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Computational Particle Mechanics
基本信息
期刊名称 Computational Particle Mechanics
COMPUT PART MECH
期刊ISSN 2196-4378
期刊官方网站 https://www.springer.com/40571
是否OA No
出版商 Springer International Publishing AG
出版周期 6 issues per year
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始发年份 2014
年文章数 155
影响因子 2.8(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 MATHEMATICS, INTERDISCIPLINARY APPLICATIONS 数学跨学科应用3区
MECHANICS 力学3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 5.7 0.845 1.289
Mathematics
Numerical Analysis
12/88 86%
Mathematics
Computational Mathematics
30/189 84%
Mathematics
Modeling and Simulation
61/324 81%
Engineering
Computational Mechanics
20/89 78%
Engineering
Civil and Structural Engineering
91/379 76%
补充信息
自引率 14.3%
H-index 16
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2196-4378%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/jcpm
收稿范围
Computational Particle Mechanics (CPM) publishes original articles addressing the modeling and simulation of systems involving particle mechanics and methods. It enhances communication among researchers in engineering and applied sciences who use "particles'' in one form or another in their research.

The phrase "particle methods/mechanics'' has now come to encompass a variety of topics, including:

Particles as a physical unit in granular media, particulate flows, plasmas, swarms, agents
Particles representing material phases in continua at the meso-, micro-and nano-scale and
Particles as a discretization unit in continua and discontinua in numerical methods such as Discrete Element Methods (DEM), Particle Finite Element Methods (PFEM), Molecular Dynamics (MD) and Smoothed Particle Hydrodynamics (SPH), etc.
CPM focuses on the above topics and welcomes their use on a variety of applications, such as:
Particulate and granular flow problems motivated by high-tech industrial processes such as those found in additive manufacturing, spray, deposition, etc.,
Manufacturing processes involving forming, cutting, compaction, etc.,
Fluid-structure interaction problems accounting for free surface flow effects in civil and marine engineering, etch as water jets, wave loads, ship hydrodynamics, debris flows, etc.,
Coupled multiphysical phenomena involving solid, fluid, thermal, electromagnetic and optical systems, etc.,
Material design/functionalization using particles to modify base materials, etc.,
Biomedical engineering, involving cell mechanics, molecular dynamics and scale-bridging, and
Impact resulting in fracture and fragmentation.
Modeling and simulation of systems involving particles and particle methods
Real-world applications in manufacturing, marine engineering and biomedical engineering
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投稿指南 https://link.springer.com/journal/40571/submission-guidelines
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参考文献格式
编辑信息

Editors-in-Chief:

T. Zohdi, University of California, Berkeley, CA,USA

E. Oñate, CIMNE, Barcelona, Spain

P. Wriggers, Leibniz Universität Hannover, Germany

Honorary Editor: D. R. J. OwenSwansea University, UK

Editorial Board:

P. Alart, L’Université de Montpellier, France

J. Andrade, California Institute of Technology, Pasadena, CA, USA

J. Garcia Aznar, University of Zaragoza, Spain

E. M. B. Campello, University of São Paulo, Brazil

J. Chen, University of California, San Diego, CA, USA

Z. Chen, University of Missouri, Columbia, MO, USA

P. Cleary, Commonwealth Scientific and Ind. Res. Org., Australia

G. Combe, University Grenoble Alpes, Grenoble, France

F. Darve, Grenoble Institute of Technology, Grenoble, France

P. Eberhard, Institut für Technische und Numerische Mechanik, Stuttgart, Germany

Y. Feng, Swansea University, UK

H. Herrmann, ETH Zurich, Switzerland

S. Idelsohn, CIMNE, Barcelona, Spain

P. Jonsén, Luleå University of Technology, Sweden

K. Kamrin, Massachusetts Institute of Technology, Cambridge, MA, USA

Y. Kevrekidis, Princeton University, NJ, USA

S. Koshizuka, University of Tokyo, Japan

A. Kwade, Technische Universität Braunschweig, Germany

C. R. Leonardi, University of Queensland, Brisbane, QLD, Australia

R. Lohner, George Mason University, Fairfax, VA, USA

S. Luding, University of Twente, Enschede, The Netherlands

A. Munjiza, Queen Mary University of London, UK

X. Oliver, Universitat Politècnica de Catalunya, Barcelona, Spain

T. Pöschel, Friedrich-Alexander University Erlangen-Nürnberg, Germany

J. Rojek, IPPT PAN, Warsaw, Poland

E. Shaqfeh, Stanford University, CA, USA

R. Schunk, Sandia National Laboratories, CA, USA

A. Souto-Iglesias, Universidad Politécnica de Madrid, Spain

D. Sulsky, The University of New Mexico, Albuquerque, NM, USA

J. Williams, Massachusetts Institute of Technology, Cambridge, MA, USA

D. Wolf, Universität Duisburg-Essen, Germany


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