Printed High‐Density and Flexible Photodetector Arrays via Size‐matched Heterogeneous Micro‐/Nanostructure,Advanced Optical Materials

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Printed High‐Density and Flexible Photodetector Arrays via Size‐matched Heterogeneous Micro‐/Nanostructure
Advanced Optical Materials ( IF 8.0 ) Pub Date : 2020-05-10 , DOI: 10.1002/adom.202000370
Qi Pan _{1,

2} , Sisi Chen ₁ , Meng Su ₁ , Pengwei Li _{1,

2} , Zeying Zhang _{1,

2} , Xiaotian Hu ₁ , Gangshu Chen ₁ , Zhandong Huang ₁ , Bingda Chen _{1,

2} , Shuoran Chen ₃ , Yanlin Song _{1,

2}

Affiliation

Semiconductor/metal binary systems constitute the core components in electronic/photonic devices. The domain size of the heterostructure should be comparable to the charge diffusion length for superior photoelectric response. However, the fabrication of size‐matched heterostructures is still a challenge, especially for printed devices. Here, a high‐density photodetector array with lateral semiconductor/metal heterostructure is achieved via the template‐assisted sequentially printing strategy. The Ag/PBDB‐T:ITIC/Ag based lateral heterojunction that matches the charge diffusion length in the charge transfer process provides high light response sensitivity (D * = 3.41 × 10¹² Jones, R = 12.9 A W⁻¹). Moreover, the printed pixel interval can be decreased to 10 µm (10⁶ pixels cm⁻²; resolution: 2.5 × 10³ dpi). As the printing strategy can be implemented on soft substrates, the photodetector arrays are endowed with the flexibility. This work demonstrates a simple and effective strategy for chip‐scale fabrication of flexible high‐performance photodetectors, which validates the potential of printed heterogeneous micro‐/nanostructures for integrated active electronics and optics.

中文翻译：

通过尺寸匹配的异质微/纳米结构印刷高密度和灵活的光电探测器阵列

半导体/金属二进制系统构成电子/光子设备中的核心组件。异质结构的畴尺寸应与电荷扩散长度相当，以获得优异的光电响应。但是，尺寸匹配的异质结构的制造仍然是一个挑战，特别是对于印刷设备。在这里，通过模板辅助顺序打印策略可实现具有横向半导体/金属异质结构的高密度光电探测器阵列。基于Ag / PBDB-T：ITIC / Ag的横向异质结在电荷转移过程中与电荷扩散长度相匹配，可提供高光响应灵敏度（D * = 3.41×10 ¹² Jones，R = 12.9 AW ^-1）。此外，打印的像素间隔可以减小到10 µm（10 ⁶像素cm ^-2；分辨率：2.5×10 ³ dpi）。由于可以在软基板上实施印刷策略，因此光电检测器阵列具有灵活性。这项工作展示了一种灵活高效的光电检测器芯片级制造的简单有效策略，该策略验证了印刷异质微/纳米结构对于集成有源电子和光学器件的潜力。

更新日期：2020-05-10

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