安荣 - 哈尔滨工业大学 - 医学与健康学院

个人简介

主要从事高可靠电子封装设计理论与技术研究。面向航天、航空、医疗、军事领域新一代电子装备对高可靠长寿命高质量电子器件组件的重大需求，综合利用先进组织性能表征方法、健壮性设计方法、第一性原理计算到数字孪生的模拟仿真方法，从材料、结构、性能和制造四个方面，研究高性能关键电子元器件封装组装的失效机理、失效物理模型、失效抑制技术、以及可靠性设计理论与优化技术。主持国家部委预研专项、国家部委技术基础科研项目、某军某部延寿工程项目等纵向项目9项，主持与中国航天科技集团、中国电子科技集团、中国工程物理研究院、银河航天等多家研究所和企业的横向项目14项。在Acta Materialia、Small等领域顶级期刊发表62篇学术论文，获得6个授权发明专利。获得18th International Conference on Electronic Packaging的Outstanding Paper Award，8th International Conference on Electronics Packaging Technology的NXP Semiconductors Best Paper Award，6th International Conference on Electronics Packaging Technology的Philips Best Paper Award。获得中国机械工业科学技术奖二等奖《面向MEMS立体封装和组装微锡球激光键合工艺及设备》，黑龙江省高校科学技术奖一等奖《微连接技术基础及可靠性研究》，黑龙江省教育教学成果奖二等奖《电子封装技术新专业建设的研究与实践》，哈尔滨工业大学教育教学成果奖一等奖《电子封装技术专业课程体系建设的研究与实践》。担任SCI国际期刊《Metals》（二区）客座编辑、新时代工匠学院（电气互联）培训专家等学术职务。2017年作为组委会秘书和可靠性分会场主席，与电子学会、中国科学院微电子所和IEEE-CMPT合作，成功组织和举办了第十八届电子封装技术国际会议，有600余位国内外专家参加了会议。在高端芯片面临国外封锁、片上集成电路技术迭代空间日趋饱和的大趋势下，高可靠电子封装设计理论与技术是，在以新概念高性能医疗器件为代表的复杂环境高端应用领域，实现高密度三维异构集成的共性基础和关键技术。它对通过先进电子封装新赛道另辟蹊径延续摩尔定律具有重要的科学价值和现实意义。该研究方向，作为典型的理工医学科交叉的案例，从人才培养、课程建设、科研创新各方面，将大大促进材料科学与工程学科与生物医学工程学科以及其他学科的融拓发展。工作经历 2022.12-至今：哈尔滨工业大学医学与健康学院，教授、纳米医学与药物研究中心党支部书记兼副主任 2021.10-2022.11：哈尔滨工业大学医学与健康学院，副教授、纳米医学与药物研究中心党支部书记兼副主任 2016.12-2021.10：哈尔滨工业大学交叉科学研究中心，副教授 2009.12-2016.12：哈尔滨工业大学基础与交叉科学研究院，讲师 2009.01-2012.03：哈尔滨工业大学化工学院，博士后教育经历 2004.09-2008.07：哈尔滨工业大学，材料加工工程，博士 2002.09-2004.07：哈尔滨工业大学，材料加工工程，硕士 1998.09-2002.07：哈尔滨工业大学，材料成型及控制，学士

研究领域

电子封装、组装、装联可靠性柔性电子封装及柔性互联含能薄膜外场诱导限域反应及应用

近期论文

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Ji, Xiaoliang, Rong An, Wei Zhou, Yiping Xia, Fu Guo, and Chunqing Wang. “Anisotropy of Hardness and Impression Morphology in Body-Centered Tetragonal Tin (Sn) at Cryogenic Temperature and Room Temperature.” Journal of Materials Science: Materials in Electronics 34, no. 4 (2023): 325. https://doi.org/10.1007/s10854-022-09757-7. Yin, Qianxing, Guoqing Chen, Xi Shu, Binggang Zhang, Chun Li, Zhibo Dong, Jian Cao, Rong An, and Yongxian Huang. “Analysis of Interaction between Dislocation and Interface of Aluminum Matrix/Second Phase from Electronic Behavior.” Journal of Materials Science & Technology 136 (2023): 78–90. https://doi.org/10.1016/j.jmst.2022.07.020. Zhao, Xiangxi, Wei Zhang, Chunqing Wang, Rong An, Wei Liu, and Chunjin Hang. “Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder.” Journal of Electronic Materials 52, no. 1 (2023): 471–76. https://doi.org/10.1007/s11664-022-10013-1. 张贺, 冯佳运, 丛森, 王尚, 安荣, 吴朗, and 田艳红. “62Sn36Pb2Ag组装焊点长期贮存界面化合物生长动力学及寿命预测.” 工程科学学报 45, no. 3 (March 1, 2023): 400–406. https://doi.org/10.13374/j.issn2095-9389.2021.11.14.002. An, Rong, Xiguang Zhang, Jingman Shen, Wanyu Jiang, Xunchun Wang, Wei Zhang, Wei Liu, Yanhong Tian, and Chunqing Wang. “Physics-of-Degradation-Based Life Prediction of Solder Interconnects of Long-Life Solar Arrays in Low-Earth Orbit.” Solar Energy 248 (2022): 196–209. https://doi.org/10.1016/j.solener.2022.11.016. Ji, Xiaoliang, Rong An, Wei Zhou, Ying Zhong, Fu Guo, and Chunqing Wang. “Revealing the Ductile-to-Brittle Transition Mechanism in Polycrystalline Body-Centered Tetragonal Tin (Sn) for Cryogenic Electronics.” Journal of Alloys and Compounds 903 (2022): 163948. https://doi.org/10.1016/j.jallcom.2022.163948. 