Incorporating Letters in Applied and Engineering Sciences

The International Journal of Engineering Science is not limited to a specific aspect of science and engineering but is instead devoted to a wide range of subfields in the engineering sciences. While it encourages a broad spectrum of contribution in the engineering sciences, its core interest lies in issues concerning material modeling and response. Articles of interdisciplinary nature are particularly welcome.

The primary goal of the new editors is to maintain high quality of publications. There will be a commitment to expediting the time taken for the publication of the papers. The articles that are sent for reviews will have names of the authors deleted with a view towards enhancing the objectivity and fairness of the review process.

Articles that are devoted to the purely mathematical aspects without a discussion of the physical implications of the results or the consideration of specific examples are discouraged. Articles concerning material science should not be limited merely to a description and recording of observations but should contain theoretical or quantitative discussion of the results.

From time to time, the Journal will publish review articles and bring out special issues on a specific sub-field of engineering science. Authors are encouraged to contact the Editors if they would like to submit a review article or bring out a special issue of the Journal.

The Editors reserve the right to reject papers without sending them out for review.

Manuscripts focusing on applied aspects of engineering science can be submitted to the Journal?s open access companion title, Applications in Engineering Science.

Original research papers and occasional reviews, short communications, letters, letters to the editor and news items. 

Editors-in-Chief
M. Kachanov
Dept. of Mechanical Engineering, Tufts University, Anderson Hall, Medford, Massachusetts, MA 02155, USA Email M. Kachanov
K. Rajagopal
Dept. of Mechanical Engineering, Texas A&M University, College Station, Texas, TX 77843-3123, USA Email K. Rajagopal
Editorial Advisory Board
N. Bellomo
Politecnico di Torino, Torino, Italy Email N. Bellomo
V. Berdichevsky
Wayne State University (WSU), Detroit, Michigan, USA Email V. Berdichevsky
D. Bergman
Tel Aviv University, Tel Aviv, Israel Email D. Bergman
J. Berryman
Lawrence Berkeley National Laboratory, Berkeley, California, USA Email J. Berryman
J.D. Goddard
University of California at San Diego (UCSD), La Jolla, California, USA Email J.D. Goddard
S. Kanaun
Instituto Tecnológico y de Estudios Superiores de Monterrey, Edo de Mexico, MexicoEmail S. Kanaun
J. Llorca
Technical University of Madrid, Spain Email J. Llorca
J. Malek
Charles University, Prague, Czech Republic Email J. Malek
G. Mishuris
Aberystwyth University Email G. Mishuris
J. Murali Krishnan
Indian Institute of Technology (IIT) Madras, Chennai, India Email J. Murali Krishnan
H. Nakotte
New Mexico State University, Las Cruces, New Mexico, USA Email H. Nakotte
J.T. Oden
University of Texas at Austin, Austin, Texas, USA Email J.T. Oden
R. W. Ogden
University of Glasgow, Glasgow, Scotland, UK Email R. W. Ogden
D. Rittel
Technion - Israel Institute of Technology, Haifa, Israel Email D. Rittel
M.B. Rubin
Technion - Israel Institute of Technology, Haifa, Israel Email M.B. Rubin
G. Saccomandi
Università degli Studi di Perugia, Perugia, Italy Email G. Saccomandi
I. Sevostianov
New Mexico State University, Las Cruces, New Mexico, USA Email I. Sevostianov
A.R. Srinivasa
Texas A&M University, College Station, Texas, USA Email A.R. Srinivasa
D .J. Steigmann
University of California at Berkeley, Berkeley, California, USA Email D .J. Steigmann
A. Tani
Keio University, Yokohama, Japan Email A. Tani
A. Waas
University of Michigan, Ann Arbor, Michigan, USA Email A. Waas
A.S. Wineman
University of Michigan, Ann Arbor, Michigan, USA Email A.S. Wineman
R.W. Zimmerman
Imperial College London, London, UK Email R.W. Zimmerman
T.I. Zohdi
University of California at Berkeley, Berkeley, California, USA Email T.I. Zohdi