丁朝刚 - 哈尔滨工业大学 - 材料科学与工程学院

个人简介

丁朝刚，男，中共党员，1990年生，山东聊城人，工学博士，助理研究员。主要从事纳米结构金属材料制备与性能调控、能场辅助微纳成形理论与工艺方面的研究。工作经历 2022.03 至今哈尔滨工业大学，能源学院，博士后 2022.04 至今哈尔滨工业大学，材料学院，助理研究员教育经历 2011.09—2015.07 哈尔滨工业大学，材料学院，材料成型及控制工程，学士 2015.09—2022.01 哈尔滨工业大学，材料学院，材料科学与工程，博士，导师：郭斌、徐杰教授

研究领域

纳米结构金属材料制备与性能调控微型构件能场辅助微成形机理与形性协同调控

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Chaogang Ding, Jie Xu*, Debin Shan, Bin Guo*, Terence G. Langdon. Sustainable fabrication of Cu/Nb composites with continuous laminated structure to achieve ultrahigh strength and excellent electrical conductivity[J]. Composites Part B: Engineering, 2021, 211: 108662. Chaogang Ding, Jie Xu*, Debin Shan, Bin Guo, Terence G. Langdon. The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites[J]. Journal of Materials Science & Technology, 2023, 157: 163-173. Chaogang Ding, Jie Xu*, Xuewen Li, Debin Shan, Bin Guo, Terence G. Langdon. Microstructural evolution and mechanical behavior of Cu/Nb multilayer composites processed by accumulative roll bonding[J]. Advanced Engineering Materials, 2020, 22(1): 1900702. Chaogang Ding, Jie Xu*, Debin Shan, Bin Guo, Terence G. Langdon, Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites[J], Heliyon, 2023, 9: e16231. Chaogang Ding, Wanji Chen, Shima Sabbaghianrad, Jie Xu*, Debin Shan, Bin Guo, Terence G. Langdon. In situ TEM observations of thickness effect on grain growth in pure titanium thin films[J]. Materials Characterization, 2021, 173: 110929. 丁朝刚，徐杰，单德彬，郭斌. 纳米多层金属复合材料研究进展[J]. 中国材料进展, 2022, 41(10): 808-818. Jianwei Li, Chaogang Ding*, Wanji Chen, Debin Shan, Bin Guo, Jie Xu*. Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper[J]. Materials & Design, 2023, 229: 111873. Wanji Chen, Jie Xu*, Chaogang Ding*, Debin Shan, Bin Guo, Terence G. Langdon. Fracture mechanism of electrically-assisted micro-tension in nanostructured titanium using synchrotron radiation X-ray tomography[J]. Scripta Materialia, 2023, 222: 114997. Zhiqin Yang, Jianxing Bao, Chaogang Ding*, Sujung Son, Zhiliang Ning, Jie Xu*, Debin Shan, Bin Guo, Hyoung Seop Kim*. Electroplasticity in the Al0. 6CoCrFeNiMn high entropy alloy subjected to electrically-assisted uniaxial tension[J]. Journal of Materials Science & Technology, 2023, 148: 209-221. Peng Zhang*, Chao Hu, Chaogang Ding, Qiang Zhu, Heyong Qin. Plastic deformation behavior and processing maps of a Ni-based superalloy[J]. Materials & Design, 2015, 65, 575-584. Peng Zhang*, Chao Hu, Qiang Zhu, Chaogang Ding, Heyong Qin. Hot compression deformation and constitutive modeling of GH4698 alloy[J]. Materials & Design, 2015, 65, 1153-1160. 徐杰，包建兴，丁朝刚，单德彬，郭斌. 电流辅助微成形技术研究进展[J]. 材料科学与工艺, 2022-11-17 Yunhuan Yuan, Senpei Xie, Chaogang Ding, Xianbiao Shi, Jie Xu*, Kang Li, Weiwei Zhao*. Fabricating flexible wafer-size inorganic semiconductor devices[J]. Journal of Materials Chemistry C, 2020, 8: 1915-1922. Yunhuan Yuan, Senpei Xie, Chaogang Ding, Jun Wei, Kewei Li, Xoangpeng Kong, Jie Xu*, Kang Li, Weiwei Zhao*. Fabricating different patterns of flexible inorganic semiconductor films via colloidal ink printing on textiles[J]. Materials Letters, 2021, 8: 1915-1922. Xinakun Lin, Xiaodi Huang, Chenggen Zeng, Wei Wang, Chaogang Ding, Jie Xu, Qiang He*, Bin Guo. Poly (vinyl alcohol) hydrogels integrated with cuprous oxide-tannic acid submicroparticles for enhanced mechanical properties and synergetic antibiofouling[J]. Journal of Colloid and Interface Science, 2019, 535: 491-498.