张贺, 冯佳运, 丛森, 王尚, 安荣, 吴朗, 田艳红, and ZHANG He FENG Jiayun. “表面贴装锡基焊点长期贮存可靠性及寿命预测研究.” 电子与封装 22, no. 7 (July 28, 2022): 70201. https://doi.org/10.16257/j.cnki.1681-1070.2022.0712. Liu, Wei, Zhicheng Wen, Jiahui Xu, Xinming Wang, Rong An, Chunqing Wang, Zhen Zheng, Wei Zhang, and Yanhong Tian. “Rapid Fabrication of Cu/40-um Thick Full Cu3Sn/Cu Joints by Applying Pulsed High Frequency Electromagnetic Field for High Power Electronics.” Materials Chemistry and Physics 276 (2022): 125386. https://doi.org/10.1016/j.matchemphys.2021.125386. Ji, Xiaoliang, Wei Zhou, Rong An, Fu Guo, and Chunqing Wang. “Revealing Ductile-to-Brittle Transition Mechanism and Enhancing the Cryogenic Ductility of Tin (Sn) for Cryogenic Electronics.” In 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 1–3. Dalian, China: IEEE, 2022. https://doi.org/10.1109/ICEPT56209.2022.9872702. Ji, Xiaoliang, Qi An, Yiping Xia, Rong An, Rui Zheng, and Chunqing Wang. “Maximum Shear Stress-Controlled Uniaxial Tensile Deformation and Fracture Mechanisms and Constitutive Relations of Sn–Pb Eutectic Alloy at Cryogenic Temperatures.” Materials Science and Engineering: A 819 (2021): 141523. https://doi.org/10.1016/j.msea.2021.141523. An, Qi, Rong An, Chunqing Wang, and Hong Wang. “Ductile-to-Brittle Transition in Fracture Behaviors of Common Solder Alloys over a Temperature Range down to ？150 °C.” Materials Today Communications 29 (2021): 102962. https://doi.org/10.1016/j.mtcomm.2021.102962. Liu, Wei, Zhicheng Wen, Sizhen Chen, Chunqing Wang, Rong An, Wei Zhang, Xinming Wang, Junjie Wang, and Yanhong Tian. “Preparation and Characterization of Self-Assembled ZnO Nanowire Devices: Nanowire Strain Sensor and Homogeneous p–n Junction.” Nanotechnology 32, no. 49 (December 3, 2021): 495604. https://doi.org/10.1088/1361-6528/ac2094. Cong, Sen, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, and Yanhong Tian. “Growth Kinetics of (Cu x Ni 1-x ) 6 Sn 5 Intermetallic Compound at the Interface of Mixed Sn63Pb37/SAC305 BGA Solder Joints during Thermal Aging Test.” Materials Research Express 8, no. 10 (October 1, 2021): 106301. https://doi.org/10.1088/2053-1591/ac3168. Zheng, Zhen, Fan Yang, Wei Liu, Fanyu Meng, Rong An, Wei Zhang, Haibo Wang, Yiping Wang, and Chunqing Wang. “Electrochemical Controlled Synthesis of Au/Ni Nano-Arrays and Its Sintering with Ag NPs Paste.” International Journal of Electrochemical Science 15, no. 8 (2020): 7709–21. https://doi.org/10.20964/2020.08.80. Liu, Wei, Kai Zhu, Chunqing Wang, Zhen Zheng, Rong An, Wei Zhang, Minxi Zhu, et al. “Laser Induced Forward Transfer of Brittle Cu3Sn Thin Film.” Journal of Manufacturing Processes 60 (2020): 48–53. https://doi.org/10.1016/j.jmapro.2020.10.003. Ji, Xiaoliang, Rong An, Fei Ma, Jiawei Hu, and Chunqing Wang. “Unique Buoyancy-Force-Based