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Computer Vision and Image Understanding
基本信息
期刊名称 Computer Vision and Image Understanding
COMPUT VIS IMAGE UND
期刊ISSN 1077-3142
期刊官方网站 https://www.sciencedirect.com/journal/computer-vision-and-image-understanding
是否OA No
出版商 Academic Press Inc.
出版周期 Monthly
文章处理费 登录后查看
始发年份 1995
年文章数 189
影响因子 4.3(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 7.8 1.420 1.562
Computer Science
Signal Processing
27/131 79%
Computer Science
Computer Vision and Pattern Recognition
22/106 79%
Computer Science
Software
88/407 78%
补充信息
自引率 9.3%
H-index 124
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1077-3142%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/CVIU
收稿范围
The central focus of this journal is the computer analysis of pictorial information. Computer Vision and Image Understanding publishes papers covering all aspects of image analysis from the low-level, iconic processes of early vision to the high-level, symbolic processes of recognition and interpretation. A wide range of topics in the image understanding area is covered, including papers offering insights that differ from predominant views.

Research Areas Include:

• Theory
• Early vision
• Data structures and representations
• Shape
• Range
• Motion
• Matching and recognition
• Architecture and languages
• Vision systems

Benefits to authors
We also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.

Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our Support Center
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投稿指南 https://www.sciencedirect.com/journal/computer-vision-and-image-understanding/publish/guide-for-authors
投稿模板 https://www.elsevier.com/__data/promis_misc/CVIU_Template.docm
参考文献格式 https://www.elsevier.com/journals/computer-vision-and-image-understanding/1077-3142/guide-for-authors
编辑信息

Editor-in-Chief

N. Paragios

CentraleSupelec, Université Paris-Saclay, Gif-sur-Yvette, FR

Assistant Editors-in-Chief

B. Caputo

Università di Roma "La Sapienza", Rome, Italy

G. Hua

Microsoft Research, Redmond, WA, USA

R. Vidal

Johns Hopkins University, Baltimore, Maryland, USA

Area Editors

K. Alahari

INRIA Grenoble - Rhone-Alpes, Grenoble, France

A. Argyros

University of Crete, Heraklion, Greece

J.F. Aujol

Institut de Mathématiques de Bordeaux, Talence Cedex, France

J.P. Barreto

Universidade de Coimbra, Coimbra, Portugal

M. Betke

Boston University, Boston, Massachusetts, USA

I. Bloch

Centre National de la Recherche Scientifique (CNRS), Paris, France

M. Bronstein

Università della Svizzera Italiana (USI), Lugano, Switzerland

O. Camps

Northeastern University (NU), Boston, Massachusetts, USA

M. Cord

Sorbonne Université, Paris, France

S. Dickinson

Samsung Toronto AI Research and University of Toronto, Toronto, Ontario, Canada

G. Doretto

West Virginia University, Morgantown, USA

P. Favaro

Universität Bern, Bern, Switzerland

C. Fermüller

University of Maryland, College Park, Maryland

T. Fletcher

The University of Utah, Salt Lake City, Utah, USA

C. Fowlkes

University of California at Irvine, Irvine, California, USA

A. Frangi

University of Leeds, Leeds, England, UK

Y. Furukawa

Washington University in St. Louis, St. Louis, Missouri, USA

G. Gilboa

Technion - Israel Institute of Technology, Haifa, Israel

J. Gonzalez

Universitat Autònoma de Barcelona (UAB), Catalonia, Spain

S. Gould

Australian National University, Canberra, Australian Capital Territory, Australia

B. Han

Pohang University of Science and Technology, Pohang, Gyeongbuk, The Republic of Korea

X. Huang

Lehigh University, Bethlehem, Pennsylvania, USA

S. Ilic

Siemens Corporate Technology, Munich, Germany

D. Jacobs

University of Maryland, College Park, Maryland, USA

C.V. Jawahar

International Institute of Information Technology, Hyderabad, India

H. Jegou

Facebook, Paris, France

F. Jurie

ENSICAEN - CNRS University of Caen, Caen cedex, France

S.J. Kim

N. Komodakis

École Nationale des Ponts et Chaussées, Marne-la-Vallee cedex 2, France

P. Kornprobst

A. Kuijper

Fraunhofer Institute for Computer Graphics (IGD), Darmstadt, Germany

B. Kulis

Boston University, Boston, Massachusetts, USA

P. Kumar

University of Oxford, Oxford, England, UK

K.M. Lee

Seoul National University (SNU), Seoul, The Republic of Korea

V. Lempitsky

Skolkovo Institute of Science and Technology (Skoltech), Skolkovo, Russian Federation

