Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The development of an adhesiveless dual-layer structure is imperative for the application of FCCLs in globalized 5G consumer electronics. In this work, autocatalytic metallization on a silane-grafted PI film was developed to fabricate a high-quality Cu/PI substrate. PI was functionalized by amine-terminated organosilanes to load polyvinylpyrrolidone-capped Pd nanoclusters (PVP-nPd) as a catalyst. The effects of organosilanes with different numbers of amine functional groups on the adsorption of the PVP-nPd catalyst and the subsequent metallization of Cu were systematically investigated. Comprehensive surface characterizations were carried out on the PI films before and after silanization. The organosilane bearing three amine groups was found to outperform its counterpart with one amine group, exhibiting a fourfold increase in catalyst adsorption, which also improved the metallization efficiency.

中文翻译：

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用于自催化金属化的聚酰亚胺表面硅烷化

由于其优异的化学稳定性、机械强度、重量轻和柔韧性，聚酰亚胺 (PI) 已被广泛用作柔性印刷电路板的聚合物基材，例如柔性覆铜板 (FCCL)。FCCLs在全球化的5G消费电子产品中的应用势在必行，无胶双层结构的发展势在必行。在这项工作中，开发了硅烷接枝 PI 膜上的自催化金属化以制造高质量的 Cu/PI 基板。PI 被胺封端的有机硅烷官能化，以负载聚乙烯吡咯烷酮封端的 Pd 纳米团簇 (PVP-nPd) 作为催化剂。系统地研究了具有不同数量胺官能团的有机硅烷对 PVP-nPd 催化剂的吸附和随后的 Cu 金属化的影响。在硅烷化前后对 PI 薄膜进行了全面的表面表征。发现带有三个胺基团的有机硅烷的性能优于带有一个胺基团的有机硅烷，催化剂吸附量增加了四倍，这也提高了金属化效率。