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IEEE Transactions on Device and Materials Reliability
基本信息
期刊名称 | IEEE Transactions on Device and Materials Reliability IEEE T DEVICE MAT RE |
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期刊ISSN | 1530-4388 |
期刊官方网站 | https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=7298 |
是否OA | No |
出版商 | Institute of Electrical and Electronics Engineers Inc. |
出版周期 | Quarterly |
文章处理费 | 登录后查看 |
始发年份 | |
年文章数 | 72 |
影响因子 | 2.5(2023) scijournal影响因子 greensci影响因子 |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
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工程技术4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区 | 否 | 否 |
PHYSICS, APPLIED 物理:应用4区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
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学科 | 排名 | 百分位 | 4.8 | 0.436 | 1.148 |
Engineering Safety, Risk, Reliability and Quality |
65/207 | 68% |
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Engineering Electrical and Electronic Engineering |
274/797 | 65% |
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Materials Science Electronic, Optical and Magnetic Materials |
103/284 | 63% |
补充信息
自引率 | 4% |
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H-index | 63 |
SCI收录状况 |
Science Citation Index Expanded |
官方审稿时间 | 登录后查看 |
网友分享审稿时间 | 数据统计中,敬请期待。 |
接受率 | 登录后查看 |
PubMed Central (PMC) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1530-4388%5BISSN%5D |
投稿指南
期刊投稿网址 | http://mc.manuscriptcentral.com/tdmr |
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收稿范围 | IEEE Transactions on Device and Materials Reliability includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectations. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products. |
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