V. Lepetit

École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland

Xuelong Li

Chinese Academy of Sciences, Xi'an, Shaanxi, P.R. China

J. Lim

Hanyang University, Seoul, The Republic of Korea

H. Ling

Temple University, Philadelphia, Pennsylvania, USA

D. Lopresti

Lehigh University, Bethlehem, Pennsylvania, USA

A.M. Martinez

The Ohio State University, Columbus, Ohio, USA

A. Mittal

Indian Institute of Technology (IIT) Madras, Chennai, India

T.B. Moeslund

Aalborg University, Denmark

www.create.aau.dk/tbm

V. Murino

Università degli Studi di Verona, Verona, Italy

L. Najman

Université Paris-Est, Champs-sur-Marne, France

S. Negahdaripour

University of Miami, Coral Gables, Florida, USA

D. Parikh

Georgia Tech, Atlanta, Georgia, USA

I. Patras

Queen Mary, University of London (QMUL), London, England, UK

M. Piccardi

University of Technology Sydney, Sydney, New South Wales, Australia

R Pless

Washington University in Saint Louis, St. Louis, Missouri, USA

A. Prati

Università Iuav di Venezia, Venezia, Italy

I. Reid

University of Adelaide, Adelaide, South Australia, Australia

A. Ross

Michigan State University, East Lansing, Michigan, USA

A.K. Roy Chowdhury

University of California, Riverside, Riverside, California, USA

D. Samaras

Stony Brook University, Stony Brook, New York, USA

Y. Sato

The University of Tokyo, Tokyo, Japan

N. Sebe

Università di Trento, Povo, Italy

G. Shakhnarovich

Toyota Technological Institute at Chicago, Chicago, Illinois, USA

S. Shan

Chinese Academy of Sciences (CAS), Haidian, Beijing, China

L. Sigal

Disney Research, Pittsburgh, Pennsylvania, USA

R. Singh

Indraprastha Institute of Information Technology (IIIT) - Delhi, New Delhi, India

S. Sinha

Microsoft Research, Redmond, Washington, USA

A. Srivastava

Florida State University, Tallahassee, Florida, USA

I. Stamos

City University of New York (CUNY), New York, New York, USA

B. Stenger

Toshiba Research Europe, Cambridge, England, UK

Y Tian

The City University of New York, New York, New York, USA

R Timofte

ETH Zürich

J.K. Tsotsos

York University, Toronto, Ontario, Canada

T. Tuytelaars

KU Leuven, Leuven, Belgium

N. Ukita

Toyota Technological Institute, Nagoya, Japan

J. van de Weijer

Computer Vision Center, Barcelona, Spain

O. Veksler

University of Western Ontario, London, Ontario, Canada

X. Wang

The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong

S. Yan

National University of Singapore, Singapore, Singapore

M.-H. Yang

University of California at Merced, Merced, California, USA

A. Yilmaz

The Ohio State University, Columbus, Ohio, USA

J. Yu

University of Delaware, Newark, Delaware, USA

L. Yuan

Microsoft Research China, Beijing, China

S. Zafeiriou

Imperial College London, London, England, UK

Editorial Board

J.K. Aggarwal

University of Texas at Austin, Austin, Texas, USA

N. Ahuja

University of Illinois at Urbana-Champaign, Champaign, Illinois, USA

C. Brown

University of Rochester, Rochester, New York, USA

R. Chellappa

University of Maryland, College Park, Maryland, USA

L.S. Davis

University of Maryland, College Park, Maryland, USA

M.A. Fischler

SRI (Stanford Research Institute) International, Menlo Park, California, USA

D. Gatica-Perez

IDIAP Research Institute, Martigny, Switzerland

B. Han

Pohang University of Science and Technology, Pohang, Korea

B.K.P. Horn

Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

T.S. Huang

University of Illinois at Urbana-Champaign, Urbana, USA

T. Kanade

Carnegie Mellon University, Pittsburgh, Pennsylvania, USA

J.J. Koenderink

Universiteit Utrecht, Utrecht, Netherlands

A. Kosaka

Olympus Corporation, Shinjuku-ku, Tokyo, Japan

H.H. Nagel

Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany

R. Nevatia

University of Southern California, Los Angeles, California, USA

W. Niessen

Erasmus MC: Universitair Medisch Centrum Rotterdam

T. Pavlidis

State University of New York (SUNY) at New Paltz, New Paltz, New York, USA

T. Poggio

Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

H. Samet

University of Maryland, College Park, Maryland, USA

A. Sanfeliu

Universitat Politècnica de Catalunya (UPC), Barcelona, Spain

M.-H. Yang

University of California at Merced, Merced, California, USA

Editors Emeriti

A.C. Kak

Purdue University, West Lafayette, Indiana, USA

L.G. Shapiro

University of Washington, Seattle, Washington, USA

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