Epoxy resin (EP) adhesive is an essential thermosetting polymer used in coating. A curing agent is typically added to the epoxy system during the curing process in order to obtain a three-dimensional network structure. Therefore, existing commercial adhesives are two-component systems containing EP and the curing agent separately. However, the curing agent is prone to oxidation in air, and two-component systems reveal rapid viscosity changes and poor storage stability. On the other hand, microcapsules possess special encapsulation properties that can isolate the curing agent from the air. Mixing EP and microencapsulated curing agent directly results in a one-component epoxy resin adhesive that is easy to store and use. In this paper, methyl ethyl disubstituted diamine (DMEDDM), namely a novel curing agent was microencapsulated adopting solvent evaporation method with thermoplastic resin polyetherimide (PEI) as the shell material. It is found that the microencapsulated DMEDDM (Mic-DMEDDM) reveals smooth and compact spherical appearance with mean particle size about 13.65 µm. Moreover, the encapsulation efficiency of Mic-DMEDDM can reach up to 70%. After recycling the residual water phase seven times, the surface-regularized Mic-DMEDDM can still be obtained. Compared with two-component epoxy adhesive, the Mic-DMEDDM in one-component epoxy adhesive effectively extends the storage period to 43 days at 45 ℃. It is expected to find wide applications in coatings, electronic packaging materials and composite materials.

环氧树脂（EP）粘合剂是涂料中必不可少的热固性聚合物。通常在固化过程中将固化剂添加到环氧树脂体系中以获得三维网络结构。因此，现有的商业粘合剂是分别含有EP和固化剂的双组分体系。但固化剂在空气中容易氧化，双组分体系粘度变化快，储存稳定性差。另一方面，微胶囊具有特殊的封装性能，可以将固化剂与空气隔离。将EP与微胶囊固化剂混合直接形成单组份环氧树脂粘合剂，易于储存和使用。本文以热塑性树脂聚醚酰亚胺（PEI）为壳材料，采用溶剂蒸发法对新型固化剂甲基乙基二取代二胺（DMEDDM）进行微胶囊化。结果发现，微胶囊化的DMEDDM（Mic-DMEDDM）呈现出光滑致密的球形外观，平均粒径约为13.65 µm。此外，Mic-DMEDDM的封装效率可达70%。将残余水相循环7次后，仍可得到表面规整的Mic-DMEDDM。与双组份环氧胶相比，单组份环氧胶中的Mic-DMEDDM有效地将45℃下的储存期延长至43天。有望在涂料、电子封装材料、复合材料等领域得到广泛应用。