Yang, Ronggui - University of Colorado Boulder - Department of Mechanical Engineering

个人简介

Massachusetts Institute of Technology (MIT), GPA:5.0/5.0, Feb. 2006 Ph.D. in Mechanical Engineering (Heat Transfer), Minor: Solid State Electronics Dissertation: Nanoscale Heat Conduction with Applications in Nanoelectronics and Thermoelectrics. Dissertation Advisor: Professor Gang Chen Committee: Gang Chen, Mildred S. Dresselhaus, John H. Lienhard, Borivoje B. Mikic •University of California, Los Angeles (UCLA), GPA: 3.85/4.0, June 2001 M.S. in Mechanical Engineering (Micro-Electro-Mechanical Systems) •Tsinghua University, Beijing, China, GPA:85/100, July 1999 M.S. in Engineering Thermophysics •Xi’an Jiaotong University, Xi’an, China, GPA: 85/100, July 1996 B.S. in Thermal Engineering

研究领域

Micro/Nanoscale and Ulrafast Energy Transport, Nanotechnology for Energy Conversion

近期论文

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Rongfu Wen, Qian Li, Jiafeng Wu, Gengsheng Wu, Wei Wang, Miao Tian, Yunfei Chen, Xuehu Ma, and Ronggui Yang,Hydrophobic copper nanowires for enhancingcondensation heat transfer, Nano Energy, in Press. Zhenqian Pang, Xiaokun Gu, Yujie Wei, Ronggui Yang, Mildred S. Dresselhaus, Stable carbon honeycomb with high specific strength and thermal conductivity, Nano Letters, published online Bo Sun, Xiaokun Gu, Qingsheng Zeng, Xi Huang, Yuexiang Yan, Zheng Liu, Ronggui Yang, and Yee Kan Koh, Temperature dependence of anisotropic thermal conductivity tensor of bulk black phosphorus, Advanced Materials, published online