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A high-performance functional phthalonitrile resin with a low melting point and a low dielectric constant.
Soft Matter ( IF 2.9 ) Pub Date : 2020-01-29 , DOI: 10.1039/c9sm02328c Minjie Wu 1 , Jianjun Xu 1 , Shengnan Bai 1 , Xinggang Chen 1 , Xiaoyan Yu 1 , Kimiyoshi Naito 2 , Zhenjiang Zhang 3 , Qingxin Zhang 4
Soft Matter ( IF 2.9 ) Pub Date : 2020-01-29 , DOI: 10.1039/c9sm02328c Minjie Wu 1 , Jianjun Xu 1 , Shengnan Bai 1 , Xinggang Chen 1 , Xiaoyan Yu 1 , Kimiyoshi Naito 2 , Zhenjiang Zhang 3 , Qingxin Zhang 4
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A monomer of fluorinated phthalonitrile, namely 4,4'-bis(p-perfluoro-phenol-(bis(p-phenol)propane-2,2-diyl)-p-oxy-diphthalonitrile) (PBDP), was synthesized by the nucleophilic substitution reaction of bisphenol A, decafluorobiphenyl and 4-nitrophthalonitrile. The structure of the monomer was characterized by nuclear magnetic resonance (NMR) spectroscopy and Fourier transform infrared (FTIR) spectroscopy. The results indicated that the PBDP monomer was synthesized successfully. The monomer was cured in the presence of 4-(aminophenoxy)phthalonitrile (APPH) and the curing behaviour was investigated by differential scanning calorimetry (DSC), suggesting a low melting point of 96 °C and an excellent processing window (96-262 °C). Thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) showed that the fluorinated phthalonitrile resin possessed outstanding thermal and thermo-oxidative stabilities as well as good mechanical properties. The glass transition temperature was >400 °C and the 5% thermal degradation temperature was 501 °C. When the frequency was 50 MHz, the dielectric constant and dielectric loss of the polymer were 2.84 and 0.007, respectively. The PBDP resin has ultra-low water absorption of 0.77% and 1.4%, when exposed to an aqueous environment for 50 days at 24 °C and for 24 h at 100 °C, respectively. The prepared PBDP resin with outstanding thermal stability and low dielectric constant is an ideal candidate for aerospace industries, and microelectronic and other electronic packaging materials.
中文翻译：
具有低熔点和低介电常数的高性能功能性邻苯二甲腈树脂。
氟化邻苯二甲腈的单体，即4,4'-双（对全氟苯酚-（双（对苯酚）丙烷-2,2-二基）-对氧基-二苯甲腈）（PBDP）合成了双酚A，十氟联苯和4-硝基邻苯二甲腈的亲核取代反应。单体的结构通过核磁共振（NMR）光谱和傅里叶变换红外（FTIR）光谱表征。结果表明成功合成了PBDP单体。该单体在4-（氨基苯氧基）邻苯二甲腈（APPH）存在下进行固化，并通过差示扫描量热法（DSC）研究了固化行为，表明其熔点低至96°C，加工窗口极佳（96-262°C）。 C）。热重分析（TGA）和动态力学分析（DMA）表明，氟化邻苯二甲腈树脂具有出色的热稳定性和热氧化稳定性以及良好的机械性能。玻璃化转变温度＞ 400℃，并且5％的热降解温度为501℃。当频率为50 MHz时，聚合物的介电常数和介电损耗分别为2.84和0.007。当在24°C下暴露于水性环境50天和100°C下暴露24 h时，PBDP树脂的吸水率分别为0.77％和1.4％。制备的PBDP树脂具有出色的热稳定性和低介电常数，是航空航天工业以及微电子和其他电子包装材料的理想选择。
更新日期：2020-02-19
中文翻译：
具有低熔点和低介电常数的高性能功能性邻苯二甲腈树脂。
氟化邻苯二甲腈的单体，即4,4'-双（对全氟苯酚-（双（对苯酚）丙烷-2,2-二基）-对氧基-二苯甲腈）（PBDP）合成了双酚A，十氟联苯和4-硝基邻苯二甲腈的亲核取代反应。单体的结构通过核磁共振（NMR）光谱和傅里叶变换红外（FTIR）光谱表征。结果表明成功合成了PBDP单体。该单体在4-（氨基苯氧基）邻苯二甲腈（APPH）存在下进行固化，并通过差示扫描量热法（DSC）研究了固化行为，表明其熔点低至96°C，加工窗口极佳（96-262°C）。 C）。热重分析（TGA）和动态力学分析（DMA）表明，氟化邻苯二甲腈树脂具有出色的热稳定性和热氧化稳定性以及良好的机械性能。玻璃化转变温度＞ 400℃，并且5％的热降解温度为501℃。当频率为50 MHz时，聚合物的介电常数和介电损耗分别为2.84和0.007。当在24°C下暴露于水性环境50天和100°C下暴露24 h时，PBDP树脂的吸水率分别为0.77％和1.4％。制备的PBDP树脂具有出色的热稳定性和低介电常数，是航空航天工业以及微电子和其他电子包装材料的理想选择。
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