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International Journal of Mechanics and Materials in Design
基本信息
期刊名称 International Journal of Mechanics and Materials in Design
INT J MECH MATER DES
期刊ISSN 1569-1713
期刊官方网站 https://www.springer.com/10999
是否OA No
出版商 Springer Netherlands
出版周期 4 issues per year
文章处理费 登录后查看
始发年份 2004
年文章数 58
影响因子 2.7(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, MECHANICAL 工程:机械3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
MECHANICS 力学2区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 6.0 0.763 0.996
Engineering
Mechanical Engineering
146/672 78%
Engineering
Mechanics of Materials
98/398 75%
Materials Science
General Materials Science
140/463 69%
补充信息
自引率 11.1%
H-index 25
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1569-1713%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/mamd/
收稿范围
It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.

Analytical synopsis of contents:

The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:
Intelligent Design:

Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.

Advanced Materials in Design:

Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.

Design Analysis and Optimisation:

Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.

Expe rimental Mechanics in Design:

Advanced Mechanical Testing in Design;
Non-destructive Tools in Design;
Condition Monitoring in Design;
Interferometry;
Photoelasticity and Strain Gauges in Design;
Quality Assurance and Control;
Intelligent Sensors in Design.

Design Case Studies:

Aeronautical and Automotive Engineering;
Mechanical Engineering;
Chemical Engineering;
Nuclear and Chemical Engineering;
Civil Engineering;
Bioengineering and Biotechnology.
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投稿指南 https://link.springer.com/journal/10999/submission-guidelines
投稿模板
参考文献格式
编辑信息

Editor-in-Chief

Shaker A. Meguid
Professor & Director 
Mechanics and Aerospace Design Laboratory
Mechanical and Industrial Engineering
University of Toronto, ON
Canada

Associate Editors

Professor Mario Guagliano
Milano Politecnico
Milano, Italy

Professor Manas Chandra Ray
Indian Institute of Technology Kharagpur
Kharagpur, India

Professor Chuanzeng Zhang
University of Siegen
Siegen, Germany

Editorial Board

K.J. Bathe, Massachusetts Institute of Technology (MIT), Cambridge, USA; J.L. Chenot, Ecole des Mines de Paris, Sophia Antipolis, France;George S. Dulikravich,Florida International University, Miami, FL, USA; Huajian GaoBrown University, Providence, RI, USA; J. Goldak, Carleton University, Ottawa, ON, Canada; Xu Han,Hunan University, Hunan, China;G.M. Hulbert, University of Michigan, Ann Arbor, MI, USA; I. Hutchings, University of Cambridge, UK; Radoslaw Iwankiewicz,Hamburg University of Technology, Hamburg, Germany; N. JonesUniversity of Liverpool, UK; Yang JuNagoya University, Nagoya, Japan;Alexander L. KalamkarovDalhousie University, Halifax, NS, Canada; H.W. KleinFH South Westphalia University of Applied Sciences, Meschede, Germany D.G. LeeKorea Advanced Institute of Science and Technology (KAIST), Daejon-Shi, Korea; S. Nemat-NasserUniversity of California at San Diego, La Jolla, USA; Sergio PellegrinoCalifornia Institute of Technology, Pasadena, CA, USA;J.N. Reddy, Texas A&M University, College Station, USA; T.Y. Ng, Nanyang Technological University, Singapore; K. TanakaNagoya University, Japan;K. WatanabeUniversity of Tokyo, Japan; G.J. WengState University of New Jersey, Piscataway, USA


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