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Microfluidics and Nanofluidics
基本信息
期刊名称 Microfluidics and Nanofluidics
MICROFLUID NANOFLUID
期刊ISSN 1613-4982
期刊官方网站 https://www.springer.com/10404
是否OA No
出版商 Springer Verlag
出版周期 Quarterly
文章处理费 登录后查看
始发年份 2004
年文章数 85
影响因子 2.3(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 INSTRUMENTS & INSTRUMENTATION 仪器仪表3区
NANOSCIENCE & NANOTECHNOLOGY 纳米科技4区
PHYSICS, FLUIDS & PLASMAS 物理:流体与等离子体3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.8 0.380 0.687
Physics and Astronomy
Condensed Matter Physics
145/434 66%
Materials Science
Electronic, Optical and Magnetic Materials
101/284 64%
Materials Science
Materials Chemistry
125/317 60%
补充信息
自引率 4.3%
H-index 75
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1613-4982%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/mano
收稿范围
Microfluidics and Nanofluidics is an international peer-reviewed journal that aims to publish papers in all aspects of microfluidics, nanofluidics and lab-on-a-chip science and technology. The objectives of the journal are to (1) provide an overview of the current state of the research and development in microfluidics, nanofluidics and lab-on-a-chip devices, (2) improve the fundamental understanding of microfluidic and nanofluidic phenomena, and (3) discuss applications of microfluidics, nanofluidics and lab-on-a-chip devices. Topics covered in this journal include:

1. Fundamental principles of micro- and nanoscale phenomena like,
flow, mass transport and reactions

2. Theoretical models and numerical simulation with experimental and/or analytical proof

3. Novel measurement & characterization technologies

4. Devices (actuators and sensors)

5. New unit-operations for dedicated microfluidic and nanofluidic platforms

6. Lab-on-a-chip applications

7. Microfabrication technologies and materials

Please note, Microfluidics and Nanofluidics does not publish manuscripts studying pure microscale heat transfer since there are many journals that cover this field of research (e.g. Journal of Heat Transfer, Journal of Heat and Mass Transfer, Journal of Heat and Fluid Flow, etc.). Furthermore, we do not publish numerical simulation articles without experimental and/or analytical proofs.
收录体裁
投稿指南 https://link.springer.com/journal/10404/submission-guidelines
投稿模板
参考文献格式
编辑信息

Editor-in-Chief

Jan C. T. Eijkel
University of Twente
Faculty of Electrical Engineering, Mathematics and Computer Science
BIOS chair, Carré 2.247
P.O. box 217
7500 AE Enschede
The Netherlands
e-mail: j.c.t.eijkel@utwente.nl

Editors

N. R. Aluru
Department of Mechanical Science and Engineering
3265 Beckman Institute, MC-251
405 N. Mathews Avenue
University of Illinois at Urbana-Champaign
Urbana, IL 61801, USA
email: aluru@illinois.edu

Jean-Christophe Baret
Soft Micro Systems
CNRS, Univ. Bordeaux, CRPP, UPR 8641
115 Avenue Schweitzer
33600 Pessac, France
email: jean-christophe.baret@u-bordeaux.fr

Steffen Hardt
Technical University of Darmstadt
Center of Smart Interfaces
L2|06
Alarich-Weiss-Str. 10
64287 Darmstadt
Germany
e-mail: hardt@csi.tu-darmstadt.de

Gwo-Bin Vincent Lee
National Tsing Hua University
Department of Power Mechanical Engineering
101, Sec. 2, Kuang-Fu Road 30013 Hsinchu
Taiwan
e-mail: gwobin@pme.nthu.edu.tw

Yi-Kuen Lee
Dept. of Mechanical & Aerospace Engineering
Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hongkong
China
e-mail: meyklee@ust.hk

Gui-Rong Liu
University of Cincinnati
Department of Aerospace Engineering &
Engineering Mechanics
P.O. Box 210070
Cincinnati, OH 45221-0070
USA
email: liugr@ucmail.uc.edu

Hywel Morgan
University of Southampton 
ECS, Faculty of Physical Sciences and Engineering
Southampton
United Kingdom. SO17 1BJ
e-mail: hm@ecs.soton.ac.uk

Nam-Trung Nguyen
Griffith University
QLD Micro- and Nanotechnology Centre
Nathan campus
170 Kessels Road
QLD 4111
Australia
e-mail: nam-trung.nguyen@griffith.edu.au

Steve Wereley
Purdue University
Birck Nanotechnology Center
1205 W. State Street
West Lafayette, IN 47907-2057 
USA
e-mail: wereley@purdue.edu

Yitshak Zohar
The University of Arizona
Department of Aerospace & Mechanical Engineering
Department of Biomedical Engineering
1130 N Mountain Ave
P.O. Box 210119
Tucson, AZ 85721
USA
e-mail: zohar@email.arizona.edu


Editorial Advisory Board

Chong H. Ahn
Microsystems and BioMEMS Lab
Department of Electrical and Computer Engineering
University of Cincinnati
Cincinnati, Ohio 45221-0030, USA

Haim H. Bau
The Department of Mechanical Engineering and Applied Mechanics 
University of Pennsylvania
Philadelphia, PA 19104-6315, USA

Albert van den Berg
University of Twente
Faculty of Electrical Engineering
Laboratory of Biosensors
7500 AE Enschede, The Netherlands

Kenneth Breuer
Brown University
Division of Engineering, Box D 
Providence RI 02912, USA

Carlo Effenhauser
Microtechnology Center 
Roche Instrument Center AG 
Diagnostics Division 
6343 Rotkreuz, Switzerland

David Erickson
Sibley School of Mechanical and Aerospace Engineering
Cornell University
Ithaca, NY, 14853, USA

Richard Fair
Department of Electrical and Computer Engineering
Duke University
Durham, NC 27708, USA

Martin Gijs
Swiss Federal Institute of Technology (EPFL)
Institute of Microelectronic & Microsystems (IMM)
Laboratory for Microsystems (LMIS)
1015 Lausanne, Switzerland

Satish G. Kandlikar
Mechanical Engineering Department 
Rochester Institute of Technology 
Rochester, NY14623, USA

Takehiko Kitamori
Department of Applied Chemistry
University of Tokyo 
Tokyo, 113-8656, JAPAN

Dongqing Li (Founding Editor) 
Department of Mechanical and Mechatronics Engineering
Faculty of Engineering 
University of Waterloo

Juan G. Santiago
Department of Mechanical Engineering
Stanford University
Stanford, CA 94305-3030, USA

Shuichi Takayama
Department of Biomedical Engineering
University of Michigan
Ann Arbor, MI 48109-2099, USA

Joseph Wang
Department of Chemical & Materials Engineering
Arizona State University 
Tempe, AZ 85287-6006, USA

Chun Yang
Division of Thermal Fluids Engineering
School of Mechanical and Aerospace Engineering
Nanyang Technological University
Singapore 639798, Singapore

Ruey-Jen Yang
Department of Engineering Science
National Cheng Kung University
Tainan, 70101, Taiwan

Roland Zengerle
Dept. of Microsystems Engineering - IMTEK
University of Freiburg
Georges-Koehler-Allee 106
79110 Freiburg, Germany
E-mail: zengerle@imtek.de


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