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Scaling analysis of electrodeposited copper and the influence of a modified polysaccharide on surface roughness
Hydrometallurgy ( IF 4.8 ) Pub Date : 2024-10-02 , DOI: 10.1016/j.hydromet.2024.106405 Jeffrey L. Shepherd, Karl Torman, Michael S. Moats, Joseph Bauer, Eduard Guerra
Hydrometallurgy ( IF 4.8 ) Pub Date : 2024-10-02 , DOI: 10.1016/j.hydromet.2024.106405 Jeffrey L. Shepherd, Karl Torman, Michael S. Moats, Joseph Bauer, Eduard Guerra
The influence of a commercially available modified polysaccharide (HydroStar®, Chemstar Chemical Products) on the roughness of short-term and small-scale copper electrodeposits was investigated using Atomic Force Microscopy (AFM), linear scan profilometry and scaling analysis. Copper was deposited on a 316L stainless steel cathode at 40 °C and 300 A m−2 from an electrolyte containing 40 g L−1 Cu2+ , 170 g L−1 H2 SO4 , 1.5 g L−1 Fe3+ , 15 mg L−1 Cl− and either 0, 10, 50 or 100 mg L−1 of HydroStar. Copper deposits produced between 15 and 25 min were imaged using AFM and 2D linear scan profilometry was used to gather surface features of copper samples produced in the range of 120 and 240 min. Scaling analysis was applied to quantify the surface characteristics of limiting roughness (δ) and critical length (LC ) from which δ/LC was computed and related to the aspect ratio of surface features. All copper deposits showed a general rise in δ and LC with deposition time but the growth rates decreased when HydroStar was included in the electrolyte indicating that the additive lowers the vertical height of surface features as well as their widths. Furthermore, copper deposits were more consistently produced in the presence of HydroStar and, for a given value of limiting roughness, had surface features with wider base than those created in the absence of the additive. The results show that the modified polysaccharide acts to create smooth copper deposits by generating surface features with lower aspect ratios.
中文翻译:
电沉积铜的结垢分析以及改性多糖对表面粗糙度的影响
使用原子力显微镜 (AFM)、线性扫描轮廓测定法和缩放分析研究了市售改性多糖(HydroStar®、Chemstar Chemical Products)对短期和小规模铜电沉积粗糙度的影响。铜在 40 °C 和 300 A m-2 的电解质下沉积在 316L 不锈钢阴极上,电解质中含有 40 g L-1 Cu2+、170 g L-1 H2SO4、1.5 g L-1 Fe3+、15 mg L-1 Cl-和 0、10、50 或 100 mg L-1 的 HydroStar。使用 AFM 对 15 到 25 分钟之间产生的铜沉积物进行成像,并使用 2D 线性扫描轮廓测定法收集在 120 到 240 分钟范围内产生的铜样品的表面特征。应用缩放分析来量化极限粗糙度 (δ) 和临界长度 (LC) 的表面特性,从中计算 δ/LC 并与表面特征的纵横比相关。所有铜沉积物的 δ 和 LC 均随沉积时间而普遍增加,但当电解质中加入 HydroStar 时,生长速率降低,这表明添加剂降低了表面特征的垂直高度及其宽度。此外,在 HydroStar 存在下,铜矿床的产生更加一致,并且对于给定的极限粗糙度值,与在没有添加剂的情况下产生的表面特征相比,铜矿床的表面特征具有更宽的基底。结果表明,改性多糖通过生成具有较低纵横比的表面特征来形成光滑的铜沉积物。
更新日期:2024-10-02
中文翻译:
电沉积铜的结垢分析以及改性多糖对表面粗糙度的影响
使用原子力显微镜 (AFM)、线性扫描轮廓测定法和缩放分析研究了市售改性多糖(HydroStar®、Chemstar Chemical Products)对短期和小规模铜电沉积粗糙度的影响。铜在 40 °C 和 300 A m-2 的电解质下沉积在 316L 不锈钢阴极上,电解质中含有 40 g L-1 Cu2+、170 g L-1 H2SO4、1.5 g L-1 Fe3+、15 mg L-1 Cl-和 0、10、50 或 100 mg L-1 的 HydroStar。使用 AFM 对 15 到 25 分钟之间产生的铜沉积物进行成像,并使用 2D 线性扫描轮廓测定法收集在 120 到 240 分钟范围内产生的铜样品的表面特征。应用缩放分析来量化极限粗糙度 (δ) 和临界长度 (LC) 的表面特性,从中计算 δ/LC 并与表面特征的纵横比相关。所有铜沉积物的 δ 和 LC 均随沉积时间而普遍增加,但当电解质中加入 HydroStar 时,生长速率降低,这表明添加剂降低了表面特征的垂直高度及其宽度。此外,在 HydroStar 存在下,铜矿床的产生更加一致,并且对于给定的极限粗糙度值,与在没有添加剂的情况下产生的表面特征相比,铜矿床的表面特征具有更宽的基底。结果表明,改性多糖通过生成具有较低纵横比的表面特征来形成光滑的铜沉积物。