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Caprylic acid based PCM composite with potential for thermal buffering and packaging applications
Materials Chemistry and Physics ( IF 4.3 ) Pub Date : 2020-10-01 , DOI: 10.1016/j.matchemphys.2020.123453
Jagadeeswara Reddy Vennapusa , Akhila Konala , Prakhar Dixit , Sujay Chattopadhyay

Abstract Form stable phase change material (FSPCM) composites were prepared using caprylic acid (15.64 °C; 140 kJ kg−1) and lightweight support materials e.g. bentonite clay, natural clay, diatomaceous earth, expanded perlite, activated charcoal and silica gel following direct impregnation method. Phase change thermal properties of each composite were obtained from DSC measurements, while thermal stabilities were understood from TGA measurements. Elemental composition of each support matrix was evaluated from EDAX while morphology and PCM-support interactions in composites were obtained from FESEM and FTIR respectively. PCM could be successfully loaded in support matrix which also minimized the inherent supercooling behavior of PCM. DSC analysis of PCM-EP composite showed highest enthalpy content of 81.0 kJ kg−1, which was estimated to be 58.6% loading of PCM. Although, PCM-SG exhibited rapid charging and discharging phenomena, but its lower enthalpy content made it inferior to PCM-EP. 200 g of PCM-EP composite placed inside a TCP box exhibited thermal buffering of 349 min by maintaining temperature of 360 g chocolate below 25 °C. Therefore, PCM-EP composite with high energy storage capacity shows potential to be used in food packaging and thermal buffering applications.

中文翻译:

具有热缓冲和包装应用潜力的辛酸基 PCM 复合材料

摘要 使用辛酸 (15.64 °C; 140 kJ kg-1) 和轻质载体材料,如膨润土、天然粘土、硅藻土、膨胀珍珠岩、活性炭和硅胶,直接制备形式稳定相变材料 (FSPCM) 复合材料。浸渍法。每种复合材料的相变热性能通过 DSC 测量获得,而热稳定性则通过 TGA 测量获得。每种载体基质的元素组成通过 EDAX 进行评估,而复合材料中的形态和 PCM-载体相互作用分别通过 FESEM 和 FTIR 获得。PCM 可以成功地加载到支撑矩阵中,这也最大限度地减少了 PCM 固有的过冷行为。PCM-EP 复合材料的 DSC 分析显示最高焓含量为 81.0 kJ kg-1,估计为 58。6% 的 PCM 负载。虽然PCM-SG表现出快速充放电现象,但其较低的焓含量使其不如PCM-EP。通过将 360 克巧克力的温度保持在 25°C 以下,放置在 TCP 盒内的 200 克 PCM-EP 复合材料表现出 349 分钟的热缓冲。因此,具有高能量存储能力的 PCM-EP 复合材料显示出用于食品包装和热缓冲应用的潜力。
更新日期:2020-10-01
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