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Thermally Robust Bendable Silicon Dioxide/Polyimide Layered Composite Film Through Catalytic Fluorination
ACS Applied Energy Materials ( IF 5.4 ) Pub Date : 2019-03-05 00:00:00 , DOI: 10.1021/acsapm.9b00012
Chan Jiang 1 , Zheng Cheng 1 , Xin Li 1 , Cao Li 1 , Xiangyang Liu 1
ACS Applied Energy Materials ( IF 5.4 ) Pub Date : 2019-03-05 00:00:00 , DOI: 10.1021/acsapm.9b00012
Chan Jiang 1 , Zheng Cheng 1 , Xin Li 1 , Cao Li 1 , Xiangyang Liu 1
Affiliation
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The poor atomic oxygen (AO) resistant property of polyimide (PI) film is the bottom problem for its application in aerospace. Coating SiO2 layer on PI is expected to solve this problem efficiently since SiO2 is inherently resistant to AO. However, the adhesion between PI and SiO2 is weak by their mismatch in polarity, leading to failure of layered SiO2/PI composite film as a result of interlaminar cracking in application. Here, by complexing Fe3+ onto benzimidazole units, polyimide film was modified by catalytic fluorination. It was found that the C—F bond on phenyl group produced in catalytic fluorination was three times as much as that in direct fluorination of original PI. Further, γ-aminopropyl triethoxysilane (APTES) was grafted onto PI through nucleophilic substitution between aromatic C—F and amine on APTES, introducing numerous Si—OH groups on PI surface. Finally, a flat and condense SiO2 layer covalently bonded to PI was obtained with condensation of Si—OH from PI surface and Si sol. As a result, peeling strength between PI and SiO2 layer increased from 3 to 210 cN/cm, which is 70 times higher after modification. Moreover, the SiO2/PI composite film can endure 1000 times of bending and 50 times of thermal cycles (−100 °C to 100 °C) without peeling off or cracking.
中文翻译：
通过催化氟化的热稳定弯曲的二氧化硅/聚酰亚胺层状复合膜
聚酰亚胺（PI）薄膜的耐原子氧（AO）性能差是其在航空航天中应用的根本问题。由于SiO 2本质上对AO具有抗性，因此期望在PI上涂覆SiO 2层可有效解决此问题。然而，由于PI和SiO 2之间的极性不匹配，因此它们之间的粘附性弱，导致层状SiO 2 / PI复合膜由于应用中的层间破裂而失效。在这里，通过络合Fe 3+在苯并咪唑单元上，通过催化氟化修饰聚酰亚胺薄膜。发现在催化氟化中产生的苯基上的CF键是原始PI的直接氟化中的三倍。此外，通过在APTES上芳族CF和胺之间的亲核取代，将γ-氨基丙基三乙氧基硅烷（APTES）接枝到PI上，在PI表面引入了许多Si-OH基团。最后，通过从PI表面和Si sol缩合Si-OH，获得共价结合到PI的平坦且稠密的SiO 2层。结果，PI和SiO 2层之间的剥离强度从3增加到210cN / cm，这是改性后的70倍。此外，SiO 2/ PI复合膜可承受1000次弯曲和50次热循环（-100°C至100°C）而不会剥离或破裂。
更新日期：2019-03-05
中文翻译：
通过催化氟化的热稳定弯曲的二氧化硅/聚酰亚胺层状复合膜
聚酰亚胺（PI）薄膜的耐原子氧（AO）性能差是其在航空航天中应用的根本问题。由于SiO 2本质上对AO具有抗性，因此期望在PI上涂覆SiO 2层可有效解决此问题。然而，由于PI和SiO 2之间的极性不匹配，因此它们之间的粘附性弱，导致层状SiO 2 / PI复合膜由于应用中的层间破裂而失效。在这里，通过络合Fe 3+在苯并咪唑单元上，通过催化氟化修饰聚酰亚胺薄膜。发现在催化氟化中产生的苯基上的CF键是原始PI的直接氟化中的三倍。此外，通过在APTES上芳族CF和胺之间的亲核取代，将γ-氨基丙基三乙氧基硅烷（APTES）接枝到PI上，在PI表面引入了许多Si-OH基团。最后，通过从PI表面和Si sol缩合Si-OH，获得共价结合到PI的平坦且稠密的SiO 2层。结果，PI和SiO 2层之间的剥离强度从3增加到210cN / cm，这是改性后的70倍。此外，SiO 2/ PI复合膜可承受1000次弯曲和50次热循环（-100°C至100°C）而不会剥离或破裂。
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