Kinetics Determination of Beta to Alpha Phase Transformation in Bulk Tin Plates.” Materials & Design 190 (2020): 108550. https://doi.org/10.1016/j.matdes.2020.108550. Wang, Te, Chenxi Wang, Hui Fang, Qiushi Kang, Rong An, and Yanhong Tian. “Pressureless Low-Temperature Sintering of Silver Nano-Solder Paste Based on Surface Activation.” In 2019 20th International Conference on Electronic Packaging Technology(ICEPT), 1–3. Hong Kong, China: IEEE, 2019. https://doi.org/10.1109/ICEPT47577.2019.245126. Liu, Wei, Yiping Wang, Zhen Zheng, Chunqing Wang, Rong An, Yanhong Tian, Lingchao Kong, and Ronglin Xu. “Laser Sintering Mechanism and Shear Performance of Cu–Ag–Cu Joints with Mixed Bimodal Size Ag Nanoparticles.” Journal of Materials Science: Materials in Electronics 30, no. 8 (2019): 7787–93. https://doi.org/10.1007/s10854-019-01094-6. Kang, Qiushi, Chenxi Wang, Shicheng Zhou, Jikai Xu, Rong An, and Yanhong Tian. “Fabrication of SiC-on-Insulator Substrate via a Low-Temperature Plasma Activated Bonding Process.” In 2019 20th International Conference on Electronic Packaging Technology(ICEPT), 1–4. Hong Kong, China: IEEE, 2019. https://doi.org/10.1109/ICEPT47577.2019.245118. Wu, Lang, Weiwei Zhang, Rong An, Sen Cong, and Yanhong Tian. “Solid-sate intermetallic growth and mechanical behavior of Sn36Pb2Ag LGA joints under thermal aging.” In 2019 20th International Conference on Electronic Packaging Technology(ICEPT). Hong Kong, China: IEEE, 2019. Zhong, Ying, Rong An, Huiwen Ma, and Chunqing Wang. “Low-Temperature-Solderable Intermetallic Nanoparticles for 3D Printable Flexible Electronics.” Acta Materialia 162 (2019): 163–75. https://doi.org/10.1016/j.actamat.2018.09.069. Liu, Wei, Rong An, Chunqing Wang, Zhen Zheng, Yanhong Tian, Ronglin Xu, and Zhongtao Wang. “Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications.” Micromachines 9, no. 7 (July 10, 2018): 346. https://doi.org/10.3390/mi9070346. Cai, Chongyang, Rong An, Chunqing Wang, Yanhong Tian, and Xiaoliang Ji. “Robust Tuning of Kirkendall Void Density in Circuit Interconnections through Substrate Strain Annealing.” Journal of Materials Science: Materials in Electronics 29, no. 10 (2018): 8287–92. https://doi.org/10.1007/s10854-018-8837-2. Ji, Xiaoliang, Rong An, Chunqing Wang, and Chongyang Cai. “Solid-State Spalling of Ag3Sn in an Eutectic SnPb Solder Joint with an Ag Thin Film/Ge Cell.” Journal of Electronic Materials 47, no. 9 (2018): 5625–31. https://doi.org/10.1007/s11664-018-6432-1. Ying Zhong, Rong An, Chunqing Wang, Zhen Zheng, Zhi-Quan Liu, Chin-Hung Liu, Cai-Fu Li, Tae Kyoung Kim, Sungho Jin. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections. Small (IF=8.368), 11(33), 4097-4103, 2015. Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing. Materials Lettes (IF=2.489). 158, 252-254, 2015. Jiandong Zhu, Rong An, Chunqing Wang, Wei Liu. Synthesis of CrO single crystal slices by firing under water vapor atmosphere. Materials Lettes (IF=2.489). 