Microfluidics and Nanofluidics is an international peer-reviewed journal that aims to publish papers in all aspects of microfluidics, nanofluidics and lab-on-a-chip science and technology. The objectives of the journal are to (1) provide an overview of the current state of the research and development in microfluidics, nanofluidics and lab-on-a-chip devices, (2) improve the fundamental understanding of microfluidic and nanofluidic phenomena, and (3) discuss applications of microfluidics, nanofluidics and lab-on-a-chip devices. Topics covered in this journal include:

1. Fundamental principles of micro- and nanoscale phenomena like,
flow, mass transport and reactions

2. Theoretical models and numerical simulation with experimental and/or analytical proof

3. Novel measurement & characterization technologies

4. Devices (actuators and sensors)

5. New unit-operations for dedicated microfluidic and nanofluidic platforms

6. Lab-on-a-chip applications

7. Microfabrication technologies and materials

Please note, Microfluidics and Nanofluidics does not publish manuscripts studying pure microscale heat transfer since there are many journals that cover this field of research (e.g. Journal of Heat Transfer, Journal of Heat and Mass Transfer, Journal of Heat and Fluid Flow, etc.). Furthermore, we do not publish numerical simulation articles without experimental and/or analytical proofs.

Editor-in-Chief
Jan C. T. Eijkel
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
BIOS chair, Carré 2.247
P.O. box 217
7500 AE Enschede
The Netherlands
e-mail: j.c.t.eijkel@utwente.nl
Editors
N. R. Aluru
Department of Mechanical Science and Engineering
3265 Beckman Institute, MC-251
405 N. Mathews Avenue
University of Illinois at Urbana-Champaign
Urbana, IL 61801, USA
email: aluru@illinois.edu
Jean-Christophe Baret
Soft Micro Systems
CNRS, Univ. Bordeaux, CRPP, UPR 8641
115 Avenue Schweitzer
33600 Pessac, France
email: jean-christophe.baret@u-bordeaux.fr

Steffen Hardt
Technical University of Darmstadt
Center of Smart Interfaces
L2|06
Alarich-Weiss-Str. 10
64287 Darmstadt
Germany
e-mail: hardt@csi.tu-darmstadt.de
Gwo-Bin Vincent Lee
National Tsing Hua University
Department of Power Mechanical Engineering
101, Sec. 2, Kuang-Fu Road 30013 Hsinchu
Taiwan
e-mail: gwobin@pme.nthu.edu.tw

Yi-Kuen Lee
Dept. of Mechanical & Aerospace Engineering
Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hongkong
China
e-mail: meyklee@ust.hk

Gui-Rong Liu
University of Cincinnati
Department of Aerospace Engineering &
Engineering Mechanics
P.O. Box 210070
Cincinnati, OH 45221-0070
USA
email: liugr@ucmail.uc.edu

Hywel Morgan
University of Southampton 
ECS, Faculty of Physical Sciences and Engineering
Southampton
United Kingdom. SO17 1BJ
e-mail: hm@ecs.soton.ac.uk
Nam-Trung Nguyen
Griffith University
QLD Micro- and Nanotechnology Centre
Nathan campus
170 Kessels Road
QLD 4111
Australia
e-mail: nam-trung.nguyen@griffith.edu.au

Steve Wereley
Purdue University
Birck Nanotechnology Center
1205 W. State Street
West Lafayette, IN 47907-2057 
USA
e-mail: wereley@purdue.edu
Yitshak Zohar
The University of Arizona
Department of Aerospace & Mechanical Engineering
Department of Biomedical Engineering
1130 N Mountain Ave
P.O. Box 210119
Tucson, AZ 85721
USA
e-mail: zohar@email.arizona.edu


Editorial Advisory Board
Chong H. Ahn
Microsystems and BioMEMS Lab
Department of Electrical and Computer Engineering
University of Cincinnati
Cincinnati, Ohio 45221-0030, USA

Haim H. Bau
The Department of Mechanical Engineering and Applied Mechanics 
University of Pennsylvania
Philadelphia, PA 19104-6315, USA
Albert van den Berg
University of Twente
Faculty of Electrical Engineering
Laboratory of Biosensors
7500 AE Enschede, The Netherlands
Kenneth Breuer
Brown University
Division of Engineering, Box D 
Providence RI 02912, USA
Carlo Effenhauser
Microtechnology Center 
Roche Instrument Center AG 
Diagnostics Division 
6343 Rotkreuz, Switzerland
David Erickson
Sibley School of Mechanical and Aerospace Engineering
Cornell University
Ithaca, NY, 14853, USA
Richard Fair
Department of Electrical and Computer Engineering
Duke University
Durham, NC 27708, USA
Martin Gijs
Swiss Federal Institute of Technology (EPFL)
Institute of Microelectronic & Microsystems (IMM)
Laboratory for Microsystems (LMIS)
1015 Lausanne, Switzerland
Satish G. Kandlikar
Mechanical Engineering Department 
Rochester Institute of Technology 
Rochester, NY14623, USA
Takehiko Kitamori
Department of Applied Chemistry
University of Tokyo 
Tokyo, 113-8656, JAPAN

Dongqing Li (Founding Editor) 
Department of Mechanical and Mechatronics Engineering
Faculty of Engineering 
University of Waterloo
Juan G. Santiago
Department of Mechanical Engineering
Stanford University
Stanford, CA 94305-3030, USA
Shuichi Takayama
Department of Biomedical Engineering
University of Michigan
Ann Arbor, MI 48109-2099, USA
Joseph Wang
Department of Chemical & Materials Engineering
Arizona State University 
Tempe, AZ 85287-6006, USA
Chun Yang
Division of Thermal Fluids Engineering
School of Mechanical and Aerospace Engineering
Nanyang Technological University
Singapore 639798, Singapore
Ruey-Jen Yang
Department of Engineering Science
National Cheng Kung University
Tainan, 70101, Taiwan

Roland Zengerle
Dept. of Microsystems Engineering - IMTEK
University of Freiburg
Georges-Koehler-Allee 106
79110 Freiburg, Germany
E-mail: zengerle@imtek.de