Abstract N-(3-hydroxyphenyl)trimellitimide (NHPTI) was synthesised through the reaction of m-aminophenol and trimellitic acid anhydride. Then epoxy-imide resins were prepared by curing the epoxy resin (CYD-128: DGEBA) with NHPTI. The curing reaction of NHPTI and CYD-128 was investigated by the methods of FTIR, DSC, etc. It was found that the esterification reaction had occurred between the epoxy and the phenyl carboxyl or hydroxyl groups of NHPTI. Moreover, the curing reaction could be accelerated by 2-ethyl-4-methylimidazole (2-MZ) as a catalyst. The cured epoxy-imide resins showed good thermal stability and adhesive properties. Thermogravimetric analysis indicated that the imide groups incorporated could have a profound effect on increasing char yield and on thermal degradation temperatures.

中文翻译：

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用 N-（3-羟基苯基）偏苯三酰亚胺固化的新型环氧酰亚胺树脂：合成、热和粘合性能

摘要 通过间氨基苯酚与偏苯三酸酐反应合成了N-(3-羟基苯基)偏苯三酰亚胺(NHPTI)。然后通过用 NHPTI 固化环氧树脂 (CYD-128: DGEBA) 来制备环氧-酰亚胺树脂。采用FTIR、DSC等方法研究NHPTI与CYD-128的固化反应，发现环氧基与NHPTI的苯基羧基或羟基发生了酯化反应。此外，2-乙基-4-甲基咪唑（2-MZ）作为催化剂可以加速固化反应。固化后的环氧酰亚胺树脂表现出良好的热稳定性和粘合性能。热重分析表明，引入的酰亚胺基团可能对提高炭产率和热降解温度产生深远的影响。