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Journal of Micromechanics and Microengineering
基本信息
期刊名称 | Journal of Micromechanics and Microengineering J MICROMECH MICROENG |
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期刊ISSN | 0960-1317 |
期刊官方网站 | https://iopscience.iop.org/journal/0960-1317 |
是否OA | No |
出版商 | IOP Publishing Ltd. |
出版周期 | Monthly |
文章处理费 | 登录后查看 |
始发年份 | 1991 |
年文章数 | 137 |
影响因子 | 2.4(2023) scijournal影响因子 greensci影响因子 |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
---|---|---|---|
工程技术3区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区 | 否 | 否 |
INSTRUMENTS & INSTRUMENTATION 仪器仪表3区 | |||
NANOSCIENCE & NANOTECHNOLOGY 纳米科技4区 | |||
PHYSICS, APPLIED 物理:应用4区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
---|---|---|---|---|---|
学科 | 排名 | 百分位 | 4.5 | 0.476 | 0.789 |
Engineering Mechanical Engineering |
207/672 | 69% |
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Engineering Mechanics of Materials |
146/398 | 63% |
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Engineering Electrical and Electronic Engineering |
292/797 | 63% |
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Materials Science Electronic, Optical and Magnetic Materials |
118/284 | 58% |
补充信息
自引率 | 8.3% |
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H-index | 119 |
SCI收录状况 | Science Citation Index Expanded |
官方审稿时间 | 登录后查看 |
网友分享审稿时间 | 数据统计中,敬请期待。 |
接受率 | 登录后查看 |
PubMed Central (PMC) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0960-1317%5BISSN%5D |
投稿指南
期刊投稿网址 | https://iopscience.iop.org/journal/0960-1317/page/submission-options |
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收稿范围 | Journal of Micromechanics and Microengineering™ (JMM) is a hybrid open access journal dedicated to advances in the nano- and micro-scale science and engineering of mechanical, electromechanical, electrical, and mechatronic systems. The journal welcomes experimental results as well as studies that contain some or wholly computational/simulation-based work. In the case of the latter, authors should compare their findings with experimental data, if it exists in the literature, and provide sufficient information to enable all computational results to be reproduced. The scope of the journal includes MEMS/NEMS technologies and applications, as well as: Biomedical systems and devices (including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces) Electronics (including flexible electronics, wearable electronics, interface electronics) Energy and power (including power MEMS/NEMS, energy harvesters, actuators, microbatteries) Fabrication techniques and manufacturing (including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing) Lab-on-a-chip Materials, testing, and reliability Physical and chemical sensors (including inertial, force, magnetic, tactile, gas, humidity, acoustic and vision sensors) Optical systems and devices (including micro mirrors, silicon photonics, infrared sensors, optical resonators and clocks, plasmonic devices, LiDAR systems, micro display systems, fiber-based systems) Packaging and integration technologies (including material/processes for packaging, liquid/vacuum packaging/encapsulation, heterogeneous integration, 3D MEMS integration) Emerging technologies and applications for MEMS/NEMS (including robotics, smart X, internet of things, autonomous vehicles, machine learning, artificial intelligence) Micro and Nano fluidics (including droplet/digital/centrifugal/capillary microfluidics, pumps/valves/dispensers, mixers/reactors, separation, integrated microfluidic systems) RF systems and components (including oscillators, resonators, SAW, BAW, timing, 5G) Papers focused on materials science with no obvious application or link to nano- or micro-engineering are not suitable for the journal. |
收录体裁 | |
投稿指南 | https://publishingsupport.iopscience.iop.org/journals/journal-of-micromechanics-and-microengineering/ |
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