A Phthalonitrile Resin with a Low Melting Point and High Storage Modulus Containing High‐Density Aromatic Ether Bonds,ChemistrySelect

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A Phthalonitrile Resin with a Low Melting Point and High Storage Modulus Containing High‐Density Aromatic Ether Bonds
ChemistrySelect ( IF 1.9 ) Pub Date : 2020-10-16 , DOI: 10.1002/slct.202002755
Xiaoyu Shi ₁ , Shengnan Bai ₁ , Puguang Ji ₂ , Kimiyoshi Naito ₃ , Xiaoyan Yu ₁ , Qingxin Zhang _{1,

2}

Affiliation

A low melting point phthalonitrile monomer named 4,4′‐((((((2‐cyano‐1,3‐phenylene)bis(oxy))bis(4,1‐phenylene))bis(oxy))bis(4,1‐phenylene))bis(oxy))diphthalonitrile (BOPN), was synthesized by nucleophilic substitution of 4,4′‐oxydiphenol with 2,6‐dichlorobenzonitrile. The BOPN resin containing high‐density aromatic ether bonds were prepared via bulk addition polymerization. Two kinds of polymers were prepared from BOPN monomer by using 4‐(aminophenoxy)phthalonitrile (APPH) as the curing agent under different curing procedures. The chemical structure of the monomer was determined by Nuclear Magnetic Resonance spectroscopy (NMR) and Fourier Transform Infrared spectroscopy (FTIR). Dynamic Mechanical Analysis (DMA) demonstrated that the storage modulus of the resin at room temperature was 3712 MPa and the glass transition temperature was above 400 °C. Differential Scanning Calorimetric (DSC) analysis and rheological test indicated that the melting point and processing window of the monomer were 92 °C and 118 °C, respectively. The temperature for 95 % weight retention of the polymer in air was 529 °C.

中文翻译：

具有高密度芳族醚键的低熔点，高存储模量的邻苯二甲腈树脂

一种低熔点邻苯二甲腈单体，称为4,4'-（（（（（（（2-氰基-1,3-亚苯基）双（氧））双（4,1-亚苯基））双（氧））双（4 （1,1-亚苯基））双（氧基））二邻苯二甲腈（BOPN）是通过2,6-二氯苄腈的亲核取代4,4'-氧基二苯酚合成的。通过本体加成聚合反应制备了含有高密度芳族醚键的BOPN树脂。以4-（氨基苯氧基）邻苯二甲腈（APPH）为固化剂，在不同的固化步骤下，由BOPN单体制备出两种聚合物。单体的化学结构通过核磁共振波谱（NMR）和傅里叶变换红外光谱（FTIR）确定。动态力学分析（DMA）表明，该树脂在室温下的储能模量为3712MPa，并且玻璃化转变温度高于400℃。差示扫描量热（DSC）分析和流变测试表明，单体的熔点和加工窗口分别为92℃和118℃。聚合物在空气中保持95％重量的温度为529°C。

更新日期：2020-10-17

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