Analog Integrated Circuits and Signal Processing is an archival peer reviewed journal publishing research and tutorial papers on the design and applications of analog, radio frequency (RF) and mixed signal integrated circuits (ICs), and signal processing circuits and systems. It is published monthly with worldwide distribution to engineers, researchers, educators, and libraries.
 

The journal promotes and expedites the dissemination of new research results and tutorial views. There is an exciting and large volume of research activity in the field worldwide. Engineers and researchers are striving to build complete systems on chip (SoC) by integrating analog and RF circuits in chip fabrication technologies optimized for digital ICs, and to bridge the gap between classical analog work and recent advances in fabrication technologies with improved analog, RF and mixed signal capabilities. As we move to deep nanometer technologies, analog and RF work is showing signs of dramatic changes with emphasis on interdisciplinary research efforts combining device, circuit, technology issues. Consequently, new design concepts, strategies and design tools as well as new applications in wireless and wire line communications, consumer electronics, automotive, control and biomedical systems are being unveiled.

 

Topics of interest include, but are not limited to:

Analog and Mixed Signal Interface Circuits and Systems;
Analog and RFIC Design;
Data converters;
Active-RC, switched-capacitor and continuous-time integrated filters;
Mixed analog/digital VLSI systems;
RF Front ends, Frequency Synthesizers, integrated power amplifiers
Wireless radio transceivers;
Clock and data recovery circuits;
Simulation and modeling, mixed-mode simulation;
Analog nonlinear circuits and signal processing;
Analog Artificial Neural Networks;
Design solutions for machine learning;
Current mode signal processing circuits and systems;
High speed optoelectronics circuits and systems;
Power management and energy harvesting solutions;
Cyber physical systems;
Hardware security solutions;
Systems on chip for internet of Things; 
Analog VLSI cell libraries;
Analog and RF product development;
Low voltage/low power analog and RFIC design;
Microwave and Millimeter wave Circuits;
Artificial Intelligence, analog behavioral modeling, Analog HDL;
Computer-Aided Design (CAD) tools;
Analog Design Automation/Knowledge-based Systems;
Analog Design in emerging technologies (nanometer CMOS, SiGe BiCMOS, GaAs, heterojunction and floating gate technologies, etc.);
Analog Design for Test;
Integrated sensors and actuators

Editor-in-Chief:
Mohammed Ismail
Dept. of Electrical Engineering, The Ohio State University, Columbus, USA
Chung-Chi Hung
National Chiao Tung University, Hsinchu City, Taiwan
Piero Malcovati
University of Pavia, Italy
Mixed Signal Letters Editors:

Kazuyuki Wada, Toyohashi University of Technology, Japan; Yehia Massoud, WPI, USA
Editorial Board:
Mohammad Alhawari, Wayne State University; E. Alarcon, UPC, Spain; Jad Atallah, Notre Dame University, Lebanon; Sidharth Balasubramanian, Texas Instruments, USA; Sergio Bampi, UFRGS, Brazil; Hervé Barthelemy, Institut Charles Fabry (ICF), Marseille, France; Steven Bibyk, Ohio State University, USA; Sleiman Bou-Sleiman, Intel, USA; Rick Carley, Carnegie Mellon University, USA; Hsin-Shu Chen, National Taiwan University, Taiwan; Ke-Horng Chen, National Chiao Tung University, Taiwan; Wei-Zen Chen, National Chiao Tung University, Taiwan; Yoon-Kyung Choi, Samsung Electronics, Korea; Mitra Mirhassani, University of Windsor, Canada; Rocio del Rio, University of Seville, Spain; Jose de la Rosa, University of Seville, Spain; Ayman Fayed, Ohio State University, USA; Eby G. Friedman, University of Rochester, NY, USA; Randall Geiger, Iowa State University, USA; Georges Gielen, ESAT-MICAS, Belgium; Ping Gui, Southern Methodist University, USA; Kari Halonen, Helsinki University of Technology, Finland; Mona Hella, RPI, USA; Sorin Huss, Technical University of Darmstadt, Germany; Tetsuro Itakura, Toshiba Corp., Japan; Jaeha Kim, Seoul National University, Korea; Tor Sverre Lande, University of Oslo, Norway; Yong Lian, National University of Singapore, Singapore; Tien-Yu Lo, MediaTek Inc., Taiwan; Franco Maloberti, University of Pavia, Italy; Jean-Yves Michel, Centillium Communications, France; Kong-Pang Pun, Chinese University of Hong Kong, Hong Kong, China; Susana Paton, Carlos III University, Spain; Costas Psychalinos, University of Patras, Greece; Timo Rahkonen, University of Oulu, Finland; Jaime Ramirez-Angulo, New Mexico State University, USA; Peter Reynaert, KU-Leuven, Belgium; Gabriel Rincon-Mora, Georgia Tech, USA; Angel Rodríguez-Vázquez, Universidad de Sevilla, Spain; Mihai Sanduleanu, Masdar Institute, UAE; Takahide Sato, University of Yamanashi, Japan; Takeshi Shima, Kanagawa University, Japan; Henrik Sjoland, Lund University, Sweden; Ahmed M. Soliman, Cairo University, Egypt; M. Taher Abuelma'atti, KFUPM, Saudi Arabia; Shigetaka Takagi, Tokyo Institute of Technology, Japan; Gabor Temes, Oregon State University, USA; Hannu Tenhunen, Swedish Royal Institute of Technology, Sweden; Seng Pan U (Ben), University of Macau, Macau, China; Zhihua Wang, Tsinghua University, China; Chung-Yu Wu, National Chiao Tung University, Taiwan; Orly Yadid-Pecht, Ben-Gurion University, Israel; Jerald Yoo,National University of Singapore; Xiaoyang Zeng, Fudan University, China, Yann Deval, Bordeaux University, France.