刘威 - 哈尔滨工业大学 - 材料科学与工程学院

个人简介

刘威，教授，博导；哈尔滨工业大学材料学院焊接系副主任。主持国家自然科学基金项目3项；承担国家自然科学基金重点项目、国家重点研发计划、工业转型升级资金项目等纵向项目，主持横向课题十余项；组织电子封装技术专业申请并获批省一流专业建设点。主持省教改项目1项，校教改项目2项，参与省教改项目1项，校教改项目1项。获省教学成果二等奖(2020)、(2013)；获哈工大教学成果一等奖两次；获“IPC亚洲人才发展奖”(2021)。编写教材2部，入选“双一流”建设精品出版工程、“十三五”国家重点出版物出版规划项目、教指委规划教材。撰写国家标准2项。工作经历 2008-目前材料科学与工程学院焊接系电子封装技术专业先后担任讲师、副教授、教授 2013-目前材料科学与工程学院焊接系副主任 2009-2012 哈尔滨工业大学机械工程博士后流动站博士后 2013-2014 英国 Hriot-Watt University 工程与物理科学学院访问学者教育经历 1998年-2002年，就读于哈尔滨工业大学，材料成型及控制工程专业，本科 2002年-2008年，就读于哈尔滨工业大学，材料加工工程专业，硕士，博士主要任职 2013-目前任材料学院焊接系副主任 2009-2013 任先进焊接与连接国家重点实验室涉外主任秘书《Current Mechanics And Advanced Materials》国际期刊编委国际电子工业联接协会(IPC)，IPC认证专家(CIT) 国际电子工业联接协会(IPC)，IPC亚洲会员社区特聘专家第三代半导体产业技术创新战略联盟(CASA)人才发展委员会，委员

研究领域

先进微互连技术及方法研究 MEMS、三维封装及组装结构及封装方法激光、电磁耦合快速键合方法第三代半导体功率器件键合材料及工艺微焊点结构优化及可靠性分析主要研究方向：激光快速微互连技术及微结构制造技术；微互连焊点结构设计、微观组织控制及研究；面向苛刻应用条件下封装结构的键合技术研究

