In article number 2004659, Sun‐Kyung Kim, Youngmin Choi, Sunho Jeong, and co‐workers propose multi‐dimensional particles that allow for deep penetration of incident photons in the surface‐conformal laser writing process. Highly conductive 3D Cu features for form‐factor free electrical circuits are created simply via successive 3D printing and laser writing processes.

中文翻译：

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3D铜电路：通过表面保形直接印刷和激光写入的无因数形式的3D铜电路（高级功能，材料45/2020）

在2004659号文章中，金日京，崔英敏，郑顺和及其同事提出了多维粒子，这些粒子可以在表面保形激光写入过程中使入射光子深度穿透。只需通过连续的3D打印和激光写入过程即可创建用于无形状因数电路的高导电3D Cu功能。