学术论文：
1. Zhang S*. Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics. Materials Reports, 2020 in press. 《材料导报》亮点文章 中国科技期刊卓越行动计划 Highlight Article
2. Xu J, Gao D, Wang X, Zhou X, Zhu B, Qi X, Sekulic D., He P*, Li Z, Lin T, Zhang S*. Joining ZnS ceramics by using PbTiO3 doped PbO-B2O3-ZnO[J]. Journal of Materials Science, 2020, 55(21): 8814–8828. 中科院2区Top期刊（材料科学）
3. Shen L, Li Z*, Feng G, Zhang S*, Zhou Z, He P*. Self-propagating Synthesis joining of Cf/Al composites and TC4 alloy using AgCu filler with Ni-Al-Zr interlayer[J]. Rare Metals, 2020. In press 中国科技期刊卓越行动计划
4. Wang Q, Zhang S*, Liu G, Lin T*, He P*. The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold[J]. Journal of Alloys and Compounds, 2020, 820: 153184. 中科院2区Top期刊（材料科学）
5. Zhang S, Xu S, Gao H, Lu Q, Lin T*, He P*, Geng H*. Characterization of multiple-filled skutterudites with high thermoelectric performance[J]. Journal of Alloys and Compounds, 2020, 814: 152272. 中科院2区Top期刊（材料科学）
6. Zhang S, Zhang X, Lu Q, He P*, Lin T*, Geng H*. Investigation of melt-spinning speed on the property of Yb0.2Ba0.1Al0.1Ga0.1In0.1La0.05Eu0.05Co3.75Fe0.25Sb12 skutterudites[J]. Materials Letters, 2020, 260: 126960.
7. Jin T, Pan Y, Jeon G-J, Yeom H-I, Zhang S, Paik K-W, Park S-H K*. Ultrathin Nanofibrous Membranes Containing Insulating Microbeads for Highly Sensitive Flexible Pressure Sensors[J]. ACS applied materials & interfaces, 2020, 12(11): 13348–13359. 中科院1区Top期刊（材料科学）
8. Xie C, Ding R*, Wang X, Hu C, Yan J, Zhang W, Wang Y, Qu Y, Zhang S, He P, Wang Z*. A disulfiram-loaded electrospun poly(vinylidene fluoride) nanofibrous scaffold for cancer treatment[J]. Nanotechnology, 2020, 31(11): 115101. 中科院2区Top期刊（工程技术）
9. Song L, Yoon D-J, Zhang S, Paik K-W*. A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine Pitch Flex-on-Flex (FOF) Interconnection[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(3): 1–1. IEEE TCPMT受欢迎文章 (Popular Article March 2020)
10. Du Q, Wang X*, Zhang S, Long W, Zhang L, Jiu Y, Yang C, Zhang Y, Yang J. Research status on surface metallization of diamond[J]. Materials Research Express, 2020, 6(12): 122005. Topical Review
11. Li S, Wang X*, Liu Z, Jiu Y, Zhang S, Geng J, Chen X, Wu S, He P, Long W. Corrosion behavior of Sn-based lead-free solder alloys: a review[J]. Journal of Materials Science: Materials in Electronics, 2020.
12. Zhang S, Liu X, Lin T*, He P*. A method to fabricate uniform silver nanowires transparent electrode using Meyer rod coating and dynamic heating[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(20): 18702–18709.
13. Zhang S*, Zhu B, Zhou X, Wang X, Lin T*, He P*, Paik K W. Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(19): 17972–17985.
14. Xu S, Qi X, Xu X, Wang X, Yang Z, Zhang S*, Lin T*, He P*. Effects of electroless nickel plating method for low temperature joining ZnS ceramics[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(16): 15236–15249.
15. Zhang S, Xu X, Lin T, He P*. Recent advances in nano-materials for packaging of electronic devices[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(15): 13855–13868.
16. Zhang S*, Qi X, Yang M, Cao Y, Lin T, He P, Paik K W. A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(10): 9171–9183.
17. 张墅野，徐翔宇，林铁松，何鹏. 熔体电纺在加工生物材料方面的应用[J], 中国医疗器械信息，2019
18. 张墅野，许孙武，曹洋，林铁松，何鹏. 新型导电胶中铜粉表面化学镀纳米银颗粒的导电机理研究[J]. 焊接, 2019 (2): 1.
19. Zhao D, Huang W C, Guo N, Zhang S, Xue C, Mao X*. Two-step separation of chitin from shrimp shells using citric acid and deep eutectic solvents with the assistance of microwave[J]. Polymers, 2019, 11(3): 409.
20. Wang J, Zhang S, Shi Z, Jiu J, Wu C, Sugahara T, Nagao S, Suganuma K, He P*. Nanoridge patterns on polymeric film by a photodegradation copying method for metallic nanowire networks[J]. RSC Advances, 2018, 8(71): 40740–40747.
