Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.

Communications
Full Papers
Reviews
Progress Reports
Research News
Essays
Correspondences

Sang-Woo Kim, Sungkyunkwan University, Seoul, Republic of Korea
       Stuart Parkin, MPI Halle, Germany
       Xiaohui Qiu, National Center for Nanoscience and Technology, Beijing, China
       John Rogers, Northwestern University, Evanston, IL, USA
       Henning Sirringhaus, University of Cambridge, UK
       Takao Someya, University of Tokyo, Japan
       Rainer Waser, RWTH Aachen University, Germany
International Advisory Board:
 
       Jong Hyun Ahn, Yonsei University, Seoul, Republic of Korea
       Marin Alexe, University of Warwick, UK
       Hiroshi Amano, Nagoya University, Japan
       Phaedon Avouris, IBM, New York, USA
       David Barbero, Umea University, Sweden
       Zhenan Bao, Stanford University, USA
       Mark Blamire, University of Cambridge, UK
       Paul Blom, University of Mainz, Germany
       Karl Böhringer, University of Washington, Seattle, USA
       Lapo Bogani, Oxford University, UK
       Ivan Bozovic, Brookhaven National Laboratory, Upton, USA
       Alexander Balandin, University Of California Riverside, USA
       David Cahill, University of Illinois at Urbana-Champaign, USA
       Guozhong Cao, University of Washington, Seattle, USA
       Hui-Ming Cheng, Shenyang National Laboratory, China
       Kilwon Cho, Pohang University of Science and Technology, Korea
       Eugenio Coronado, Universitat de València, Spain
       Xiangfeng Duan, University of California Los Angeles, USA
       Bruce Dunn, University of California Los Angeles, USA
       Josep Fontcuberta, Institute of Materials Science of Barcelona, Spain
       Gregory Fuchs, Cornell University, Ithaca, USA
       Yuri Gogotsi, Drexel University, Philadelphia, USA
       Marius Grundmann, University of Leipzig, Germany
       Yunlong Guo, Institute of Chemistry, CAS, Beijing, China
       Hideo Hosono, Tokyo Institute of Technology, Japan
       Wenping Hu, Institute of Chemistry, Chinese Academy of Science, Beijing, China
       Wei Huang, Nanjing University of Technology, China
       Cheol-Seong Hwang, Seoul National University, Republic of Korea
       Nazir Kherani, University of Toronto, Canada
       Jang-Joo Kim, Seoul National University, Republic of Korea
       Hagen Klauk, Max Plank Institute for Solid State Research, Stuttgart, Germany
       Holger Kleinke, University of Waterloo, Canada
       Valeri Kotov, University of Vermont, Burlington, USA
       Yoshihiro Kubozono, Okayama University, Japan
       Mario Lanza, Institute of Functional Nano & Soft Materials, Suzhou, China
       Takhee Lee, Seoul National University, Republic of Korea
       Qingwen Li, Suzhou Institute of Nanoscience and Nanobionics, China
       Yongfang Li, Institute of Chemistry, Chinese Academy of Science, Beijing, China
       Emil List, NanoTec Center Weiz, Austria
       Ming Liu, Institute of Microelectronics, Chinese Academy of Science, Beijing, China
       Maria Antonietta Loi, University of Groningen, the Netherlands
       Xiong Wen Lou, Nanyang Technological University, Singapore
       Cristine Luscombe, University of Washington, Seattle, USA
       Liqiang Mai, Wuhan University of Technology, China
       Rodrigo Martins, Universidade Nova de Lisboa, Portugal
       Richard McCullough, Harvard University, Cambridge, USA
       Martyn McLachlan, Imperial College London, UK
       Neil Mathur, University of Cambridge, UK
       Andy Monkman, Durham University, UK
       Hadis Morkoc, Virginia Commonwealth University, Richmond, USA
       Yoshio Nishi, Stanford University, USA
       Tae Won Noh, Seoul National University, Republic of Korea
       Qibing Pei, University of California Los Angeles, USA
       Clive Randall, Pennsylvania State University, USA
       Alberto Salleo, Stanford University, USA
       James Scott, University of St. Andrews, UK
       Jan Seidel, University of New South Wales, Sydney, Australia
       Jeffrey Snyder, Northwestern University, Illinois, USA
       Susanne Stemmer, University of California Santa Barbara, USA
       Michael Strano, Massachusetts Institute of Technology, Cambridge, USA
       Osamu Tabata, Kyoto University, Japan
       He Tian, East China University of Science and Technology, Shanghai, China
       Joseph Wang, University of California San Diego, USA
       Christian Wetzel, Rensselaer Polytechnic Institute, Troy, USA
       Peter Woias, University of Freiburg, Germany
       H.-S. Philip Wong, Stanford University, USA
       Matthias Wuttig, RWTH Aachen University, Germany
       Gary Fedder, Carnegie Mellon University, Pittsburgh, USA
       Ulrike Wallrabe, University of Freiburg, Germany
       Xudong Wang, University of Wisconsin-Madison, USA