刘晓英 - 大连理工大学 - 材料科学与工程学院

个人简介

教育经历 2003.92010.4 大连理工大学材料学博士 1999.92003.7 大连理工大学材料学学士 1996.91999.7 山东省烟台市第二中学工作经历 2010.4至今大连理工大学实验技术

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[1]杨喜锐,周大雨,马晓倩,王雪霞,徐进,陈国清,侯晓多,刘晓英,高晓霞.Synthesis of dopant-free tetragonal zirconia nano-powders with aqueous precursor and their optica...[J],Materials Research Expresss,2018,6:15041-15041 [2]Liang, Hailong,Xu, Jin,Wang, Xuexia,Liu, Xiaohua,Chu, Shichao,Liu, Xiaoying,Zhou, Dayu.Structure and electrical properties of pure and yttrium-doped HfO2 films by chemical solution d...[J],MATERIALS & DESIGN,2017,120:376-381 [3]刘晓英,徐佐省,邹龙江,于凤云,季首华.高校实验技术人员的继续教育初探[J],实验室科学,2014,17(6):193-195,198 [4]Huang, M. L.,Zhou, Q.,Zhao, N.,Liu, X. Y.,Zhang, Z. J..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763 [5]Liu, Xiaoying,Huang, Mingliang,Zhao, Ning,Wang, Lai.Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337 [6]刘晓英,赵杰,邹龙江,季首华.材料科学基础实验课多媒体教学及网络教学平台建设[J],中国现代教育装备,2013,19:42-43 [7]Zhao, N.,Liu, X. Y.,Huang, M. L.,Ma, H. T..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931 [8]Liu, Xiaoying,Huang, Mingliang,Zhao, Ning,Wang, Lai.Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging[A],2013,400-402 [9]Liu, Xiaoying,Huang, Mingliang,Zhao, Ning.Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate[A],2013,706-708:138-141 [10]Huang, Mingliang,Yang, Fan,Zhao, Ning,Liu, Xiaoying.Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substra...[A],2013,52(1):753-758 [11]赵宁,黄明亮,马海涛,潘学民,刘晓英.液态Sn-Cu钎料的粘滞性与润湿行为研究[J],物理学报,2013,62(8):86601-86601 [12]Liu, Xiaoying,Huang, Mingliang,Zhao, Ning.Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi sol...[A],2012,422-424 [13]刘晓英,马海涛,罗忠兵,赵艳辉,黄明亮,王来.Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2012,22(4):1169-1176 [14]刘晓英,马海涛,罗忠兵,赵艳辉,黄明亮,王来.刘晓英；马海涛；罗忠兵；赵艳辉；黄明亮；王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,,2012,22(4):1169-1172 [15]Liu, Xiaoying,Huang, Mingliang,Wu, C. M. L.,Wang, Lai.Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2010,21(10):1046-1054 [16]Liu, Xiaoying,Huang, Mingliang,Zhao, Yanhui,Wu, C. M. L.,Wang, Lai.The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu duri...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2010,492(1-2):433-438 [17]黄明亮,刘晓英.Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package[A],2010,1132-1137 [18]Ye, Song,Huang, Mingliang,Chen, Leida,Liu, Xiaoying.Electromigration of 300 mu m Diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package[A],2010,1132-1137 [19]Liu, Xiaoying,Zhao, Yanhui,Huang, Mingliang,Wu, C. M. L.,Wang, Lai.Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate[A],2009,611-+ [20]刘晓英,马海涛,王来.超细氧化物颗粒对Sn-58Bi钎料组织及性能影响[J],大连理工大学学报,2008,48(1):51-57