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Journal of Thermal Spray Technology
基本信息
期刊名称 Journal of Thermal Spray Technology
J THERM SPRAY TECHN
期刊ISSN 1059-9630
期刊官方网站 https://www.springer.com/11666
是否OA No
出版商 Springer New York
出版周期 Quarterly
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始发年份 1992
年文章数 170
影响因子 3.2(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 MATERIALS SCIENCE, COATINGS & FILMS 材料科学:膜3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 5.2 0.608 1.121
Physics and Astronomy
Condensed Matter Physics
130/434 70%
Materials Science
Surfaces, Coatings and Films
44/132 67%
Materials Science
Materials Chemistry
113/317 64%
补充信息
自引率 15.6%
H-index 72
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1059-9630%5BISSN%5D
投稿指南
期刊投稿网址 https://mc.manuscriptcentral.com/jtst
收稿范围
The Journal of Thermal Spray Technology publishes contributions on all aspects -- fundamental and practical--of thermal spray science including processes, feedstock manufacture, testing, and characterization. As the primary vehicle for thermal spray information transfer, its mission is to synergize the rapidly advancing thermal spray industry and related industries by presenting research and development efforts leading to advancements in implementable engineering applications of the technology.

The Journal of Thermal Spray Technology

Publishes critically reviewed scientific papers and engineering articles, which combine the best of new research with the latest applications and problem solving.
Covers all fundamental and practical aspects of thermal spray science, including processes, feedstock manufacture, and testing and characterization.
Contains worldwide coverage of the latest research, products, equipment and process developments.
Includes technical note case studies from real-time applications and in-depth topical reviews.
Provides abstracts of recent technical literature with patents and critically reviewed scientific papers.
Covers industry news such as organizational changes and event listings.
收录体裁
投稿指南 https://link.springer.com/journal/11666/submission-guidelines
投稿模板
参考文献格式
编辑信息

Editor-in-Chief

Armelle Vardelle, Université de Limoges/ENSIL, France

Lead Editor

André McDonald, University of Alberta, Canada

Associate Editors
Andrew S.M. Ang,
 Swinburne University of Technology, Australia
Giovanni Bolelli, University of Modena And Reggio Emilia, Modena, Italy
Kendall Hollis, Los Alamos National Laboratory, Los Alamos, NM, USA
Tanvir Hussain, University of Nottingham, United Kingdom
Margaret Hyland, Victoria University of Wellington, New Zealand
Chang-Jiu Li, Xian Jiaotong University, China
Georg Mauer, Forschungszentrum Jülich GmbH, Germany
Kentaro Shinoda, AIST, Japan

Editor Emeritus
Christopher C. Berndt, Swinburne University of Technology, Australia

Editorial Committee
Robert Vassen, ChairForschungszentrum Jülich GmbH, Germany; Y.C. Lau, Vice Chair, GE Power (Retired), Schenectady, NY, USA; Komal Laul, Board Liaison, Delta Airlines, Atlanta, GA, USA; Robert C. Tucker, Jr., Past Chair, The Tucker Group LLC, Wesley Chapel, FL, USA; Armelle Vardelle, Editor-in-Chief, Université de Limoges/ENSIL, France;André McDonald, Lead Editor, University of Alberta, Canada; Andrew S.M. Ang, Swinburne University of Technology, Australia; Giovanni Bolelli, University of Modena And Reggio Emilia, Modena, Italy; Kendall Hollis, Los Alamos National Laboratory, Los Alamos, NM, USA; Tanvir Hussain, University of Nottingham, United Kingdom; Margaret Hyland, Victoria University of Wellington, New Zealand; Chang-Jiu Li, Xian Jiaotong University, China; Georg Mauer, Forschungszentrum Jülich GmbH, Germany; Kentaro Shinoda, AIST, Japan; Rehan Ahmed, Heriot-Watt University, United Kingdom; Luc Bianchi, Safran SA, France; Timothy J. Eden, Penn State Applied Research Laboratory, PA, USA; Masahiro Fukumoto, Toyohashi University of Technology, Japan; Bertrand Jodoin, University of Ottowa, Ontario, Canada; Seiji Kuroda, National Institute for Materials Science, Japan; Hua Li, Chinese Academy of Sciences, China; Robert A. Miller, R.A. Miller Materials Engineering, Indianapolis, IN, USA; Christian Moreau, Concordia University, Quebec, Canada; Dheepa Srinivasan, Independent Consultant, Additive Manufacturing and High Temperature Materials and Coatings, Bangalore, India; Mary Anne Fleming, Staff Liaison, ASM International, Materials Park, OH, USA


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