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Correlation Between Microstructure and Pitting Corrosion Behavior of TLP Bonded DSS-2205/Ni–P/DSS-2205 Specimens
Metals and Materials International ( IF 3.3 ) Pub Date : 2020-01-31 , DOI: 10.1007/s12540-020-00625-9
Masoud Mosallaee , Afshin Babanejhad

Abstract

The correlation between microstructure and pitting corrosion resistance of transient liquid phase (TLP) bonded 2205 duplex stainless steel (DSS) using BNi-6 interlayer (Ni–10.8 wt% P) was investigated. Experimental results revealed that not only progress of the isothermal solidification (IS), but also cooling procedure after the TLP bonding considerably affected the pitting corrosion resistance of the TLP bonded specimen. Potentiodynamic polarization (PDP) results revealed that pitting potential of the furnace cooled TLP specimen (FC-TLP) was increased from + 0.274 to + 0.557 V by completing the IS. SEM/EDS analyses showed that the bonding zone (BZ) was the weakest zone to pitting corrosion before completing the IS and the pitting attacks severely occurred in the bonding zone (BZ) centerline. After completion of the IS, the pitting corrosion preferentially occurred in vicinity of (Mo–P) rich intermetallic precipitates in the diffusion affected zone (DAZ) of FC-TLP specimen. Microstructural studies also revealed that water quenching after the TLP bonding prevented the formation of (Mo–P) rich intermetallic precipitates in the DAZ. It resulted in the significant increase of the pitting potential of water cooled TLP specimen to + 1.096 V after IS completion, which was very close to that of the as-received BM (+ 1.220 V).

Graphic Abstract



中文翻译:

TLP 键合 DSS-2205/Ni-P/DSS-2205 试样的微观结构与点蚀行为的相关性

摘要

研究了使用 BNi-6 夹层 (Ni–10.8 wt% P) 的瞬态液相 (TLP) 键合 2205 双相不锈钢 (DSS) 的微观结构与耐点蚀性之间的相关性。实验结果表明,不仅等温凝固 (IS) 的进展,而且 TLP 接合后的冷却过程都显着影响了 TLP 接合试样的耐点蚀性。动电位极化 (PDP) 结果表明,通过完成 IS,炉冷 TLP 试样 (FC-TLP) 的点蚀电位从 + 0.274 V 增加到 + 0.557 V。SEM/EDS 分析表明,在完成 IS 之前,结合区 (BZ) 是点蚀最弱的区域,并且点蚀严重发生在结合区 (BZ) 中心线。IS完成后,点蚀优先发生在 FC-TLP 试样扩散影响区 (DAZ) 中富含 (Mo-P) 的金属间化合物沉淀物附近。微观结构研究还表明,TLP 键合后的水淬阻止了 DAZ 中富含 (Mo-P) 的金属间化合物沉淀的形成。这导致水冷 TLP 试样的点蚀电位在 IS 完成后显着增加至 + 1.096 V,非常接近原样的 BM (+ 1.220 V)。

图形摘要

更新日期:2020-01-31
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