Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry.

中文翻译：

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设计和合成的三嗪二硫醇硅烷分子的自组装单层作为集成电路的界面粘附增强剂。

具有可调表面化学和光滑表面的自组装单层 (SAM) 提供了一种提高粘附力和抑制有害化学相互作用的方法。在这里，我们展示了由设计和合成的 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol 分子组成的 SAM，它可以增强界面粘附以抑制用于器件金属化的铜扩散。X 射线光电子能谱证实了三嗪二硫醇硅烷 SAM 的形成。SAM 涂层基板与化学沉积铜膜之间的粘附强度高达 13.8 MPa。三嗪二硫醇硅烷分子的设计策略有望开辟替代传统有机硅烷应用于微电子工业的可能性。