With the advent of very powerful PCs and high-end graphics cards, there has been an incredible development in Virtual Worlds, real-time computer animation and simulation, games. But at the same time, new and cheaper Virtual Reality devices have appeared allowing an interaction with these real-time Virtual Worlds and even with real worlds through Augmented Reality. Three-dimensional characters, especially Virtual Humans are now of an exceptional quality, which allows to use them in the movie industry. But this is only a beginning, as with the development of Artificial Intelligence and Agent technology, these characters will become more and more autonomous and even intelligent. They will inhabit the Virtual Worlds in a Virtual Life together with animals and plants.

Computer Animation & Virtual Worlds is the first journal to address this global thematic of the Virtual Worlds. This thematic has been subdivided into 6 areas:

Computer animation
Embodied agents
Virtual Environments
Augmented Reality
Virtual Life
Visualization
Computer Animation & Virtual Worlds seeks papers in all fields of Virtual Worlds. Contributions are solicited describing original research results, applications, and experience in the following topics:

EDITORS-IN-CHIEF
Nadia Magnenat Thalmann
MIRALab, CUI.
Battelle, Building A 7,
Route de Drize CH-1227 Carouge, Switzerland
Tel: +41 22 379 09 69
Fax: +41-22-379-7780
e-mail: thalmann@miralab.ch
Daniel Thalmann
EPFL VRLab,
CH-1015 Lausanne, Switzerland
Tel: +41-21-693-5214
Fax: +41-21-693-5290
e-mail: daniel.thalmann@epfl.ch
ASSOCIATE EDITORS BOARD
S. Ali
SRI International, USA
e-mail:saad.ali@sri.com
Ken Anjyo
OLM Digital,
Japan
e-mail: anjyo@olm.co.jp
N. Badler
University of Pennsylvania,
Philadelphia, USA
e-mail: badler@seas.upenn.edu
C. Basdogan
Koc University
Istanbul, Turkey
e-mail: cbasdogan@ku.edu.tr
R. Boulic
EPFL, Lausanne, Switzerland
e-mail: ronan.boulic@epfl.ch
Marc Cavazza
University of Greenwich
United Kingdom
e-mail: M.Cavazza@greenwich.ac.uk
Parag Chaudhuri
Indian Institute of Technology Bombay
Mumbai, India
e-mail: paragc@cse.iitb.ac.in
Z. Deng
University of Houston, Texas
e-mail: zdeng4@uh.edu
P. Faloutsos
York University, Canada
e-mail: pfaloutsos@gmail.com
Ugur Gudukbay
Bilkent University, Turkey
e-mail: gudukbay@cs.bilkent.edu.tr
Xiaohu Guo
The University of Texas at Dallas, USA
e-mail: xguo@utdallas.edu
Stephen Guy
University of Minnesota, USA
e-mail: sjguy@cs.umn.edu
J. Hahn
George Washington University, USA
e-mail: hahn@gwu.edu
Bruno Heberlin
EPFL, Switzerland
e-mail: bruno.herbelin@epfl.ch
Klaus Hildebrandt
Delft University of Technology, Netherlands
e-mail: K.A.Hildebrandt@tudelft.nl
Wang Huamin
The Ohio State University, USA
e-mail: whmin@cse.ohio-state.edu
M. Inakage
Keio University, Japan
e-mail: inakage@sfc.keio.ac.jp
Marcelo Kallmann
University of California, Merced, USA
e-mail: mkallmann@ucmerced.edu
Mubbasir Kapadia
Tohoku University, Japan
e-mail: Mubbasir.Kapadia@rutgers.edu
Young J. Kim
Ewha Womans University, South Korea
e-mail:kimy@ewha.ac.kr
Yoshifumi Kitamura
Tohoku University, Japan
e-mail: kitamura@riec.tohoku.ac.jp
T. Komura
Edinburgh University, UK
e-mail: tkomura@staffmail.ed.ac.uk
Torsten Kuhlen
Aachen University, Germany
e-mail: kuhlen@vr.rwth-aachen.de
R. Lau
City University, HongKong
e-mail: rynson@cs.cityu.edu.hk
Dongman Lee
KAIST,
South Korea
e-mail: dlee@cs.kaist.ac.kr
Sung-Hee Lee
KAIST, Korea
e-mail: sunghee.lee@kaist.ac.kr
W.S. Lee
University of Ottawa, Canada
e-mail: wslee@uottawa.ca
Vincent Lepetit
University of Bordeaux, France
e-mail: vincent.lepetit@u-bordeaux.fr
T.-Y. Li
National Chengchi  University, Taiwan
e-mail: li@nccu.edu.tw
Anderson Maciel
Federal University of Rio Grande del Sul, Brasil
e-mail: amaciel@inf.ufrgs.br
N. Max
Lawrence Livermore National Laboratory,
Livermore, USA
e-mail: max2@llnl.gov
Daniel Mestre
Université Aix Marseilles,
France
e-mail: daniel.mestre@univ-amu.fr
S.P. Mudur
Concordia University, Canada
e-mail: mudur@cs.concordia.ca
H. Müller
Universitat of Dortmund, Germany
e-mail: mueller@ls7.informatik.uni-dortmund.de
Franck Multon
University Rennes 2, France
e-mail: fmulton@irisa.fr
S. Musse
Pontifícia Universidade Católica do Rio Grande do Sul, Brazil
e-mail: soraia.musse@gmail.com
Michael Neff
University of California Davis, USA
e-mail: cmpneff@ucdavis.edu
C. Pelachaud
CNRS, LTCI, TELECOM ParisTech
e-mail: catherine.pelachaud@telecom-paristech.fr
Julien Pettre
INRIA, France
e-mail: julien.pettre@inria.fr
P. Poulin
University of Montreal, Canada
e-mail: poulin@iro.umontreal.ca
Nicolas Pronost
Université Claude Bernard Lyon 1, France
e-mail: nicolas.pronost@univ-lyon1.fr
A. Rizzo
University of Southern California, California, USA
e-mail: arizzo@usc.edu
J.-R. Sack
Carleton University, Ottawa, Canada
e-mail: sack@scs.carleton.ca
Craig Schroeder
University of California At Riverside, USA
e-mail: craigs@cs.ucr.edu
Takaaki Shiratori
Oculus, USA
e-mail: takaaki.shiratori@oculus.com
Hubert P.H. Shum
Northumbria University, Hong Kong
e-mail: hubert.shum@northumbria.ac.uk
Oliver Staadt
University of Rostock, Germany
e-mail: oliver.staadt@uni-rostock.de
J. Stam
Autodesk, Canada
e-mail: Jos.Stam@autodesk.com
Shinjiro Sueda
Texas A&M University, USA
e-mail: sueda@tamu.edu
H. Sun
Chinese University of Hong Kong
e-mail: hanqiu@cse.cuhk.edu.hk
Yiying Tong
Michigan State University, USA
e-mail: ytong@msu.edu
E. Vouga
University of Texas in Austin, USA
e-mail: evouga@cs.utexas.edu
Wang Wenping
The University of Hong Kong
e-mail: wenping@cs.hku.hk
E. Wu
University of Macau, China
e-mail: ehwu@umac.mo
B. Wyvill
University of Victoria, Canada
e-mail: blob@cs.uvic.ca
Zerrin Yumak
University of Utrecht, The Netherlands
e-mail: z.yumak@uu.nl
Changzi Zheng
Columbia University, USA
e-mail: cxz@cs.columbia.edu