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A promising low-dielectric-constant material with good comprehensive performance upon heating
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2023-02-21 , DOI: 10.1002/app.53769 Yingyi Ma 1 , Zian He 1 , Yuhang Han 1
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2023-02-21 , DOI: 10.1002/app.53769 Yingyi Ma 1 , Zian He 1 , Yuhang Han 1
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The dielectric and other properties of low-dielectric-constant materials after heating are crucial to their performance and use, but rarely studied. In this article, sandwich-type porous polyimide (PI) film in which porous structures located on both upper and lower surfaces of flat PI film was prepared through the simple, low-cost and green microemulsion method. The porous structures were preserved after heating due to the usage of thermally stable fluorine-contained PI (FPI) and PI as skeleton and substrate of the porous structure, respectively, but with the increase of pore size because of the removal of thermally unstable surfactant on the inner surface of the pores. More importantly, 2.89%–5.57% of reductions in the dielectric constant with the maintenance of low dielectric loss and water absorption and high mechanical strength were observed after heating. Therefore, the low dielectric properties of heated films were well preserved upon high humidity treatment. Moreover, the structure and properties of the heated films could be adjusted via controlling the parameters in the microemuslion method. These excellent properties after the high-temperature treatment facilitate the application of the sandwich-type porous PI film as dielectric materials in high-temperature environment.
中文翻译：
一种具有良好加热综合性能的有前途的低介电常数材料
加热后低介电常数材料的介电和其他特性对其性能和使用至关重要，但很少有人研究。在本文中，通过简单、低成本和绿色的微乳液方法制备了夹层型多孔聚酰亚胺 (PI) 薄膜，其中多孔结构位于平面 PI 薄膜的上下表面。由于使用热稳定的含氟 PI (FPI) 和 PI 分别作为多孔结构的骨架和基质，加热后多孔结构得以保留，但由于表面热不稳定的表面活性剂的去除，孔径增加气孔的内表面。更重要的是，2.89%–5。加热后观察到介电常数降低 57%，同时保持低介电损耗和吸水率以及高机械强度。因此，加热薄膜的低介电性能在高湿度处理后得到很好的保持。此外，可以通过控制微乳液法中的参数来调整加热薄膜的结构和性能。高温处理后的这些优异性能促进了夹层式多孔PI薄膜在高温环境下作为介电材料的应用。
更新日期：2023-02-21
中文翻译：
一种具有良好加热综合性能的有前途的低介电常数材料
加热后低介电常数材料的介电和其他特性对其性能和使用至关重要，但很少有人研究。在本文中，通过简单、低成本和绿色的微乳液方法制备了夹层型多孔聚酰亚胺 (PI) 薄膜，其中多孔结构位于平面 PI 薄膜的上下表面。由于使用热稳定的含氟 PI (FPI) 和 PI 分别作为多孔结构的骨架和基质，加热后多孔结构得以保留，但由于表面热不稳定的表面活性剂的去除，孔径增加气孔的内表面。更重要的是，2.89%–5。加热后观察到介电常数降低 57%，同时保持低介电损耗和吸水率以及高机械强度。因此，加热薄膜的低介电性能在高湿度处理后得到很好的保持。此外，可以通过控制微乳液法中的参数来调整加热薄膜的结构和性能。高温处理后的这些优异性能促进了夹层式多孔PI薄膜在高温环境下作为介电材料的应用。
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