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Journal of Intelligent Manufacturing
基本信息
期刊名称 Journal of Intelligent Manufacturing
J INTELL MANUF
期刊ISSN 0956-5515
期刊官方网站 https://www.springer.com/10845
是否OA No
出版商 Springer Netherlands
出版周期 Bimonthly
文章处理费 登录后查看
始发年份 1990
年文章数 202
最新影响因子 5.9(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术2区 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能3区
ENGINEERING, MANUFACTURING 工程:制造2区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 19.3 2.071 3.088
Engineering
Industrial and Manufacturing Engineering
12/384 97%
Computer Science
Software
18/407 95%
Computer Science
Artificial Intelligence
18/350 95%
补充信息
自引率 13.6%
H-index 67
SCI收录状况 Science Citation Index Expanded
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网友分享审稿时间 数据统计中,敬请期待。
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0956-5515%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/jims
收稿范围
Published eight times per year, Journal of Intelligent Manufacturing provides a unique international forum for developers of intelligent manufacturing systems. By publishing quality refereed papers on the applications of artificial intelligence in manufacturing, the Journal provides a vital link between the research community and practitioners in industry.

In addition to research papers, Journal of Intelligent Manufacturing presents:

Articles on new methodologies and developments
Case studies
Surveys
Tutorials on topics related to product design and manufacturing
Special issues.
收录体裁
投稿指南 https://link.springer.com/journal/10845/submission-guidelines
投稿模板
参考文献格式
编辑信息

Editor-in-Chief:
Andrew Kusiak
Industrial and Systems Engineering, The University of Iowa, Iowa City, USA

Regional Associate Editors:
Manoj Kumar Tiwari (Asia)
Indian Institute of Technology, Kharagpur, India
Hervé Panetto (Europe)
Research Centre for Automatic Control (CRAN UMR CNRS 7039), University of Lorraine, Vandoeuvre-les-Nancy, France

Associate Editors:
Radu F. Babiceanu, Embry-Riddle Aeronautical University, USA
Eric Bonjour, Lorraine University, ENSGSI / ERPI, France
Sergio Cavalieri, University of Bergamo, Italy
Yuval Cohen, Tel-Aviv Afeka College of Engineering, Israel
Ernesto D.R. Santibanez Gonzalez, Federal University of Ouro Preto, Brazil
Adel Hatamimarbini, De Montfort University, UK
David He, University of Illinois at Chicago, USA
George Q. Huang, The University of Hong Kong, SAR
Roger Jiao, Georgia Institute of Technology, USA
Kamal Medjaher, National School of Engineering, Tarbes, France
Ercan Oztemel, Marmara University, Turkey
R. Venkata Rao, Sardar Vallabhbhai National Institute of Technology (SV NIT), India
Vishal S. Sharma, National Institute of Technology, India
Jiafu Wan, South China University of Technology, China
Juite (Ray) Wang, National Chung Hsing University, Taiwan
Dazhong Wu, University of Central Florida, USA
Jianguo Wu, Peking University, China
Xun W. Xu, University of Auckland, New Zealand
Wen-Jun (Chris) Zhang, The University of Saskatchewan, Canada
Kit Qichun Zhang, University of Bradford, UK
Zijun Zhang, City University of Hong Kong, SAR
Shiyu Zhou, University of Wisconsin, USA

International Editorial Board:
Bruno Agard, École Polytechnique de Montréal, Canada
Thomas Bäck, Leiden Institute of Advanced Computer Science, The Netherlands
Abdelaziz Bouras, Qatar University, Qatar
Felix Chan, Hong Kong Polytechnic University, Hong Kong, SAR
Yong Chen, University of Southern California, USA
Christoph Herrmann, Technische Universität Braunschweig, Germany
Thomas Kurfess, Oak Ridge National Laboratory, USA
Annalisa Milella, CNR-STIIMA, Italy
Charles Møller, Aalborg University, Denmark
Ilkyeong Moon, Seoul National University, South Korea
Kenichi Nakashima, Waseda University, Japan
John Pang, Nanyang Technological University, Singapore
David Romero, Tecnológico de Monterrey, México
Subhrajit Roychowdhury, General Electric, USA
Essam Shehab, Cranfield University, UK
Alexander Smirnov, Russian Academy of Sciences, Russia
Lianyu Zheng, Beihang University, China

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