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Thiol‐terminated hyperbranched polymer for DLP 3D printing: Performance evaluation of a low shrinkage photosensitive resin
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2021-02-03 , DOI: 10.1002/app.50525 Songyi Li 1 , Yihua Cui 1 , Jingjing Li 1
Journal of Applied Polymer Science ( IF 2.7 ) Pub Date : 2021-02-03 , DOI: 10.1002/app.50525 Songyi Li 1 , Yihua Cui 1 , Jingjing Li 1
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In order to lower the volume shrinkage of the DLP 3D printing photosensitive resins during printing, a thiol‐terminated hyperbranched polymer (T‐HBP) was synthesized and introduced into the bisphenol A epoxy acrylate (EA) based photosensitive resin system. The obtained T‐HBP was characterized by FTIR and 1H NMR spectra, and the grafting rate of sulfhydryl was determined. The mechanical properties of the photosensitive resins were measured by tensile and impact strength measurement. The glass transition temperature of the photosensitive resins was analyzed by DSC and the impact fracture surface was observed by SEM. T‐HBP exhibited a much lower viscosity than its linear counterparts, and the addition of thiol improved the curing speed of the photosensitive resins. When the amount of T‐HBP added was 20 wt%, the shrinkage of the photosensitive resins was reduced by about 45.5% and the impact strength increased by 33.9% compared with the control. The macromolecular spherical structure of T‐HBP effectively reduced the functional group density of the photosensitive resins. In addition, the thiol‐acrylate photopolymerization introduced by T‐HBP further reduced the volume shrinkage of the photosensitive resins.
中文翻译：
用于DLP 3D打印的巯基封端的超支化聚合物：低收缩光敏树脂的性能评估
为了降低DLP 3D打印感光树脂在打印过程中的体积收缩率，合成了硫醇封端的超支化聚合物（T-HBP），并将其引入基于双酚A环氧丙烯酸酯（EA）的感光树脂体系中。获得的T-HBP的特征在于FTIR和11 H NMR谱和巯基的接枝率被确定。通过拉伸和冲击强度测量来测量光敏树脂的机械性能。用DSC分析光敏树脂的玻璃化转变温度，并用SEM观察冲击断裂表面。T-HBP的粘度远低于其线性对应物，而硫醇的加入提高了光敏树脂的固化速度。当T-HBP的添加量为20 wt％时，与对照组相比，光敏树脂的收缩率降低了约45.5％，冲击强度提高了33.9％。T-HBP的大分子球形结构有效降低了光敏树脂的官能团密度。此外，
更新日期：2021-03-02
中文翻译：
用于DLP 3D打印的巯基封端的超支化聚合物：低收缩光敏树脂的性能评估
为了降低DLP 3D打印感光树脂在打印过程中的体积收缩率，合成了硫醇封端的超支化聚合物（T-HBP），并将其引入基于双酚A环氧丙烯酸酯（EA）的感光树脂体系中。获得的T-HBP的特征在于FTIR和11 H NMR谱和巯基的接枝率被确定。通过拉伸和冲击强度测量来测量光敏树脂的机械性能。用DSC分析光敏树脂的玻璃化转变温度，并用SEM观察冲击断裂表面。T-HBP的粘度远低于其线性对应物，而硫醇的加入提高了光敏树脂的固化速度。当T-HBP的添加量为20 wt％时，与对照组相比，光敏树脂的收缩率降低了约45.5％，冲击强度提高了33.9％。T-HBP的大分子球形结构有效降低了光敏树脂的官能团密度。此外，
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