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Flexible polymer thermoelectric device based on PEDOT:PSS and surface treated pyromellitic dianhydride‐oxydianiline polyimide substrate
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2020-02-25 , DOI: 10.1002/app.49156 Juheon Lee 1 , Seohyun Kim 1 , Moonhyun Chung 2 , Hakgeun Jeong 2 , Hyanghee Choi 3 , Haksoo Han 1
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2020-02-25 , DOI: 10.1002/app.49156 Juheon Lee 1 , Seohyun Kim 1 , Moonhyun Chung 2 , Hakgeun Jeong 2 , Hyanghee Choi 3 , Haksoo Han 1
Affiliation
Flexible polymer thermoelectric devices based on poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) and pyromellitic dianhydride‐oxydianiline polyimide polyimide (PI) were fabricated and investigated in this work. PI was selected as a substrate for PEDOT:PSS to secure from repeated bending cycles of flexible device. To enhance the interfacial adhesion between PEDOT:PSS and PI, oxygen plasma treatment was used on the surface of PI substrate. The effect of the surface treatment with oxygen plasma on the synthesized PI substrate was significant. The polar component of surface free energy of PI was increased from 2.8 to 31.8 mJ/m2. The power factor of PEDOT:PSS on the PI substrate was increased from 25.86 to 43.78 μW m−1 K−2. Also, as a result of 10 k times of bending test, the electrical performance consistency and the mechanical stability of the fabricated devices were confirmed. This verified fabricated flexible polymer thermoelectric devices based on PEDOT:PSS and PI are suitable for the various applications.
中文翻译:
基于PEDOT:PSS和表面处理均苯四酸二酐-氧二苯胺聚酰亚胺基材的柔性聚合物热电装置
制备并研究了基于聚(3,4-亚乙基二氧噻吩)聚苯乙烯磺酸盐(PEDOT:PSS)和均苯四酸二酐-氧二苯胺聚酰亚胺(PI)的柔性聚合物热电器件。PI被选作PEDOT:PSS的基材,以防止柔性设备反复弯曲。为了增强PEDOT:PSS与PI之间的界面粘合力,在PI基板的表面上进行了氧等离子体处理。用氧等离子体进行的表面处理对合成的PI基材的影响是显着的。PI的表面自由能的极性成分从2.8增加到31.8 mJ / m 2。PI基板上PEDOT:PSS的功率因数从25.86μWm -1 K -2增加到43.78μWm -1 K -2。另外,通过10k次弯曲试验的结果,确认了所制造的器件的电性能一致性和机械稳定性。经过验证的,基于PEDOT:PSS和PI的柔性聚合物热电器件适合各种应用。
更新日期:2020-02-25
中文翻译:
基于PEDOT:PSS和表面处理均苯四酸二酐-氧二苯胺聚酰亚胺基材的柔性聚合物热电装置
制备并研究了基于聚(3,4-亚乙基二氧噻吩)聚苯乙烯磺酸盐(PEDOT:PSS)和均苯四酸二酐-氧二苯胺聚酰亚胺(PI)的柔性聚合物热电器件。PI被选作PEDOT:PSS的基材,以防止柔性设备反复弯曲。为了增强PEDOT:PSS与PI之间的界面粘合力,在PI基板的表面上进行了氧等离子体处理。用氧等离子体进行的表面处理对合成的PI基材的影响是显着的。PI的表面自由能的极性成分从2.8增加到31.8 mJ / m 2。PI基板上PEDOT:PSS的功率因数从25.86μWm -1 K -2增加到43.78μWm -1 K -2。另外,通过10k次弯曲试验的结果,确认了所制造的器件的电性能一致性和机械稳定性。经过验证的,基于PEDOT:PSS和PI的柔性聚合物热电器件适合各种应用。