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Journal of Micromechanics and Microengineering
基本信息
期刊名称 Journal of Micromechanics and Microengineering
J MICROMECH MICROENG
期刊ISSN 0960-1317
期刊官方网站 https://iopscience.iop.org/journal/0960-1317
是否OA No
出版商 IOP Publishing Ltd.
出版周期 Monthly
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始发年份 1991
年文章数 137
最新影响因子 2.4(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
INSTRUMENTS & INSTRUMENTATION 仪器仪表3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技4区
PHYSICS, APPLIED 物理:应用4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.5 0.476 0.789
Engineering
Mechanical Engineering
207/672 69%
Engineering
Mechanics of Materials
146/398 63%
Engineering
Electrical and Electronic Engineering
292/797 63%
Materials Science
Electronic, Optical and Magnetic Materials
118/284 58%
补充信息
自引率 8.3%
H-index 119
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0960-1317%5BISSN%5D
投稿指南
期刊投稿网址 https://iopscience.iop.org/journal/0960-1317/page/submission-options
收稿范围
Journal of Micromechanics and Microengineering™ (JMM) is a hybrid open access journal dedicated to advances in the nano- and micro-scale science and engineering of mechanical, electromechanical, electrical, and mechatronic systems.

The journal welcomes experimental results as well as studies that contain some or wholly computational/simulation-based work. In the case of the latter, authors should compare their findings with experimental data, if it exists in the literature, and provide sufficient information to enable all computational results to be reproduced.

The scope of the journal includes MEMS/NEMS technologies and applications, as well as:

Biomedical systems and devices (including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces)
Electronics (including flexible electronics, wearable electronics, interface electronics)
Energy and power (including power MEMS/NEMS, energy harvesters, actuators, microbatteries)
Fabrication techniques and manufacturing (including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing)
Lab-on-a-chip
Materials, testing, and reliability
Physical and chemical sensors (including inertial, force, magnetic, tactile, gas, humidity, acoustic and vision sensors)
Optical systems and devices (including micro mirrors, silicon photonics, infrared sensors, optical resonators and clocks, plasmonic devices, LiDAR systems, micro display systems, fiber-based systems)
Packaging and integration technologies (including material/processes for packaging, liquid/vacuum packaging/encapsulation, heterogeneous integration, 3D MEMS integration)
Emerging technologies and applications for MEMS/NEMS (including robotics, smart X, internet of things, autonomous vehicles, machine learning, artificial intelligence)
Micro and Nano fluidics (including droplet/digital/centrifugal/capillary microfluidics, pumps/valves/dispensers, mixers/reactors, separation, integrated microfluidic systems)
RF systems and components (including oscillators, resonators, SAW, BAW, timing, 5G)
Papers focused on materials science with no obvious application or link to nano- or micro-engineering are not suitable for the journal.
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投稿指南 https://publishingsupport.iopscience.iop.org/journals/journal-of-micromechanics-and-microengineering/
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