Packaging Technology & Science publishes original research, applications and review papers describing significant, novel developments in its field.

The Journal welcomes contributions in a wide range of areas in packaging technology and science, including:
Active packaging
Aseptic and sterile packaging
Barrier packaging
Design methodology
Environmental factors and sustainability
Ergonomics
Food packaging
Machinery and engineering for packaging
Marketing aspects of packaging
Materials
Migration
New manufacturing processes and techniques
Testing, analysis and quality control
Transport packaging

Topics may relate to the packaging of: foods; fragile and high value goods; medical and pharmaceutical products; high volume consumer goods; chemicals and hazardous materials.

It is emphasized that the above is by no means an exhaustive list.

The journal publishes full-length papers, which should not normally exceed 10,000 words, and short communications, which can be at most 2500 words with three tables or illustrations. Two-part papers will not be considered.

The journal has specific editorial policies and requirements concerning mathematical models, new materials (including bio-polymers and anti-microbial treatments), direct food coatings, distribution environmental data and research on the packaging of specific products. These requirements are set out in the Author Check-list: papers failing to meet these requirements will not be considered.

Please note this journal does not cover the microencapsulation (packaging) of electronic circuits and devices.

Editor-in-Chief
David Shires
Surrey, UK
Email:pts@shires.me.uk

Associate Editors
Cristina Nerin
University of Saragoza, Spain

Gordon L. Robertson
University of Queensland, Brisbane, Australia

Vincent Rouillard
Victoria University, Melbourne, Australia

Yves Wyser
Nestle Research Centre, Lausanne, Switzerland

Alaster Yoxall
Sheffield Hallam University, UK

 

Editorial Board
R. Auras
Michigan State University School of Packaging, USA 

V. Chonhenchob
Kasetsart University, Bangkok,
Thailand

J. de la Fuente
California Polytechnic State University,
USA

R. Gavara
IATA-CSIC, 
Spain

C. Guzman-Siller
Universidad de Monterrey, San Pedro, Garza Garcia, Mexico

T. Karbowiak
University of Bourgogne, 
France

R. ten Klooster
University of Twente, 
Netherlands

D. S. Lee
Kyungnam University, Changwon, 
South Korea

S. Østergaard
Danish Technological Institute, Taastrup, Denmark 

L. Piergiovanni
Universita di Milano, Milan,
Italy

E. Schlick-Hasper
BAM Institute, 
Germany

S. Tondella Dantas
ITAL Institute of Food Technology, Campinas, Brazil

J. Wang
Jiangnan University,
P.R. China

R. Wever
Linköping University, 
Sweden

K. L. Yam
Rutgers State University, New Brunswick, New Jersey, USA

G. Batt
Clemson University, 
USA

A. East
Massey University, 
New Zealand

M. Galotto
University of Santiago de Chile(USACH),
Chile

C. Ge
RIT (Rochester Institute of Technology),
USA

L. Horvath
Virginia Tech, 
USA

J. Kerry
University College, Cork,
Ireland

C. Koelsch Sand
Packaging Technology and Research, Michigan State University, USA

A. Olsson
Lund University, 
Sweden

M. Pascall
Food Innovation Center, Ohio State University, USA

K. Saito
Kobe University, 
Japan

K. Tanprasert
King Mongkut's University of Technology Thonburi, Thailand

K. Verghese
RMIT University, Melbourne, 
Australia

Z. W. Wang
Jinan University, Guangzhou,
P.R. China

F. Welle
Fraunhofer Institute for Process Engineering and Packaging, Freising, Germany