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Thin Solid Films
基本信息
期刊名称 Thin Solid Films
THIN SOLID FILMS
期刊ISSN 0040-6090
期刊官方网站 https://www.sciencedirect.com/journal/thin-solid-films
是否OA No
出版商 Elsevier B.V.
出版周期 Semimonthly
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始发年份 1967
年文章数 347
影响因子 2.0(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 MATERIALS SCIENCE, COATINGS & FILMS 材料科学:膜3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合4区
PHYSICS, APPLIED 物理:应用4区
PHYSICS, CONDENSED MATTER 物理:凝聚态物理4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.0 0.400 0.628
Materials Science
Metals and Alloys
51/176 71%
Materials Science
Surfaces, Coatings and Films
60/132 54%
Materials Science
Electronic, Optical and Magnetic Materials
131/284 54%
Materials Science
Materials Chemistry
148/317 53%
Physics and Astronomy
Surfaces and Interfaces
28/57 51%
补充信息
自引率 6.60%
H-index 175
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0040-6090%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/tsf/default.aspx
收稿范围
International Journal on the Science and Technology of Condensed Matter Films



Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin film synthesis, characterization, modelling, and applications. The topical scope of Thin Solid Films reflects a wide range of thin film related themes:
Thin film synthesis, with particular emphasis on the control of growth for desired physical properties
Surfaces and interfaces
Solar energy conversion
Catalysis
Batteries and other electrochemical devices
Metallurgical, protective, and hard coatings
Electronics, optics, and opto-electronics
Magnetics and magneto-optics
Superconductivity


Note to authors
Contributions to Thin Solid Films should concern thin films and their potential applications. Details of film synthesis are required, together with the reproducibility of achieved results. Simulations should always be compared with corresponding original or published experimental data.

Benefits to authors
We also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.

Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our Support Center
收录体裁
• Full length (regular) papers 
• Invited review articles
• Letters
投稿指南 https://www.sciencedirect.com/journal/thin-solid-films/publish/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/thin-solid-films/0040-6090/guide-for-authors
编辑信息
Editor-in-Chief
J.E. Greene
Frederick Seitz Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
Associate Editors
Helmholtz-Zentrum Berlin für Materialien und Energie, Berlin, Germany
Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK

P. Desjardins

Dépt. de Génie Physique, École Polytechnique de Montreal, Montréal, Quebec, Canada
Gessert Consulting, LLC, Conifer, Colorado, USA
Dept. of Chemistry, City University of Hong Kong, Kowloon, Hong Kong
Editorial Board

T.L. Alford

Dept. of Chemical & Materials Engineering, Arizona State University, Tempe, Arizona, USA

J.-M. Baribeau

Inst. for Microstructural Sciences, Conseil national de recherches Canada (CNRC), Ottawa, Ontario, Canada

P.B. Barna

Res. Inst. for Technical Physics HAS, Budapest, Hungary

J.P. Chu

Dept. of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan

M.-A. De Paoli

Instituto de Química, Universidade Estadual de Campinas (UNICAMP), Campinas, Brazil

A. Djurisic

School of Biomedical Sciences, Li Ka Shing Faculty of Medicine, The University of Hong Kong, Pokfulam, Hong Kong

D. Gall

Materials Science & Engineering, MRC 204, Rensselaer Polytechnic Institute, Troy, New York, USA

C.G. Granqvist

Dept. of Engineering Science (Inst. för Teknikvetenskaper), Uppsala Universitet, Uppsala, Sweden

H.J. Kim

School of Electrical and Electronic Engineering, Yonsei University, Seodaemun-Gu, Seoul, The Republic of Korea

Y. Li

Institute of Chemistry, Chinese Academy of Sciences (CAS), Beijing, China

P.J. Martin

Materials Science & Engineering, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Lindfield, New South Wales, Australia

A.K. Pal

Dept. of Materials Science, Indian Association. for the Cultivation of Science, Jadavpur, Kolkata, India
Evatec AG, Trübbach, Switzerland

J.-J. Pireaux

LISE Lab., Université de Namur, Namur, Belgium

B. Ratner, PhD

Dept. of Bioengineering, University of Washington, Seattle, Washington, USA

I.K. Schuller

Dept. of Physics, 0319, University of California at San Diego (UCSD), La Jolla, California, USA

J.A.N.T. Soares

Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA


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