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Microelectronics International
基本信息
期刊名称 | Microelectronics International MICROELECTRON INT |
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期刊ISSN | 1356-5362 |
期刊官方网站 | https://www.emerald.com/insight/publication/issn/1356-5362 |
是否OA | No |
出版商 | Emerald Group Publishing Ltd. |
出版周期 | Tri-annual |
文章处理费 | 登录后查看 |
始发年份 | 1982 |
年文章数 | 30 |
影响因子 | 0.7(2023) scijournal影响因子 greensci影响因子 |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
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工程技术4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区 | 否 | 否 |
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合4区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
---|---|---|---|---|---|
学科 | 排名 | 百分位 | 1.9 | 0.188 | 0.354 |
Engineering Electrical and Electronic Engineering |
511/797 | 35% |
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Materials Science Surfaces, Coatings and Films |
90/132 | 31% |
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Materials Science Electronic, Optical and Magnetic Materials |
201/284 | 29% |
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Physics and Astronomy Condensed Matter Physics |
308/434 | 29% |
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Physics and Astronomy Atomic and Molecular Physics, and Optics |
163/224 | 27% |
补充信息
自引率 | 21.40% |
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H-index | 19 |
SCI收录状况 |
Science Citation Index Expanded |
官方审稿时间 | 登录后查看 |
网友分享审稿时间 | 数据统计中,敬请期待。 |
接受率 | 登录后查看 |
PubMed Central (PMC) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1356-5362%5BISSN%5D |
投稿指南
期刊投稿网址 | https://mc.manuscriptcentral.com/miij |
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收稿范围 | Microelectronics International (MI) provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: Advanced packaging Ceramics Chip attachment Chip on board (COB) Chip scale packaging Flexible substrates MEMS Micro-circuit technology Microelectronic materials Multichip modules (MCMs) Organic/polymer electronics Printed electronics Semiconductor technology Solid state sensors Thermal management Thick/thin film technology Wafer scale processing |
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