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Analog Integrated Circuits and Signal Processing
基本信息
期刊名称 Analog Integrated Circuits and Signal Processing
ANALOG INTEGR CIRC S
期刊ISSN 0925-1030
期刊官方网站 https://www.springer.com/10470
是否OA No
出版商 Springer Netherlands
出版周期 Monthly
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始发年份 1991
年文章数 95
影响因子 1.2(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 3.5 0.351 0.664
Computer Science
Signal Processing
68/131 48%
Materials Science
Surfaces, Coatings and Films
71/132 46%
Computer Science
Hardware and Architecture
102/177 42%
补充信息
自引率 8.3%
H-index 45
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0925-1030%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/alog/
收稿范围
Analog Integrated Circuits and Signal Processing is an archival peer reviewed journal publishing research and tutorial papers on the design and applications of analog, radio frequency (RF) and mixed signal integrated circuits (ICs), and signal processing circuits and systems. It is published monthly with worldwide distribution to engineers, researchers, educators, and libraries.
 

The journal promotes and expedites the dissemination of new research results and tutorial views. There is an exciting and large volume of research activity in the field worldwide. Engineers and researchers are striving to build complete systems on chip (SoC) by integrating analog and RF circuits in chip fabrication technologies optimized for digital ICs, and to bridge the gap between classical analog work and recent advances in fabrication technologies with improved analog, RF and mixed signal capabilities. As we move to deep nanometer technologies, analog and RF work is showing signs of dramatic changes with emphasis on interdisciplinary research efforts combining device, circuit, technology issues. Consequently, new design concepts, strategies and design tools as well as new applications in wireless and wire line communications, consumer electronics, automotive, control and biomedical systems are being unveiled.

 

Topics of interest include, but are not limited to:

Analog and Mixed Signal Interface Circuits and Systems;
Analog and RFIC Design;
Data converters;
Active-RC, switched-capacitor and continuous-time integrated filters;
Mixed analog/digital VLSI systems;
RF Front ends, Frequency Synthesizers, integrated power amplifiers
Wireless radio transceivers;
Clock and data recovery circuits;
Simulation and modeling, mixed-mode simulation;
Analog nonlinear circuits and signal processing;
Analog Artificial Neural Networks;
Design solutions for machine learning;
Current mode signal processing circuits and systems;
High speed optoelectronics circuits and systems;
Power management and energy harvesting solutions;
Cyber physical systems;
Hardware security solutions;
Systems on chip for internet of Things; 
Analog VLSI cell libraries;
Analog and RF product development;
Low voltage/low power analog and RFIC design;
Microwave and Millimeter wave Circuits;
Artificial Intelligence, analog behavioral modeling, Analog HDL;
Computer-Aided Design (CAD) tools;
Analog Design Automation/Knowledge-based Systems;
Analog Design in emerging technologies (nanometer CMOS, SiGe BiCMOS, GaAs, heterojunction and floating gate technologies, etc.);
Analog Design for Test;
Integrated sensors and actuators
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投稿指南 https://link.springer.com/journal/10470/submission-guidelines
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参考文献格式
编辑信息

Editor-in-Chief:

Mohammed Ismail
Dept. of Electrical Engineering, The Ohio State University, Columbus, USA

Chung-Chi Hung
National Chiao Tung University, Hsinchu City, Taiwan

Piero Malcovati
University of Pavia, Italy

Mixed Signal Letters Editors:

Kazuyuki Wada, Toyohashi University of Technology, Japan; Yehia Massoud, WPI, USA

Editorial Board:

Mohammad Alhawari, Wayne State University; E. AlarconUPC, SpainJad AtallahNotre Dame University, LebanonSidharth BalasubramanianTexas Instruments, USASergio BampiUFRGS, BrazilHervé BarthelemyInstitut Charles Fabry (ICF), Marseille, FranceSteven BibykOhio State University, USASleiman Bou-SleimanIntel, USA; Rick CarleyCarnegie Mellon UniversityUSAHsin-Shu ChenNational Taiwan University, TaiwanKe-Horng ChenNational Chiao Tung University, TaiwanWei-Zen ChenNational Chiao Tung University, TaiwanYoon-Kyung ChoiSamsung Electronics, KoreaMitra Mirhassani, University of Windsor, Canada; Rocio del RioUniversity of Seville, SpainJose de la RosaUniversity of Seville, SpainAyman FayedOhio State UniversityUSAEby G. FriedmanUniversity of Rochester, NY, USARandall GeigerIowa State University, USAGeorges GielenESAT-MICAS, BelgiumPing GuiSouthern Methodist University, USAKari HalonenHelsinki University of Technology, FinlandMona HellaRPI, USA; Sorin HussTechnical University of Darmstadt, Germany; Tetsuro Itakura, Toshiba Corp., JapanJaeha KimSeoul National University, KoreaTor Sverre LandeUniversity of Oslo, Norway; Yong LianNational University of Singapore, SingaporeTien-Yu LoMediaTek Inc., TaiwanFranco MalobertiUniversity of Pavia, ItalyJean-Yves MichelCentillium Communications, FranceKong-Pang PunChinese University of Hong Kong, Hong Kong, ChinaSusana PatonCarlos III University, SpainCostas PsychalinosUniversity of Patras, GreeceTimo RahkonenUniversity of Oulu, FinlandJaime Ramirez-AnguloNew Mexico State University, USAPeter ReynaertKU-Leuven, BelgiumGabriel Rincon-MoraGeorgia Tech, USAAngel Rodríguez-VázquezUniversidad de Sevilla, SpainMihai SanduleanuMasdar Institute, UAETakahide SatoUniversity of Yamanashi, JapanTakeshi ShimaKanagawa University, JapanHenrik SjolandLund University, SwedenAhmed M. SolimanCairo University, EgyptM. Taher Abuelma'attiKFUPM, Saudi ArabiaShigetaka TakagiTokyo Institute of Technology, JapanGabor TemesOregon State University, USAHannu TenhunenSwedish Royal Institute of Technology, SwedenSeng Pan U (Ben), University of Macau, Macau, ChinaZhihua WangTsinghua University, ChinaChung-Yu WuNational Chiao Tung University, TaiwanOrly Yadid-PechtBen-Gurion University, IsraelJerald Yoo,National University of Singapore; Xiaoyang ZengFudan University, China, Yann Deval, Bordeaux University, France.

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