2015, 152:13-16. Jiandong Zhu, Rong An, Chunqing Wang, Wei Zhang, Guangwu Wen. Characterization of the Microstructure of an AlN-Mullite-Al2O3 Ceramic Layer on WCu Composite Alloy for Microelectronic Application. Journal of Electronic Materials (IF=1.798), 44(11), 4154-4160, 2015 Rong An, Yanhong Tian, Rui Zhang, Chunqing Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics (IF=1.569). 2015, 26(5):2674-2681. Wei Liu, Rong An*, Ying Ding, Chun-Qing Wang, Yan-Hong Tian, Kun Shen. Microstructure and property of AgCu/2wt% Ag added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Metals (IF=1.009). DOI 10.1007/s12598-015-0545-y, 2015. In Press Hailong Li, Rong An*, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. Journal of Alloys and Compounds (IF=2.99). 2015, 634:94-98. Hailong Li, Rong An*, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters (IF=2.489). 2015, 144:97-99. Jiandong Zhu, Rong An, Chunqing Wang, Guangwu Wen. Fabrication of Al2O3-Mullite-AlN Multiphase Ceramic Layer on W-Cu Substrates for Power Semiconductor Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology (IF=1.18). 2015, 5(2):182-187. Wei Liu, Rong An, Chunqing Wang and Yanhong Tian. Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints. Soldering & Surface Mount Technology (IF=0.872), 2015, 27(1):45-51. Rong An, Yanhong Tian, Lingchao Kong, Chunqing Wang, Shuai Chang. Laser-ignited Self-propagating Behavior of Self-supporting Nano-scaled Ti/Al Multilayer Films. Acta Metallurgica Sinica -Chinese Edition (IF=0.54), 2014, 50(8):97-943. Jiandong Zhu, Rong An, Chunqing Wang, Yanhong Tian,Guangwu Wen. A novel Method to Fabricate AlN-Al2O3 Multiphase Ceramic Layer on WCu Alloy. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Huiwen Ma, Hailong Li, Zhen Zheng, Chunqing Wang. Formation of single phase Cu-Sn IMCs via layer-by- layer electroplating of Cu and Sn metals. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Yanhong Tian, Chunqing Wang. Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Di Xu, Chunqing Wang. Parallel-gap resistance welding between gold-plated silver interconnects and silver electrodes in germanium solar cells. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014. Rong An, Wei Liu, Chunqing Wang, Yanhong Tian. Analytical bond-order potential for Sn. Acta Physica Sinica -Chinese Edition (IF=0.813), 2013; 62(12). Mei Zhu, Rong An*, Chunqing Wang, Xingyao Fu. Laser-induced Self-propagating Reaction in Ti/a-Si Multilayer Films. 2013 14th International Conference on Electronic Packaging Technology (EI); 08/2013. Hailong Li, Rong An*, Mingliang Fu, Chunqing Wang, Mei Zhu, Rui Zhang. Effect of High Temperature Thermal Aging on Microstructural Evolution of Sn3Ag0.5Cu/Cu Solder Joints. 2013 14th International Conference on Electronic Packaging Technology (EI); 08/2013. 安荣、杭春进、刘威、张威、田艳红、王春青、电子封装与组装焊点钎料合金力学行为研究进展, 电子工艺技术, 第34卷, 第2期, 65-69页, 2013 杭春进、安荣、飞景明、王宏、孙毅、王春青、大功率LED照明模块及高效散热结构优化设计, 焊接, 第2期, 20-24页, 2013 杭春进、安荣、王宏、飞景明、王春青、郑振、铝制散热器翅片钎焊工艺研究, 焊接, 第1期, 27-29页，2013 Yanhong Tian, Wei Liu, Rong An, Wei Zhang, Lina Niu, Chunqing Wang. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test, Journal of Materials Science (IF=2.371), 23(10):136-147, 2012. Bin Li, Chunqing Wang, Wei Liu, Ying Zhong, Rong An. Synthesis of Co-doped barium strontium titanate nanofibers by sol–gel/electrospinning process. Materials Letters (IF=2.489). 2012. Hailong Li, Chunqing Wang, Meng Yang, Ningning Wang, Rong An*, Yanjun Xu, The effect of Voids on Thermal Conductivity of Solder Joints, 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012. Yarong Chen, Meng Yang, Binbin Zhang, Rong An. Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012. Ningning Wang, Binbin Zhang, Rong An, Meng Yang. Research of reflow soldering on Al-SiC composite material and thick film ceramic substrates. 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012. 安荣、杨猛、王宁宁、王春青、安茂忠、再流焊接头气孔对散热的影响, 电子工艺技术, 第33卷, 第3期, 127-131页, 2012 Wei Liu, Rong An, Chunqing Wang, Yanhong Tian, Lei Yang, Lining Sun. Evolution of AuSnx intermetallic compounds in laser reflowed micro-solder joints, China Welding (EI), 20(1):1-5, 2011. 安荣, 刘威, 杭春进, 田艳红, 王春青, 安茂忠. 电子封装与组装焊点界面反应及微观组织研究进展, 电子工艺技术, 第32卷, 第6期, 321-329页, 2011. Rong An, Chunqing Wang, Yanhong Tian. Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (EI); 08/2009. Rong An, Chunqing Wang, Yanhong Tian. Determination of the elastic properties of Au5Sn and AuSn from Ab initio calculations, Journal of Electronic Materials (IF=1.798). Vol. 37, No. 7, 2008: 968- 974. Rong An, Chunqing Wang, Yanhong Tian, Huaping Wu. Determination of the elastic properties of Cu3Sn through first-principles calculations, Journal of Electronic Materials (IF=1.798). Vol. 37, No. 4, 2008: 477- 482. Mingyu Li，Rong An，Chunqing Wang，Self excite reflowing and interfacial reaction of SnPb eutectic solder on BGA pad under alternate electromagnetic radiation. Acta Metallurgica Sinica (IF=0.54). 2004. 40(10):1093-1098. Rong An, Chunqing Wang, Yanhong Tian. First-Principles Study on the Elastic Anisotropy of Au5Sn and AuSn, 9th International Conference on Electronics Packaging Technology (EI), Shanghai, 2008. Rong An, Chunqing Wang and Yanhong Tian. Elastic property of Cu3Sn determined by a first-principles calculation on the basis of its crystal substructure, 8th International Conference on Electronics Packaging Technology (ICEPT2007) (EI), August 26-29, 2007. (SCI; EI) Best paper award. Rong An, Mingyu Li, Chunqing Wang, A New Solder Bumping Technology with Local Induction Heating, 8th International Conference on Electronics Packaging Technology (ICEPT2005), Aug. 30-Sep. 2, 2005. (EI) Best paper award Rong An, Chunqing Wang and Yanhong Tian. Investigation of Tin Atomic Migration of Tin-based Solders with Cluster Model and DV-Xa Method in Electromigration, 7th International Conference on Electronics Packaging Technology (ICEPT2006), Aug. 26 - 29, 2006. (SCI, EI) Rong An, Mingyu Li, Chunqing Wang. A Novel Reflow Method for Electronic Area Array Packaging, 1st International EcoDesign Electronics Symposium, Shanghai, 2004:117-121.