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Soldering & Surface Mount Technology
基本信息
期刊名称 | Soldering & Surface Mount Technology SOLDER SURF MT TECH |
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期刊ISSN | 0954-0911 |
期刊官方网站 | https://www.emerald.com/insight/publication/issn/0954-0911 |
是否OA | No |
出版商 | Emerald Group Publishing Ltd. |
出版周期 | Quarterly |
文章处理费 | 登录后查看 |
始发年份 | |
年文章数 | 22 |
最新影响因子 | 1.7(2023) scijournal影响因子 greensci影响因子 |
中科院SCI期刊分区
大类学科 | 小类学科 | Top | 综述 |
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工程技术4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区 | 否 | 否 |
ENGINEERING, MANUFACTURING 工程:制造4区 | |||
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合4区 | |||
METALLURGY & METALLURGICAL ENGINEERING 冶金工程3区 |
CiteScore
CiteScore排名 | CiteScore | SJR | SNIP | ||
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学科 | 排名 | 百分位 | 4.1 | 0.365 | 0.922 |
Engineering Electrical and Electronic Engineering |
316/797 | 60% |
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Physics and Astronomy Condensed Matter Physics |
175/434 | 59% |
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Materials Science General Materials Science |
227/463 | 51% |
补充信息
自引率 | 11.8% |
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H-index | 28 |
SCI收录状况 |
Science Citation Index Expanded |
官方审稿时间 | 登录后查看 |
网友分享审稿时间 | 数据统计中,敬请期待。 |
接受率 | 登录后查看 |
PubMed Central (PMC) | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0954-0911%5BISSN%5D |
投稿指南
期刊投稿网址 | |
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收稿范围 | Soldering & Surface Mount Technology (SSMT) seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are: Soldering science and technology Novel soldering processes and new solder alloys Surface mount technology (SMT) Surface mount assembly Advanced packaging technologies and 3D interconnects Flip chip/BGA/SiP/TSV Novel substrates and embedded components Solderable finishes and coatings Screen printing Conductive adhesives and conformal coatings Reliability Quality control Inspection and testing Rework and repair Environmental aspects |
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