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Guo L, Liu W, Wang C. Twistable and tailorable Cu-doped SnO2@ PANI textile for wearable ammonia sensing[J]. Applied Surface Science, 2023, 630: 157529. Wang J, Liu W, Wang C. High‐Performance Black Phosphorus Field‐Effect Transistors with Controllable Channel Orientation[J]. Advanced Electronic Materials, 2023, 9(3): 2201126. Guo L, Liu W, Wang C. Nanoscale Ag-Decorated Hollow Porous CuO/SnO2 Heterojunctions for Isopropanol Detection[J]. ACS Applied Nano Materials, 2023, 6(9): 7830-7840. Gao H, Liu W, An R, et al. In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints[J]. Journal of Materials Research and Technology, 2023, 26: 3506-3523. Gao H, Liu W, An R, et al. Effect of nano-intermetallic compound on creep properties and β-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints[J]. Materials Today Communications, 2023, 36: 106874. Gao H, Liu W, An R, et al. Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints[J]. Journal of Materials Science: Materials in Electronics, 2023, 34(28): 1-13. Gao H, Liu W, Wang C. Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point[J]. Journal of Materials Science: Materials in Electronics, 2023, 34(12): 1009. Zhao X, Zhang W, Wang C, An R, Liu W. Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5 Ag Solder[J]. Journal of Electronic Materials, 2023, 52(1): 471-476. Wu Z, Liu W, Feng J, et al. Novel Cu@ Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics[J]. ACS omega, 2023, 8(34): 31021-31029. An R, Zhang X, Shen J, Jiang W, Wang X, Zhang W, Liu W. Physics-of-degradation-based life prediction of solder interconnects of long-life solar arrays in low-earth orbit[J]. Solar Energy, 2022, 248: 196-209. Liu W, Wen Z, Xu J, et al. Rapid fabrication of Cu/40-μm thick full Cu3Sn/Cu joints by applying pulsed high frequency electromagnetic field for high power electronics[J]. Materials Chemistry and Physics, 2022, 276: 125386. Wang J, Liu W, Wang C. Superior rate and long-lived performance of few-layered black phosphorus-based hybrid anode for lithium-ion batteries[J]. Electrochimica Acta, 2022, 403: 139697. Guo L, Liu W, Ji X, et al. Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging[J]. ACS Applied Electronic Materials, 2022, 4(7): 3457-3469. 吴卓寰, 刘威, 温志成, 等. 微米铜银复合结构与纳米银混合连接材料制备与高频感应快速烧结方法研究[J]. 机械工程学报, 2022, 58(2): 26-33. Wang J, Liu W, Wang C. An amorphous TiOx-coated black phosphorus composite with enhanced cycling performance as an anode for lithium-ion batteries[J]. Journal of Alloys and Compounds, 2022, 921: 166220. Guo L, Liu W, Ji X, et al. Facile synthesis of Cu10Sn3 nanoparticles and their sintering behavior for power device packaging[J]. Results in Materials, 2021, 10: 100187. Guo L, Liu W, Wang C. Preparation and sintering properties of Cu10Sn3 IMCs nanopaste as die attach material for high temperature power electronics[J]. Materials Letters, 2021, 282: 128845. Liu W, Wen Z, Chen S, et al. Preparation and characterization of self-assembled ZnO nanowire devices: nanowire strain sensor and homogeneous p–n junction[J]. Nanotechnology, 2021, 32(49): 495604. Wang Z, Wang X, Liu W, et al. Ohmic contact formation mechanisms of TiN film on 4H–SiC[J]. Ceramics International, 2020, 46(6): 7142-7148. Liu W, Zhu K, Wang C, et al. Laser induced forward transfer of brittle Cu3Sn thin film[J]. Journal of Manufacturing Processes, 2020, 60: 48-53. Zheng Z, Yang F, Liu W, et al. Electrochemical Controlled Synthesis of Au/Ni Nano-arrays and its Sintering with Ag NPs Paste[J]. Int. J. Electrochem. Sci, 2020, 15: 7709-7721. Wang Z, Liu W, Wu Y, et al. A novel cobalt-free CO2-stable perovskite-type oxygen permeable membrane[J]. Journal of Membrane Science, 2019, 573: 504-510. Liu W, Wang Y, Zheng Z, et al. Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles[J]. Journal of Materials Science: Materials in Electronics, 2019, 30: 7787-7793. Liu W, An R, Wang C, et al. Recent progress in rapid sintering of nanosilver for electronics applications[J]. Micromachines, 2018, 9(7): 346. 刘威, 费义鹍, 郑振, 等. 激光前向转移技术及其温度场数值模拟研究[J]. 精密成形工程, 2018, 10(1): 52-56. Liu W, Wang C, Wang C, et al. Laser sintering of nano-Ag particle paste for high-temperature electronics assembly[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(7): 1050-1057. Liu X, Zheng Z, Wang C, Liu Wei, An Rong, Zhang Wei. Fusion behaviour and mechanism of ultrafine Ag-Cu nanoparticles induced by electron beam irradiation[J]. Journal of Materials Science: Materials in Electronics, 2017, 28: 8206-8210. Liu X, Wang C, Liu W, et al. Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging[J]. Journal of Materials Science: Materials in Electronics, 2017, 28: 5446-5451. Liu W, Wang Y, Wang C, et al. Copper-tin reaction and preparation of microsolder joints under high frequency alternating magnetic field[C]//2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017: 1592-1594. Liu W, Nie Y, Wang C, et al. Effect of multilayer films and current on IMC formation in solder joints[C]//2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017: 1561-1563. Li Y, Hang C, Tian Y, Liu W, et al. Interposer connection reliability using double-side solder bump for board-level vertical interconnection[C]//2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017: 501-504. Jia Y, Hang C, Tian Y, Liu W, et al. Reliability prediction of different size solder bumps in thermal shock test using FEM[C]//2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017: 580-583. Liu W, Xu R, Wang C, et al. Study on preparation and rapid laser sintering process of nano silver pastes[C]//2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017: 1525-1528. Liu X, Liu W, Wang C, et al. Optimization and modeling for one-step synthesis process of Ag–Cu nano-particles using DOE methodology[J]. Journal of Materials Science: Materials in Electronics, 2016, 27: 4265-4274. Liu W, Wang C, Dou G, et al. Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface[J]. Applied Physics Express, 2016, 10(1): 017202. Liu X, Zheng Z, Wang C, Liu W, et al. Effects of temperature and dispersants on the phases and morphology of Ag–Cu nanoparticles[J]. Journal of Materials Science: Materials in Electronics, 2016, 27: 10065-10069. Liu X, Liu W, Wang C, et al. Preparation and sintering properties of Ag27Cu2Sn nanopaste as die attach material[J]. Journal of Electronic Materials, 2016, 45: 5436-5442. Liu B, Tian Y, Liu W, et al. TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows[J]. Materials Letters, 2016, 163: 254-257. Zhong Y, Liu W, Wang C, et al. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling[J]. Materials Science and Engineering: A, 2016, 652: 264-270. Wang Z, Liu W, Wang C. Recent progress in ohmic contacts to silicon carbide for high-temperature applications[J]. Journal of Electronic Materials, 2016, 45: 267-284. Liu X, Wang C, Zheng Z, Liu W, et al. Synthesis and Characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials[C]//2016 17th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2016: 206-208. Zhu J, An R, Wang C, Liu W. Synthesis of CrO single crystal slices by firing under water vapor atmosphere[J]. Materials Letters, 2015, 152: 13-16. Jiang X, Wang C, Liu W. A laser-assisted bonding method using a liquid crystal polymer film for MEMS and sensor packaging[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5(5): 583-591. Liu W, An R, Wang C, et al. Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints[J]. Soldering & Surface Mount Technology, 2015, 27(1): 45-51. Zeng C, Wang C, Tian Y, Liu W, et al. Fracture Statistics Dominated by Hot-Cutting Defect and Deviation from Weibull Distribution[J]. Journal of Harbin Institute of Technology, 2015, 22(2): 41-48. 安荣, 刘威, 王春青, 等. Sn 的分析型键级势[J]. 物理学报, 2013, 62(12): 128101. 刘威, 窦广彬, 王春青, 等. 高斯分布激光散焦距离对激光转印 Cu 薄膜形貌影响及机理分析[J]. Chinese Journal of Lasers, 2013, 40(5): 507001--1. 安荣, 杭春进, 刘威, 等. 电子封装与组装焊点钎料合金力学行为研究进展[J]. 电子工艺技术, 2013 (2): 65-69. 刘威, 王春青, 田艳红, 等. 激光诱发前向转移技术在电子制造领域的应用[J]. 电子工艺技术, 2013 (2): 70-72. 刘威, 窦广彬, 王春青, 等. 高斯分布激光前向转印 Cu 薄膜形貌及机理[J]. Chinese Journal of Lasers, 2013, 40(3): 307002--1. 刘威. 全 IMC 微互连焊点界面反应机理及微观力学行为研究[J]. 机械制造文摘: 焊接分册, 2013 (1): 17-18. Liu W, Tian Y, Wang C, et al. Formation of AuSn x IMCs in Sn3. 5Ag0. 75Cu micro-solder joints fabricated by laser and hot air reflow processes[J]. Journal of Materials Science: Materials in Electronics, 2013, 24: 217-223. Li B, Wang C, Liu W, et al. Multiferroic properties of La and Mn co-doped BiFeO3 nanofibers by sol–gel and electrospinning technique[J]. Materials Letters, 2013, 90: 45-48. Yang L, Wang C, Liu W. Precision Study for Surface Tension Driven Self-assembly of Hingeless Structures[J]. Journal of Applied Sciences, 2013, 13(14): 2807-2812. Yang L, Wang C, Liu W, et al. Dynamic model for analyzing the motion of molten solder during self-assembly[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 649-652. Yang L, Liu W, Wang C, et al. Surface-tension-driven self-assembly of 3-D microcomponents by using laser reflow soldering and wire limiting mechanisms[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 3(1): 168-176. Tian Y, Liu W, An R, et al. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test[J]. Journal of Materials Science: Materials in Electronics, 2012, 23: 136-147. Liu W, Tian Y, Wang C, et al. Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3. 0Ag0. 5Cu/Cu solder joints[J]. Materials Letters, 2012, 86: 157-160. Liu W, Tian Y, Yang L, et al. Oxidation and Au‐Sn reaction of laser reflowed micro‐solder joints protected by N2 or exposed to air atmosphere[J]. Soldering & surface mount technology, 2012, 24(3): 191-196. Li B, Wang C, Liu W, et al. Synthesis of Co-doped barium strontium titanate nanofibers by sol–gel/electrospinning process[J]. Materials Letters, 2012, 75: 207-210. Yang L, Liu W, Wang C, et al. Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints during Isothermal Aging Process[C]//2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006: 1-4. Yang L, Liu W, Wang C, et al. Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices[C]//2011 12th International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, 2011: 1-4. Yang L, Liu W, Wang C, et al. Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering[C]//2011 12th International Conference on Electronic Packaging Technology and High Density Packaging. IEEE, 2011: 1-4. 安荣, 刘威, 杭春进, 等. 电子封装与组装焊点界面反应及微观组织研究进展[J]. 电子工艺技术, 2011, 32(6): 321-325. Liu W, Wang C, Sun L, et al. Effect of protection atmosphere's temperature on morphology of au-sn imcs in laser reflowed micro-solder joints[C]//2010 11th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2010: 442-445. Yang L, Wang C, Liu W, et al. Study of MEMS self-assembly using molten solder ball[C]//2010 11th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2010: 1302-1307. Liu W, Wang C, Sun L, et al. Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils[C]//2009 International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2009: 642-645. Liu W, Wang C, Tian Y, et al. Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils[J]. Transactions of Nonferrous Metals Society of China, 2008, 18(3): 617-622.