周鹏 - 哈尔滨工业大学

个人简介

教育经历 2002年-2007年，美国弗吉尼亚大学，工程物理学科，博士 2000年-2002年，清华大学，材料科学与工程系，硕士 1995年-2000年，清华大学，材料科学与工程系，本科工作经历 2011年-现今哈尔滨工业大学，航天学院航天科学和力学系，副教授 2010年-2011年美国加州大学埃尔文分校，数学系，专业研究人员（副） 2007年-2010年美国加州大学埃尔文分校，数学系，访问助理教授

研究领域

计算力学和材料学，外场影响下的扩散相变，主要的研究方向如下：电迁移，热迁移和弹性应力应变影响下，集成电路导线和焊接点界面上的中间相生长，空穴生长等失效问题征对电迁移，热迁移和外场下扩散的机制分析和数值模拟弹性应力应变，界面各项异性能以及表面沉积对于薄膜形貌，粗化机制和粗化规律的影响

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Hao Ren, Peng Zhou, Chunming Zhou, "Finite Element Simulations of Flip Chip Solder Bumps with Fractures Present using FreeFem++", 2022 23th International Conference on Electronic Packaging Technology (ICEPT). Peng Zhou, "Coupling efiects between elastic and electromagnetic flelds from the perspective of conservation of energy", Applied Mathematics and Mechanics (English Edition) (2021), https://doi.org/10.1007/s10483-021-2792-9 . Chunming Zhou, Peng Zhou, Yuehua Hu, Hao Zhang, "Investigation of the Influences of Thermal stresses and Joule Heating within a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling"，2021 22th International Conference on Electronic Packaging Technology (ICEPT). Guomin Ma, Peng Zhou, Hao Zhang, Jinxin Qian, Yubao Zhen, "Simulation of a Piezoelectric MEMS Accelerometer using Finite Element Modeling with Freefem++"，2020 21th International Conference on Electronic Packaging Technology (ICEPT). Jinxin Qian, Peng Zhou, Hao Zhang, Yubao Zhen, Yuan Gao, "3D Finite Element Modeling of Flip Chip Solder Bumps and Cu-Pillar Bumps with Thermal Stresses and Joule Heating present", 2019 20th International Conference on Electronic Packaging Technology (ICEPT). Hao Zhang, Peng Zhou, Jinxin Qian, Guoming Ma, Yubao Zhen, Yuehua Hu, "3D simulations of a Piezoresistive MEMS Pressure Sensor using the Finite Element Modeling", 2019 20th International Conference on Electronic Packaging Technology (ICEPT). Peng Zhou, Qibiao Zeng, Yuan Gao and Yubao Zhen, "Investigation of the Elastic Properties of Through-silicon Vias using a Finite Element Model with Thermal Stresses and Joule Heating Present", 2018 19th International Conference on Electronic Packaging Technology (ICEPT). Peng Zhou, Baojie Zhao, Yubao Zhen, Shuo Liu and Yuehua Hu, Jiayu Li, “Finite-element calculations of elastic fields within flip-chip solder bumps and Cu-pillar bumps under the influences of thermal stresses and joule heating”, 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 569-574 Peng Zhou and Jie Wang, Modeling of the coalescence of micro-voids under the influence of elastic stresses and electromigration, Proceedings of the Electronic Packaging Technology Conference, EPTC, p 1047-1051, October 13, 2014 Peng Zhou，The Influence of a Field-dependent Total Effective Charge Number on the Interfacial Migration Rate and the Phase Growth Behavior During Intermediate Phase Growth with Electromigration present, Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p 448-452, 2013. Peng Zhou, The stressing effect of electromigration from the Maxwell Stress and a preliminary mean time to failure analysis. Journal of Electronic Materials, Vol. 42, 956-962, No. 6, 2013. Featured online by Advances in Engineering Peng Zhou, Steven Wise, Xiangrong Li, and John Lowengrub*，Coarsening of elastically stressed, strongly anisotropic driven thin films，Phys. Rev. E 85, 061605 (2012) Peng Zhou* and William C. Johnson, “A Diffuse Interface Model of Intermediate Phase Growth under the Influence of Electromigration”, Journal of Electronic Materials, Vol. 40, 1867-1875, No. 9, 2011. Peng Zhou*,William C. Johnson, and Perry H. Leo, “A Sharp Interface Model of Intermediate Phase Growth under the Influence of Electromigration”, Journal of Electronic Materials, Vol. 40, 1876-1883, No. 9, 2011. Peng Zhou* and William C. Johnson, “Discussion of the Mechanism of Electromigration from the Perspective of Electromagnetism”, Journal of Electronic Materials, Vol. 39, 2583-2587, No. 12, 2010. William C. Johnson*, Peng Zhou, A. M. Lucente and J. R. Scully, “Composition Profiles around Solute-Lean, Spherical Nanocrystalline Precipitates in an Amorphous Matrix: Implications for Corrosion Resistance”, Metallurgical and Materials Transactions A, Volume 40, Number 4, April, 2009. Peng Zhou, Steven M. Wise and John Lowengrub, Coarsening of 3D Thin Films under the Influence of Strong Surface Anisotropy, Elastic stresses, TMS 2009 (138th annual meeting), Supplemental Proceedings: Materials Characterization, Computation and Modeling (2009) 39-46.