The state-of-the-art technology of fabricating printed copper electronics is focussed largely on thermal sintering restricting transition towards heat sensitive flexible substrates. Herein we report a pioneering technology which eliminates the need for conventional sintering. Biopolymer-stabilised copper particles are prepared such that they can be compressed at room temperature to generate air-stable films with very low resistivities (2.05 – 2.33 × 10⁻⁸ Ω m at 20 °C). A linear positive correlation of resistivity with temperature verifies excellent metallic character and electron microscopy confirms the formation of films with low porosity (< 4.6%). An aqueous ink formulation is used to fabricate conductive patterns on filter paper, first using a fountain/dip pen and then printing to deposit more defined patterns (R < 2 Ω). The remarkable conductivity and stability of the films, coupled with the sustainability of the approach could precipitate a paradigm-shift in the use of copper inks for printable electronics.

制造印刷铜电子器件的最先进技术主要集中在热烧结上，限制了向热敏柔性基板的过渡。在此，我们报告了一项无需传统烧结的开创性技术。生物聚合物稳定的铜颗粒可在室温下压缩，生成电阻率极低（20 °C 时为 2.05 – 2.33 × 10 ^-8 Ω m）的空气稳定薄膜。电阻率与温度的线性正相关验证了优异的金属特性，电子显微镜证实了低孔隙率 (< 4.6%) 薄膜的形成。水性油墨配方用于在滤纸上制造导电图案，首先使用钢笔/蘸水笔，然后印刷以沉积更明确的图案（R < 2 Ω）。薄膜卓越的导电性和稳定性，加上该方法的可持续性，可能会促成铜墨水在可印刷电子产品中使用的范式转变。