当前位置: X-MOL首页SCI期刊查询及投稿分析系统 › AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING杂志
AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING
基本信息
期刊名称 AI EDAM-ARTIFICIAL INTELLIGENCE FOR ENGINEERING DESIGN ANALYSIS AND MANUFACTURING
AI EDAM
期刊ISSN 0890-0604
期刊官方网站 http://aiedam.usc.edu/
是否OA
出版商 Cambridge University Press
出版周期 Bimonthly
文章处理费 登录后查看
始发年份 1987
年文章数 33
影响因子 1.7(2023)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE 计算机:人工智能4区
COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用4区
ENGINEERING, MANUFACTURING 工程:制造4区
ENGINEERING, MULTIDISCIPLINARY 工程:综合4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 1.26 0.351 0.874
Computer Science
Artificial Intelligence
122 / 189 35%
Engineering
Industrial and Manufacturing Engineering
128 / 323 60%
补充信息
自引率 6.80%
H-index 49
SCI收录状况 Science Citation Index Expanded
官方审稿时间 登录后查看
网友分享审稿时间 数据统计中,敬请期待。
接受率 登录后查看
PubMed Central (PMC) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0890-0604%5BISSN%5D
投稿指南
期刊投稿网址 https://mc.manuscriptcentral.com/aie
收稿范围

The journal publishes original articles about significant AI theory and applications based on the most up-to-date research in all branches and phases of engineering. Suitable topics include: analysis and evaluation; selection; configuration and design; manufacturing and assembly; and concurrent engineering. Specifically, the journal is interested in the use of AI in planning, design, analysis, simulation, qualitative reasoning, spatial reasoning and graphics, manufacturing, assembly, process planning, scheduling, numerical analysis, optimization, distributed systems, multi-agent applications, cooperation, cognitive modeling, learning and creativity. AI EDAM is also interested in original, major applications of state-of-the-art knowledge-based techniques to important engineering problems.

收录体裁
投稿指南
投稿模板
参考文献格式
编辑信息
Editorial board
Editor-in Chief

Professor Amaresh Chakrabarti, Centre for Product Design and Manufacturing |Indian Institute of Science |Bangalore 560012|India 
ac123@iisc.ac.in

Associate Editors

Professor Gaetano Cascini, Department of Mechanical Engineering|Politecnico di Milano|Via Lambruschini 15|20158|Milano|Italy| 
gaetano.cascini@polimi.it

Professor Kristina Shea, Department of Mechanical and Process Engineering|ETH Zurich|Tannenstrasse 3, CH-8092 Zurich|Switzerland 
kshea@ethz.ch

Professor Ashutosh Tiwari, Department of Automatic Control and Systems Engineering (ACSE)|University of Sheffield|Sheffield, S1 3JD 
a.tiwari@sheffield.ac.uk

Editorial Board

Professor Alice M. Agogino, University of California, Berkeley, USA 
agogino@berkeley.edu

Professor Frances Brazier, Delft University of Technology, The Netherlands 
f.m.brazier@tudelft.nl

Professor David C. Brown, Worcester Polytechnic Institute, USA 
dcb@cs.wpi.edu

Professor Jonathan Cagan, Carnegie Mellon University, USA 
cagan@cmu.edu

Professor Matthew I Campbell, Oregon State University, USA 
matt.campbell@oregonstate.edu

Professor Per Christiansson, Lund Institute of Technology, Lund University, Sweden 
per@christiansson.biz

Professor Ellen Yi-Luen Do, University of Colorado Boulder, USA 
ellen.do@Colorado.EDU

Professor Alex H.B. Duffy, University of Strathclyde, UK 
alex.duffy@strath.ac.uk

Professor Donal Finn, University College, Dublin, Republic of Ireland 
donal.finn@ucd.ie

Professor John S. Gero, George Mason University, Fairfax, USA 
john@johngero.com

Professor Ashok K. Goel, Georgia Institute of Technology, USA 
goel@cc.gatech.edu

Dr Kazjon Grace, The University of Sydney, Australia 
kazjon.grace@sydney.edu.au

Professor Roderick A. Grupen, University of Massachusetts at Amherst, USA 
grupen@cs.umass.edu

Dr Sean Hanna, University College London, UK 
s.hanna@ucl.ac.uk

Professor Yan Jin, University of Southern California, USA 
yjin@usc.edu

Dr Mark Klein, Massachusetts Institute of Technology, USA 
m_klein@mit.edu

Dr John C. Kunz, Stanford University, USA 
kunz@stanford.edu

Professor Chris McMahon, Technical University of Denmark, Denmark 
chmcm@mek.dtu.dk

Professor Wolfgang Nejdl, Institut für Verteilte Systeme, Hannover, Germany 
nejdl@kbs.uni-hannover.de

Professor Panos Papalambros, University of Michigan, USA 
pyp@umich.edu

Dr H. Van Dyke Parunak, Vector Research Center, Jacobs Technology, USA 
van.parunak@gmail.com

Professor William C. Regli, Institute for System Research, Clark School of Engineering, The University of Maryland at College Park, USA 
regli@umd.edu

Professor Warren Seering, Massachusetts Institute of Technology, USA 
seering@mit.edu

Professor Li Shu, University of Toronto, Canada 
shu@mie.utoronto.ca

Dr Tim Smithers, Independent Research Practitioner| Donostia / San Sebastián| The Basque Country| 
tim.smithers@cantab.net

Professor Ian F.C. Smith, EPFL - Federal Institute of Technology, Switzerland 
ian.smith@epfl.ch

Professor Robert B. Stone, Oregon State University, USA 
rob.stone@oregonstate.edu

Professor Rudi Stouffs, National University of Singapore, Singapore 
stouffs@nus.edu.sg

Professor Markus Stumptner, University of South Australia, Australia 
mst@cs.unisa.edu.au

Professor Tetsuo Tomiyama, Japan Educational Foundation, Japan 
tomiyama.tetsuo@nkz.ac.jp

Professor Kristin Wood, Singapore University of Technology and Design, Singapore 
kristinwood@sutd.edu.sg

我要分享  (欢迎您来完善期刊的资料,分享您的实际投稿经验)
研究领域:
投稿录用情况: 审稿时间:  个月返回审稿结果
本次投稿点评:
提交
down
wechat
bug