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Circuit World
基本信息
期刊名称 Circuit World
CIRCUIT WORLD
期刊ISSN 0305-6120
期刊官方网站 https://www.emerald.com/insight/publication/issn/0305-6120
是否OA No
出版商 Emerald Group Publishing Ltd.
出版周期 Quarterly
文章处理费 登录后查看
始发年份
年文章数 10
最新影响因子 0.8(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 2.6 0.288 0.763
Engineering
Industrial and Manufacturing Engineering
182/384 52%
Engineering
Electrical and Electronic Engineering
455/797 42%
补充信息
自引率 12.5%
H-index 19
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0305-6120%5BISSN%5D
投稿指南
期刊投稿网址 http://mc.manuscriptcentral.com/cw
收稿范围
Circuit World (CW) publishes multidisciplinary research on a range of topics relating to all types of electronics circuit including; design, application, manufacturing, assembly, safety and special sections on new technology trends and application areas.
Circuit World is a platform for state-of-the-art technical papers and editorials in the areas of electronics and power electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:

Circuit theory, design methodology, analysis and simulation
Power electronics technology and applications 
Electromagnetic interference and compatibility 
Low and high-power circuits
Application of artificial intelligence and signal processing in circuit design and analysis
Digital, analog, microwave and optoelectronic integrated circuits
Semiconductors, passives, connectors and sensors
Electronic packaging of components, assemblies and products
PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
Internet of Things (IoT)
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