21. Wang J, Jiu J, Zhang S, Sugahara T, Nagao S, Suganuma K, He P*. The comprehensive effects of visible light irradiation on silver nanowire transparent electrode[J]. Nanotechnology, 2018, 29(43): 435701. 中科院2区Top期刊（工程技术）
22. Yang M, Kim S W, Zhang S, Park D Y, Lee C W, Ko Y H, Yang H, Xiao Y, Chen G, Li M. Facile and highly efficient fabrication of robust Ag nanowire-elastomer composite electrodes with tailored electrical properties[J]. Journal of Materials Chemistry C, 2018, 6(27): 7207–7218. Inside backcover
23. Jin M L, Park S, Kim J-S, Kwon S H, Zhang S, Yoo M S, Jang S, Koh H-J, Cho S-Y, Kim S Y, Ahn C W, Cho K, Lee S G, Kim D H, Jung H-T. Sensors: An Ultrastable Ionic Chemiresistor Skin with an Intrinsically Stretchable Polymer Electrolyte (Adv. Mater. 20/2018)[J]. Advanced Materials, 2018, 30(20): 1870140. Frontispiece
24. Jin M L, Park S, Kim J S, Kwon S H, Zhang S, Yoo M S, Jang S, Koh H J, Cho S Y, Kim S Y, Ahn C W, Cho K, Lee S G, Kim D H, Jung H T. An Ultrastable Ionic Chemiresistor Skin with an Intrinsically Stretchable Polymer Electrolyte[J]. Advanced Materials, 2018, 30(20): 1706851. 中科院1区Top期刊（材料科学）
25. Zhang S, Yang M, Wu Y, Du J, Lin T, He P, Huang M, Paik K W*. A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250°C Bonding Temperature[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(3): 383–391.
26. Zhang S*, Yang M, Jin M, Huang W C, Lin T, He P, Lin P, Paik K W. Mechanism of solder joint cracks in anisotropic conductive films bonding and solutions: Delaying hot-bar lift-up time and adding silica fillers[J]. Metals, 2018, 8(1): 42.
27. Zhang S, Lin T, He P, Zhao N, Huang M, Paik K W. A study on the bonding conditions and nonconductive filler contents on cationic epoxy-based Sn-58Bi solder ACFs joints for reliable flex-on-board applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(12): 2087–2094.
28. Pan Y, Song L, Zhang S, Cai X, Paik K W*. Effects of Polymer Conductive Particle Contents on the Electrical Performance and Reliability of 50- μm Pitch Flex-on-Flex Assemblies Using Anisotropic Conductive Films[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(11): 1759–1764.
29. Zhang S*, Lin T, He P, Paik K W. Effects of acrylic adhesives property and optimized bonding parameters on Sn–58Bi solder joint morphology for flex-on-board assembly[J]. Microelectronics Reliability, 2017, 78: 181–189.
30. Kim J, Kim J, Song S, Zhang S, Cha J, Kim K, Yoon H, Jung Y, Paik K W, Jeon S*. Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake[J]. Carbon, 2017, 113: 379–386. 中科院1区Top期刊（材料科学）
31. Yang M, Ko Y H, Bang J, Kim T S, Lee C W, Zhang S, Li M. Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5grains on Cu substrates[J]. Journal of Alloys and Compounds, 2017, 701: 533–541. 中科院2区Top期刊（材料科学）
32. Kim T W, Lee T I, Pan Y, Kim W, Zhang S, Kim T S, Paik K W*. Effect of nanofiber orientation on nanofiber solder anisotropic conductive films joint properties and bending reliability of flex-on-flex assembly[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(9): 1317–1329.
33. Zhang S, Park J H, Paik K W. Joint morphologies and failure mechanisms of Anisotropic Conductive Films (ACFs) during a power handling capability test for flex-on-board applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(12): 1820–1826.
34. Park J H, Kim T W, Zhang S, Paik K W*. Effects of polymer ball size and polyvinylidene fluoride nanofiber on the ball capture rate for 100-μm -pitch flex-on-flex assembly using anisotropic conductive films and ultrasonic bonding method[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(7): 1129–1136.
35. Zhang S, Paik K W*. A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(2): 216–223.
36. Kim Y-S, Zhang S, Paik K-W*. Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding[J]. Journal of the Microelectronics and Packaging Society, 2015, 22(1): 35–41.
37. Zhang S, Kim S H, Kim T W, Kim Y S, Paik K W. A study on the solder ball size and content effects of solder ACFs for flex-on-board assembly applications using ultrasonic bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(1): 9–14.
