Founded in 2002 and publishing quarterly as of 2007, Earthquake Engineering and Engineering Vibration is an international journal sponsored by the Institute of Engineering Mechanics (IEM), China Earthquake Administration, co-sponsored by the Huixian Earthquake Engineering Foundation (China), the US-China Earthquake Engineering Foundation (USA) and the Chinese Association of Earthquake Engineering. It promotes scientific exchange between Chinese and foreign scientists and engineers, to improve the theory and practice of earthquake hazards mitigation, preparedness, and recovery.

To accomplish this purpose, the journal aims to attract a balance of Chinese and international authors by publishing original and invited papers addressing the latest theories and applications of interest to earthquake engineering communities, both in China and other countries. The journal has a special interest in encouraging joint authorship between Chinese and foreign contributors such as that resulting from the PRC - US cooperative research projects.

Chairman:
Prof. XIE Lili, Institute of Engineering Mechanics (IEM), China Earthquake Administration (CEA), China.
Editor-in-Chief (Harbin, China) :
Prof. QI Xiaozhai, Institute of Engineering Mechanics (IEM), China Earthquake Administration (CEA), 9 Xuefu Road, Harbin 150080, China
Editor-in-Chief (Buffalo, USA) :
Prof. George C. LEE, MCEER, Department of Civil Structural and Environmental Engineering, University at Buffalo, State University of New York, Buffalo, NY 14261, USA
Members:
Dimitrios E. BESKOS, University of Patras, Greece
Roger BORCHERDT, U.S. Geological Survey, USA
Fabio CASCIATI, University of Pavia, Italy
Kuo-Chun CHANG, Center for Research on Earthquake Engineering (NCREE), Chinese Taipei
Houqun CHEN, China Institute of Water Resources and Hydropower Research, China
Gian Paolo CIMELLARO, Politecnico di Torino, Italy
Weimin DONG, Risk Management Solutions, Inc., USA
Xiuli DU, Beijing University of Technology, China
Peter FAJFAR, University of Ljubljana, Slovenia
Andre FILIATRAULT, University at Buffalo, State University of New York, USA
George GAZETAS, National Technical University of Athens, Greece
Polat GULKAN, Cankaya University, Turkey
Yuxian HU , Institute of Engineering Mechanics, China Earthquake Adminstration, China
Wilfred D. IWAN, California Institute of Technology, USA
Sudhir JAIN, Indian Institute of Technology, India
Jae Kwan KIM, Seoul National University, Korea
George C. LEE, University at Buffalo, State University of New York, USA
Hongnan LI, Dalian University of Technology, China
Jie LI, Tongji University, China
Zhenpeng LIAO, Institute of Engineering Mechanics, China Earthquake Administration, China
Gao LIN, Dalian University of Technology, China
Shih-Chi LIU, National Science Foundation, USA
Xilin LU , Tongji University, China
Carlos Sousa OLIVEIRA, Technical University of Lisbon, Portugal
Jinping OU, Dalian University of Technology, China
Xiaozhai QI, Institute of Engineering Mechanics, China Earthquake Administration, China
Jiaru QIAN, Tsinghua University, China
M. Saiid SAIIDI, University of Nevada-Reno, USA
Pol SPANOS, Rice University, USA
Billie F. SPENCER, University of Illinois at Urbana-Champaign, USA
Baitao SUN, Institute of Engineering Mechanics, China Earthquake Administration, China
Izuru TAKEWAKI, Kyoto University, Japan
Xiaxin TAO, Harbin Institute of Technology, China
Robert TREMBLAY, Ecole Polytechnique de Montreal, Canada
Akira WADA, Tokyo Institute of Technology, Japan
Yayong WANG, China Academy of Building Research, China
Lili XIE, Institute of Engineering Mechanics, China Earthquake Administration, China
Youlin XU, Hong Kong Polytechnic University, Hong Kong, China
Manabu YOSHIMURA, Tokyo Metropolitan University, Japan
Xiaoming YUAN, Institute of Engineering Mechanics, China Earthquake Administration, China
Chuhan ZHANG, Tsinghua University, China
Minzheng ZHANG, Institute of Engineering Mechanics, China Earthquake Administration, China
Yunfeng ZHANG, University of Maryland, USA
Fulin ZHOU, Guangzhou University, China
Denghua ZHONG, Tianjin University, China