Silicon‐containing arylacetylene resins (PSAs) can be used in high temperature environment due to their excellent thermal stability. However, their high temperature oxidation is still bottle‐neck for further application. Herein, Materials Genome Initiative (MGI) was utilized to identify a target monomer, 3,6‐diethynylcarbazole (DEC), to design new PSAs with enhanced antioxidant properties and heat resistance. After incorporation of DEC, the thermal curing behavior observed using differential scanning calorimetry (DSC), fourier transform infrared (FTIR) and thermogravimetric analysis (TGA) revealed that obtained silicon‐containing carbazolylacetylene resins (PSA‐VBC) can exhibit hydroamination reaction to decrease the initial curing temperature. And the temperature at 5% weight loss (T_d5) occurred in cured copolymers ranged from 665°C to 691°C, which showed excellent heat resistance. Moreover, the oxidation behavior of cured resins was investigated by thermogravimetric/derivative thermogravimetry (TG/DTG), X‐ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM). Upon the incorporation of DEC, the thermal oxidation decomposition temperature of PSA‐VBC were 100°C higher than those observed for PSAs, which also proved by XPS analysis results that the oxygen content of PSA‐VBC solidified oxide was lower than that of PSAs. In addition, the surface morphology of cured PSA‐VBC resins still maintained integrity after oxidation at 400°C for 2 hr, which showed excellent oxidation resistance.

中文翻译：

---

引入咔唑后可提高含硅芳基乙炔树脂的抗氧化性

含硅的芳基乙炔树脂（PSA）具有出色的热稳定性，可用于高温环境。但是，它们的高温氧化仍然是进一步应用的瓶颈。本文中，材料基因组计划（MGI）用于确定目标单体3,6-二乙炔基咔唑（DEC），以设计具有增强的抗氧化性能和耐热性的新型PSA。掺入DEC后，使用差示扫描量热法（DSC），傅立叶变换红外光谱（FTIR）和热重分析（TGA）观察到的热固化行为表明，所获得的含硅咔唑基乙炔树脂（PSA-VBC）可以表现出加氢胺化反应以减少初始固化温度。而且温度在5％时失重（T _d5）发生在665°C至691°C的固化共聚物中，这显示出优异的耐热性。此外，通过热重/衍生热重分析（TG / DTG），X射线光电子能谱分析（XPS）和扫描电子显微镜（SEM）研究了固化树脂的氧化行为。掺入DEC后，PSA-VBC的热氧化分解温度比PSA观察到的高100°C，这也通过XPS分析结果证明PSA-VBC固化氧化物的氧含量低于PSA。此外，固化的PSA-VBC树脂的表面形态在400°C氧化2小时后仍保持完整性，显示出优异的抗氧化性。