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Applied Physics Letters
基本信息
期刊名称 Applied Physics Letters
APPL PHYS LETT
期刊ISSN 0003-6951
期刊官方网站 http://apl.aip.org/
是否OA No
出版商 American Institute of Physics
出版周期 Weekly
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始发年份 1962
年文章数 2392
影响因子 3.5(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
物理2区 PHYSICS, APPLIED 物理:应用3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 6.4 0.976 1.015
Physics and Astronomy
Physics and Astronomy (miscellaneous)
11/81 87%
补充信息
自引率 8.6%
H-index 401
SCI收录状况 Science Citation Index Expanded
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PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0003-6951%5BISSN%5D
投稿指南
期刊投稿网址 http://apl.peerx-press.org/cgi-bin/main.plex
收稿范围
Applied Physics Letters (APL) features concise, up-to-date reports on significant new findings in applied physics. Emphasizing rapid dissemination of key data and new physical insights, APL offers prompt publication of new experimental and theoretical papers reporting applications of physics phenomena to all branches of science, engineering, and modern technology.

Topics covered in APL are diverse and reflect the most important subjects in applied physics, including:

Photonics and optoelectronics
Surfaces and interfaces
Metasurfaces and metamaterials
Advanced materials
Semiconductors
Phononic, acoustic, and thermal properties
Magnetics and spintronics
Superconductivity and superconducting electronics
Dielectrics, ferroelectrics, and multiferroics
Low-dimensional and topological materials
Solution-processable electronics and photonics
Device physics and nanotechnology
Biophysics, bioimaging, and biosensors
Energy conversion and storage
Quantum technologies
Interdisciplinary applied physics
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参考文献格式
编辑信息

Lesley F. Cohen, Imperial College London, London, UK

Alexander A. Balandin, University of California-Riverside, CA, USA

Qing Hu, Massachusetts Institute of Technology, Cambridge, MA, USA

Xiuling Li, University of Illinois, Urbana, IL, USA

Maria Antonietta Loi, University of Groningen, Groningen, Netherlands

David Long Price, CNRS-Centre de Recherche sur les Matériaux à Haute Température, Orleans, France


Associate Editors

Andrea Alù  (The City College Of New York, NY, USA)

Samuel D. Bader (Argonne National Laboratory, Argonne, IL, USA)

Dongmin Chen (Peking University, Beijing, China)

Christoph H. Grein (University of Illinois at Chicago, Chicago, IL, USA)

David S. Kupperman (Argonne National Laboratory, Argonne, IL, USA)

Roger K. Lake (University of California Riverside, Riverside, CA)

Liang-Sheng Liao (Institute of Functional Nano and Soft Materials, Soochow University, China)

Minn-Tsong Lin (National Taiwan University, Taipei, Taiwan)

Kenjiro Miyano (National Institute for Materials Science, Tsukuba, Japan)

Paul R. Okamoto (Argonne National Laboratory, Argonne, IL, USA)

Lynn E. Rehn (Argonne National Laboratory, Argonne, IL, USA)

Marie-Louise Saboungi (CNRS- Institut de Minéralogie, de Physique des Matériaux, et de Cosmochimie, Paris, France)

Mathias Schubert (University of Nebraska–Lincoln, Lincoln, NE)

Alessandro Tredicucci (Pisa University, Pisa, Italy)

Susan E. Trolier-McKinstry (Pennsylvania State University, University Park, PA, USA)

Emanuel Tutuc (University of Texas at Austin, Austin, TX)

Martin Weides (University of Glasgow, Glasgow, UK)

Wenqing Zhang (Southern University of Science and Technology in Shenzhen, China)

Hongping Zhao (The Ohio State University, OH, USA)


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