The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.

The Editor-in-Chief, associate editors and rigorous refereeing procedures will ensure that the journal maintains the highest levels of integrity, scientific standards and the broadest international coverage. Silicon accepts submissions from researchers in academia, industry, national research laboratories and research institutions.

Silicon is a publication platform for novel knowledge and scientific dialogue in all disciplines where silicon is an enabling element. Silicon accepts novel submissions in the form of short communications, original articles, essays, and reviews. Submitted articles are complete reports of significant results or conclusions, which focus on some aspect of silicon being present. Communications are preliminary reports (1500-2000 words) of unusually urgent significance and of wider interest. Reviews are critically evaluated surveys of progress (3000-6000 words) and should contain new information on the subject.

Editor-in-Chief:
David A. Schiraldi
Department of Macromolecular Science and Engineering
Case Western Reserve University, 
Cleveland, OH 44106, USA.


Associate Editors:
Nicola Hüsing
Materials Chemistry
Salzburg University 
Hellbrunner Str. 34
A-5020 Salzburg
Austria
Zhijian Pei
Department of Industrial and Systems Engineering
Texas A&M University
3131 TAMU
College Station, TX 77843-3131
USA
Xuegong Yu 
School of Materials Science and Engineering
Zhejiang University
38, Zheda Road
HangZhou, Zhejiang Province
China
Editorial Advisory Board:
Sylvie Boileau, Institut de Chimie et des Matériaux Paris-Est (Paris, France); M.A. Brook, McMaster University (Ontario, Canada); Bhanu P. S. Chauhan, William Paterson University (Wayne, USA); Julian Chojnowski, Polish Academy of Sciences (Lódz, Poland); Stephen Clarke, Flinders University (Adelaide, South Australia); Thibaud Coradin, Université Pierre et Marie Curie (Paris, France); Petar Dvornic, Pittsburg State University (Pittsburg, Kansas, USA); Alan Esker, Virginia Tech (Blacksburg, Virginia, USA); Hendrik Heinz, University of Akron (Akron, Ohio, USA); Yusuke Kawakami, Japan Advanced Institute of Science and Technology (Ishikawa, Japan); Stephen Kinrade, Lakehead University (Ontario, Canada); J. Lewicki, Lawrence Livermore National Laboratory (California, USA); J.M. Mabry, AFRL, Edwards Air Force Base (California, USA); Jukka Pekka Matinlinna, University of Hong Kong (Hong Kong); Werner Müller, Johannes Gutenberg University Mainz (Mainz, Germany); Aziz Muzafarov, Russian Academy of Sciences (Moscow, Russia); Michael J. Owen, formerly Dow Corning Corporation, (Michigan, USA); Mario Pagliaro, Co-Chairman - SuNEC 2011, CNR (Palermo, Italy); Carole Perry, Nottingham Trent University (Nottingham, UK); Murali Sastry, Tata Chemicals Ltd. (Pune, India); Peyman Servati, University of British Columbia (Vancouver, Canada); Richard Soref, Air Force Research Laboratory (Massachusetts, USA); Mark Soucek, University of Akron (Akron, Ohio, USA); Miriam Steinitz-Kannan, Northern Kentucky University (Highland Heights, Kentucky, USA); Eric Struyf, University of Antwerp (Antwerp, Belgium); Engel Vrieling, University of Groningen (Haren, Netherlands); Julie Willoughby, NC State University (Raleigh, North Carolina, USA); Deren Yang, Zhejiang University (Hangzhou, China); Iskender Yilgör, Koç University (Istanbul, Turkey); Paul M. Zelisko, Brock University (St. Catharines, Ontario, Canada).