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Materials Science in Semiconductor Processing
基本信息
期刊名称 | Materials Science in Semiconductor Processing MAT SCI SEMICON PROC |
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期刊ISSN | 1369-8001 |
期刊官方网站 | https://www.sciencedirect.com/journal/materials-science-in-semiconductor-processing |
是否OA | No |
出版商 | Elsevier Ltd |
出版周期 | Bimonthly |
文章处理费 | 登录后查看 |
始发年份 | |
年文章数 | 635 |
影响因子 | 4.2(2023) scijournal影响因子 greensci影响因子 |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
---|---|---|---|
工程技术3区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区 | 否 | 否 |
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区 | |||
PHYSICS, APPLIED 物理:应用3区 | |||
PHYSICS, CONDENSED MATTER 物理:凝聚态物理3区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
---|---|---|---|---|---|
学科 | 排名 | 百分位 | 8.0 | 0.732 | 0.992 |
Engineering Mechanical Engineering |
87/672 | 87% |
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Physics and Astronomy Condensed Matter Physics |
59/434 | 86% |
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Engineering Mechanics of Materials |
60/398 | 85% |
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Materials Science General Materials Science |
100/463 | 78% |
补充信息
自引率 | 4.8% |
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H-index | 49 |
SCI收录状况 |
Science Citation Index Expanded |
官方审稿时间 | 登录后查看 |
网友分享审稿时间 | 数据统计中,敬请期待。 |
接受率 | 登录后查看 |
PubMed Central (PMC) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D |
投稿指南
期刊投稿网址 | https://www.editorialmanager.com/mssp/default.aspx |
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收稿范围 | Functional Materials for (Opto)electronics, Sensors, Detectors, and Green Energy. Materials Science in Semiconductor Processing Mrovides a unique forum for the discussion of novel processing, applications, and theoretical studies of functional semiconductor materials and devices. Each issue aims to provide a snapshot of current insights, new achievements, breakthroughs, perspectives, and future trends in material sciences for such diverse fields as advanced electronics and opto-electronics, sensors and detectors, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film deposition and growth technology, hybrid and quantum materials, device fabrication technology, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography, etching, doping, annealing, and thin film processing for submicron and nano devices; material and device failure, reliability, damage evolution, and related issues; advanced chemical and physical vapor deposition; advanced metallization and interconnect schemes; compound semiconductor materials and processing; new dielectrics and non-oxide materials and their applications; (macro)molecular, hybrid, heterostructure, and quantum materials, devices, and processing; molecular dynamics, ab-initio methods, Monte Carlo simulations, data intensive and machine-learning based approaches, etc.; new materials and processes for discrete and integrated circuits; advanced electronic packaging materials and processes; magnetic materials and spintronics; crystal growth technology and mechanism; intrinsic impurities and defects of materials. Pure device simulation and modelling without connection to experiment is not within the aim and scope of this journal. Submit your manuscript |
收录体裁 | Original research papers, reviews, letters to the editor. |
投稿指南 | https://www.sciencedirect.com/journal/materials-science-in-semiconductor-processing/publish/guide-for-authors |
投稿模板 | |
参考文献格式 | https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors |
编辑信息 |
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