穆德魁 - 华侨大学 - 机电及自动化学院

个人简介

学习工作经历： 2013毕业于昆士兰大学获材料科学与工程博士学位（2011年3月至2011年4月访问大阪大学研习）；2012年11月-2013年7月在昆士兰大学任博士后研究员；2014年9月至2015年8月江苏科技大学；2015年9月至今华侨大学，2020年晋升教授。曾获QUT Postgraduate Research Award (QUTPRA)、Australian Postgraduate Award (APA) with top-up from Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) and UQ Graduate School International Travel Award (GSITA)、The Best Published Material Award (UQ Postgraduate Engineering Conference 2012)等奖励；2017年入选福建省高层次海外人才（境外B类）；２０１９年福建省优秀硕士论文（指导教师，机械工程领域２名）。主持或参加的科研项目： 1.国家自然科学基金联合基金重点项目: 复杂形状石材制品省材高效加工关键技术基础研究，参与，在研。 2.国家自然科学基金面上项目：活性软钎料低温连接金刚石磨粒关键技术的基础研究，主持，结题。 3.福建省科技厅引导性项目：钎焊金刚石用异质增强低温焊料的开发研究，主持，结题。 4.厦门市科技局产学研协同创新项目：钎焊微粉金刚石砂轮制备工艺，主持，结题。 5.华侨大学中青年教师科技创新资助计划(优秀青年科技创新人才)（2018-2022），主持，在研。

研究领域

1.电子封装领域的界面金属间化合物的晶体结构、生长行为； 2.在金刚石焊接过程中液固、固固界面相变行为以及其对应的润湿、连接机理对金刚石钎焊热损伤机制； 3.脆性材料超精密加工与工具制备。

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

1.Han Huang, Xuliang Li, Dekui Mu, Brian R Lawn, Science and Art of ductile grinding of brittle solids, International Journal of Machine Tools and Manufacturing, 161(2021)103675. （IF8.1，机械工程领域顶刊，邀请综述） 2.Qiqi He, Yubin Zhang, Duan Nian, Hui Huang, Dekui Mu, Xinjiang Liao*, Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by Sn-Ti active solder, Powder Technology, 376 (2020) 643–651. 3.Yueqin Wu, Dekui Mu, Hang Huang, Deformation and removal of semiconductor and laser single crystals at extremely small scales, International Journal of Extreme Manufacturing 2(2020)012006. （EI，邀请综述） 4.Zhuo Liu, Xinjiang Liao, Wei Fu, Dekui Mu*, Xipeng Xu, Han Huang: Microstructures and Bonding Strength of Synthetic Diamond Brazed by Near-Eutectic Ag-Cu-In-Ti Filler Alloy, Materials Science & Engineering A, 790 (2020) 139711. 5.Yubin, Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Jing Lu, Hui Huang, Han Huang: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials 13 (2020) 1532. 6.Xinjiang Liao, Qiqi He, Qiaoli Lin, Dekui Mu*: Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond, Applied Surface Science 504 (2020) 144508. 7.D. Mu*, K.Y. Feng, Q.L. Lin, H. Huang: Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, 45 (2019) 22175–22182. 8.J. Shena , L. Lia, X. Wu , H. Chena, W. Huang, D. Mu: Interfacial characteristics of titanium coated micro-powder diamond abrasive tools fabricated by electroforming-brazing composite process，International Journal of Refractory Metals and Hard Materials, 84 (2019) 104973. 9.X.J. Liao, D. Mu*, W. Fu, H. Huang, H. Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039. 10.M Li, J Chen, Q Lin, Y Wu, D Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440. 11.J. Chen, X. Liao, Q. Lin, D. Mu*, H. Huang, X. Xu. H. Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99. 12.J. Chen, D. Mu*, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60. 13.X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257. 14.D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20, (2016) 55-76. (IF: 9.5, 年均发文量27篇,邀请综述) 15.D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes. Material Science and Engineering A, under revision. 16.D. Mu, H. Huang, S. D. McDonald and K. Nogita: Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 at elevated temperatures. Journal of Electronic Materials, DOI: 10.1007/s11664-012-2227-y. 17.K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012). 18.D. Mu, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012). 19.D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012). 20.D. Mu, Y.F. Yang, J. Read and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011). 21.D. Mu, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, 654, 2450 (2010). 22.D. Mu, Y. Sun and L. Ma: Reliability of multistate repairable standby systems with dependent deteriorations. Proceedings of the Third World Congress on Engineering Asset Management and Intelligent Maintenance System Conference, Beijing, China, p1, (2009).