会议论文：
1. S.Zhang,M.Yang,T.Lin,P.He,K.Paik: A Study on the Optimization of O2 Plasma Parameters on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC); Las Vegas, NV, USA, May 28-31, 2019, Interactive presentation. 领域顶级国际会议 EI检索
2. S.Zhang,T.Lin,P.He,J.Park,G.Park,H.Song,J.Kim,K.Paik: A Study on the High-Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC); San Diego, USA, 05/2018, Interactive presentation. 领域顶级国际会议 EI检索
3. S.Zhang and K.Paik*, "The Effect of Polymer Rebound on SnBi58 Solder ACFs Joints Cracks during a Thermo-Compression Bonding," 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2017, pp. 2047-2053. Interactive presentation. 领域顶级国际会议 EI检索
4. S.Zhang and K.Paik*: Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability. 2016 IEEE 66th Electronic Components and Technology Conference (ECTC); Florida USA, 05/2017, Oral presentation. 领域顶级国际会议 EI检索
5. S.Zhang,X.Liu,T.Lin,P.He: Atomic Layer of ZnO Deposition on Ag Nanowires for Novel Electrical Applications. the 19th IEEE International Conference on Nanotechnology (IEEE-NANO 2019), July 22-26, 2019, The Parisian Macao, Macau SAR, China, Oral presentation. 领域顶级国际会议 EI检索
6. S.Zhang,Y.Zhang,T.Lin,P.He: Pulsed Laser Deposited MoS2 for the Fabrication of MoS2/Graphene Photodetector. the 19th IEEE International Conference on Nanotechnology (IEEE-NANO 2019), July 22-26, 2019, The Parisian Macao, Macau SAR, China, Poster presentation. 领域顶级国际会议 EI检索
7. S.Zhang, M.Yang, Y. Zhang, Q. Wang, T. Lin, P. He and K. Paik, "A Study on the Preparation and Properties of Conductive Adhesives Filled with Multi-component Fillers for Green Packaging" 2018 IEEE 20th International Conference on Electronics Materials and Packaging (EMAP), HKUST, HK, 2018, Oral presentation, including poster. 领域顶级国际会议 EI检索
8. S.Zhang and P.He*: 3D printed magnetic hydrogels for biomedical applications, 2019 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 4-8 August 2019, Zhenjiang, China, Invited Oral Presentation
9. P.He and S.Zhang*: Enhanced Mechanical and Transparent Properties of Conductive Hydrogels for Stretchable Application, 2019 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 4-8 August 2019, Zhenjiang, China, Invited Oral Presentation
10. S.Zhang and P.He*: Nanoridge patterns on polymeric film by photocopying metallic nanowire networks, The 8th IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, Hangzhou, China, 13-17 August, 2018, Invited Oral Presentation
11. P.He and S.Zhang*: Visible light irradiation of silver nanowire transparent electrode: a double-edged sword, The 8th IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, Hangzhou, China, 13-17 August, 2018, Invited Oral Presentation
12. S.Zhang, M.Yang, T.Lin, P.He and K.Paik,"Wettability and Mechanical Strength of Sn-3Ag-0.5Cu solders on Ni plated ZnS Ceramics" 2019 21th International Conference on Electronics Materials and Packaging (EMAP), Busan, Korea, 2019, Oral presentation.
13. S.Zhang, K.Paik*: Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications. The 15th International Symposium on Microelectronics and Packaging, KINTEX, Seoul, Korea, 2016, Oral presentation.
14. S.Zhang, K.Paik*: Mechanism of solder crack of Anisotropic Conductive Films (ACFs) joint caused by Ultrasonic Horn Releasing Time during Cooling Process Using Thermomechanical Analysis. The 14th International Symposium on Microelectronics and Packaging, KINTEX, Ilsan, Korea, 2015, Poster
15. Y.Ming,D.Park,C.Lee,Y.Ko*,S.Zhang*,T.Lin,P.He*: Fabrication of Ag nanowire-elastomer composite electrodes with tailored electrical properties by using a 3D mask. International Conference on flexible electronics, Hangzhou, China, 2018, Best Poster Award 首届柔性电子大会最佳海报奖
16. S.Zhang,Z.Shi,C.Yu,T.Lin,P.He,W.Long,L.Bao,J.Ma: A Study of PEDOT:PSS Layer on the Enhanced Reliability of Silver Nanowires for Transparent Electrodes, Shenyang, China, 2018, Oral presentation
17. S.Zhang, Y.Zhang, Q.Wang,T.Lin,P.He,W.Long,L.Bao,J.Ma: Preparation and Properties of Two-component Filler Filled Conductive Adhesive, Shenyang, China, 2018
18. S.Xu,S.Zhang,Y.Cao,T.Lin,P.He,W.Long,L.Bao,J.Ma: A Study on the Conductive Mechanism of Silver Coated Copper Powders for Conductive Adhesives, Shenyang, China, 2018
19. S.Xu,Q.Lu,H.Geng,T.Lin,P.He,S.Zhang*: A Study on the Annealing and Melt-spinning on the Enhancement of Thermoelectric Properties of Multiple-filled Skutterudites Followed by Hot Pressing, Wiley Soochow University International Conference on Energy Materials, Suzhou, China, 2018, 21-23 December.